High- Accuracy Die-Bonding Technology for LED Array

Author(s):  
H. Tanabe ◽  
I. Shibata ◽  
K. Nihei ◽  
K. Miyaki
Author(s):  
Noboru Asahi ◽  
Yoshihito Mizutani ◽  
Koichi Imai ◽  
Yasunori Hashimoto ◽  
Hikaru Tomita ◽  
...  

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 002251-002284 ◽  
Author(s):  
Gilbert Lecarpentier ◽  
Joeri De Vos

Higher density interconnection using 3-Dimensional technology implies a pitch reduction and the use of micro-bumps. The micro-bump size reduction has a direct impact on the placement accuracy needed on the die placement and flip chip bonding equipment. The paper presents a Die-to-Die and Die-to-Wafer, high accuracy, die bonding solution illustrated by the flip chip assembly of a large 2x2cm die consisting of 1 million 10 μm micro-bumps at 20 μm pitch


Optik ◽  
2021 ◽  
Vol 235 ◽  
pp. 166632
Author(s):  
Peidong Xu ◽  
Bin Wang ◽  
Yong Wang ◽  
Xiantao Wang

Author(s):  
Antoine Nowodzinski ◽  
Herve Boutry ◽  
Remy Franiatte ◽  
Vincent Mandrillon ◽  
Romain Anciant ◽  
...  

2013 ◽  
Vol 816-817 ◽  
pp. 1105-1110
Author(s):  
Xiao Wu

LED chips position is of crucial significance in chip testing, scribing, die spreading, and die bonding. It’s a great solution to indicate electrical characteristics of chips, examine whether the chip pins are up to the standard, and distinguish LED chip quality. Concerning this, an LED chip positioning method based on wavelet transform is proposed in this paper. Firstly, CCD, light and motion control module are adopted to construct and acquire the visual system of LED chip images. Then the images are processed with lowpass filtering and normalization to obtain Hi-Q chips image, and image features are extracted by further using multi-scale wavelet transform. Lastly, high accuracy positioning of LED chips is achieved by employing high-accuracy point pattern matching algorithm. Experimental results show that the LED chip image positioning error is less than 1μm and the position speed is faster than 5 particles per second, which offer new approaches for high-accuracy chip positioning system of detection machines, sorting machines, die bonders, etc.


Author(s):  
M. Nishigaki ◽  
S. Katagiri ◽  
H. Kimura ◽  
B. Tadano

The high voltage electron microscope has many advantageous features in comparison with the ordinary electron microscope. They are a higher penetrating efficiency of the electron, low chromatic aberration, high accuracy of the selected area diffraction and so on. Thus, the high voltage electron microscope becomes an indispensable instrument for the metallurgical, polymer and biological specimen studies. The application of the instrument involves today not only basic research but routine survey in the various fields. Particularly for the latter purpose, the performance, maintenance and reliability of the microscope should be same as those of commercial ones. The authors completed a 500 kV electron microscope in 1964 and a 1,000 kV one in 1966 taking these points into consideration. The construction of our 1,000 kV electron microscope is described below.


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