Characterization of wet chemical etching for effective backside sample preparation on devices with exposed pads

2014 ◽  
Author(s):  
Andrew C. Sabate ◽  
Rowin V. Galarce
Keyword(s):  
Sample Preparation ◽  
Chemical Etching ◽  
Wet Chemical ◽  
Wet Chemical Etching

Characterization of luminescent silicon carbide nanocrystals prepared by reactive bonding and subsequent wet chemical etching

2011 ◽  
Vol 99 (21) ◽  
pp. 213108 ◽  
Author(s):  
David Beke ◽  
Zsolt Szekrényes ◽  
István Balogh ◽  
Miklós Veres ◽  
Éva Fazakas ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
Chemical Etching ◽  
Wet Chemical ◽  
Wet Chemical Etching

Structural Characterization of Silicon Carbide Etched by Using a Combination of Ion Implantation and Wet Chemical Etching

2000 ◽  
Vol 338-342 ◽  
pp. 481-484 ◽  
Author(s):  
T. Henkel ◽  
Gabriel Ferro ◽  
Shin Ichi Nishizawa ◽  
H. Pressler ◽  
Yasuhito Tanaka ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
Ion Implantation ◽  
Structural Characterization ◽  
Chemical Etching ◽  
Wet Chemical ◽  
Wet Chemical Etching

Characterization of dislocation etch pits in HVPE-grown GaN using different wet chemical etching methods

2010 ◽  
Vol 504 (1) ◽  
pp. 186-191 ◽  
Author(s):  
Lei zhang ◽  
Yongliang Shao ◽  
Yongzhong Wu ◽  
Xiaopeng Hao ◽  
Xiufang Chen ◽  
...  
Keyword(s):  
Chemical Etching ◽  
Etch Pits ◽  
Dislocation Etch ◽  
Wet Chemical ◽  
Wet Chemical Etching

Decapsulation Techniques for Cu Wire Bonding Package

2009 ◽  
Author(s):  
Dongmei Meng ◽  
Joe Rupley ◽  
Chris McMahon
Keyword(s):  
Laser Ablation ◽  
Thin Layer ◽  
Chemical Etching ◽  
Wire Bonding ◽  
Methods And Techniques ◽  
Wet Chemical ◽  
Wet Chemical Etching ◽  
Reliability Issue ◽  
Etch Time ◽  
Device Technology

Abstract This paper presents decapsulation solutions for devices bonded with Cu wire. By removing mold compound to a thin layer using a laser ablation tool, Cu wire bonded packages are decapsulated using wet chemical etching by controlling the etch time and temperature. Further, the paper investigates the possibilities of decapsulating Cu wire bonded devices using full wet chemical etches without the facilitation of laser ablation removing much of mold compound. Additional discussion on reliability concerns when evaluating Cu wirebond devices is addressed here. The lack of understanding of the reliability of Cu wire bonded packages creates a challenge to the FA engineer as they must develop techniques to help understanding the reliability issue associated with Cu wire bonding devices. More research and analysis are ongoing to develop appropriate analysis methods and techniques to support the Cu wire bonding device technology in the lab.

scholarly journals Controlling the Facet of ZnO during Wet Chemical Etching Its (0001) O‐Terminated Surface

Small ◽  
2020 ◽  
Vol 16 (51) ◽  
pp. 2007045
Author(s):  
Mei Sun ◽  
Bocheng Yu ◽  
Mengyu Hong ◽  
Zhiwei Li ◽  
Fengjiao Lyu ◽  
...  
Keyword(s):  
Chemical Etching ◽  
Wet Chemical ◽  
Wet Chemical Etching

scholarly journals In Situ Study of the Wet Chemical Etching of SiO2 and Nanoparticle@SiO2 Core–Shell Nanospheres

2021 ◽  
Author(s):  
Albert Grau-Carbonell ◽  
Sina Sadighikia ◽  
Tom A. J. Welling ◽  
Relinde J. A. van Dijk-Moes ◽  
Ramakrishna Kotni ◽  
...  
Keyword(s):  
Chemical Etching ◽  
Core Shell ◽  
In Situ Study ◽  
Wet Chemical ◽  
Wet Chemical Etching
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