Reliability tests on micro-insert die bonding technology

2012 ◽  
Author(s):  
Antoine Nowodzinski ◽  
Herve Boutry ◽  
Remy Franiatte ◽  
Vincent Mandrillon ◽  
Romain Anciant ◽  
...  
Keyword(s):  
Bonding Technology ◽  
Die Bonding

High- Accuracy Die-Bonding Technology for LED Array

1985 ◽  
Vol 8 (4) ◽  
pp. 500-504
Author(s):  
H. Tanabe ◽  
I. Shibata ◽  
K. Nihei ◽  
K. Miyaki
Keyword(s):  
High Accuracy ◽  
Led Array ◽  
Bonding Technology ◽  
Die Bonding

Study and optimization of die-bonding technology for semiconductor lasers based on differential-analysis

Optik ◽  
2021 ◽  
Vol 235 ◽  
pp. 166632
Author(s):  
Peidong Xu ◽  
Bin Wang ◽  
Yong Wang ◽  
Xiantao Wang
Keyword(s):  
Semiconductor Lasers ◽  
Differential Analysis ◽  
Bonding Technology ◽  
Die Bonding

Analysis of Two Electrical Failures Caused by Die Attach of Exposed Pad Package

2014 ◽  
Author(s):  
Jinglong Li ◽  
Motohiko Masuda ◽  
Yi Che ◽  
Miao Wu
Keyword(s):  
Bonding Process ◽  
Die Attach ◽  
Die Bonding ◽  
Generic Analysis

Abstract Die attach is well known in die bonding process. Its electrical character is simple. But some failures caused by die attach are not so simple. And it is not proper to analyze by a generic analysis flow. The analysis of two failures caused by die attach are presented in this paper.

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