Al
2
O
3
Thin Films Prepared by a Combined Thermal‐Plasma Atomic Layer Deposition Process at Low Temperature for Encapsulation Applications
2019 ◽
Vol 37
(1)
◽
pp. 010901
◽
Keyword(s):
1997 ◽
Vol 181
(3)
◽
pp. 259-264
◽