Designing an optimal single chip FPGA video interface for embedded systems

2010 ◽  
Author(s):  
Aleodor Daniel Ioan
Keyword(s):  
Embedded Systems ◽  
Single Chip ◽  
Video Interface

Embedded Virtualization Techniques for Automotive Infotainment Applications

2014 ◽  
pp. 372-387
Author(s):  
Massimo Violante ◽  
Gianpaolo Macario ◽  
Salvatore Campagna
Keyword(s):  
Operating System ◽  
Embedded Systems ◽  
Experimental Evidence ◽  
Real Time ◽  
Operating Systems ◽  
Resource Usage ◽  
Single Chip ◽  
Real Time Operating System ◽  
Multicore Computing ◽  
Computing Platforms

Automotive infotainment applications are examples of embedded systems in which a heterogeneous software stack is used, which most likely comprises a real-time operating system, an automotive-grade Linux, and possibly Android. Thanks to the availability of modern systems-on-a-chip providing multicore computing platforms, architects have the possibility of integrating the entire software stack in a single chip. Embedded virtualization appears an interesting technology to achieve this goal, while providing the different operating systems the capability of exchanging data as well as optimizing resource usage. Although very well known in server-class systems, virtualization is rather new to the embedded domain; in order to leverage its benefits, it is therefore mandatory to understand its peculiarities and shortcomings. In this chapter, the authors illustrate the virtualization technologies with particular emphasis on hypervisors and Linux Containers. Moreover, they illustrate how those technologies can cooperate to fulfill the requirements on automotive infotainment applications. Finally, the authors report some experimental evidence of the performance overheads introduced when using embedded virtualization.

Implementation of LabVIEW Based Embedded Control System for FAIMS on a Single Chip ARM

2012 ◽  
Vol 542-543 ◽  
pp. 679-683
Author(s):  
Dian Ling Wang ◽  
Chi Lai Chen ◽  
Cong Zhao ◽  
You Jiang Liu ◽  
Ran Chen ◽  
...  
Keyword(s):  
Control System ◽  
Embedded Systems ◽  
Implementation Process ◽  
Circuit Board ◽  
Single Chip ◽  
Embedded Control ◽  
Embedded Control System ◽  
Development Cycle ◽  
Proposed Model ◽  
The Stability

This paper introduces the mechanism of High-field Asymmetric Waveform Ion Mobility Spectrometry (FAIMS). By using the LabVIEW PDA module which supports the WinCE 5.0 development, a single-chip ARM9 embedded control system for FAIMS is proposed. Compared with conventional "Master + Slave" computer models, the proposed model is able to reduce hardware cost effectively as well as shorten software development cycle. It also downsizes the main controlling circuit board and reduces the power consumption of the entire system. We describe the functions and implementation process of each part in detail, and finally give the detecting results of FAIMS. Sufficient test results validate the stability of FAIMS system. This paper provides a new engineering solution to future similiar embedded systems, and a reliable technical support for some existing embedded systems as well.

scholarly journals A Conceptual Study on Fundamentals and Characteristics of Embedded Systems

2020 ◽  
Vol 4 (4) ◽  
pp. 23-25
Author(s):  
VJST Anirudh ◽  
M.Kiran Kumar
Keyword(s):  
Embedded Systems ◽  
Embedded System ◽  
Medical Equipment ◽  
Complete System ◽  
Consumer Products ◽  
Specific Task ◽  
Specific Function ◽  
Single Chip ◽  
System On A Chip ◽  
Conceptual Study

An embedded system is an electronic/electro-mechanical system designed to perform a specific function and is a combination of firmware and hardware. A complete system on a chip is called an embedded system. It is a special purpose system in which the computer is encapsulated on a single chip which performs a specific task. Every system is unique and the hardware as well as the firmware is inevitable part of any product or equipment in all the fields including household appliances, telecommunications, medical equipment, consumer products etc. This paper highlights the fundamental concepts and characteristics of ES. Keywords: Embedded Systems.

Development of embedded systems to control toxic compounds in textile industries

2012 ◽  
Vol 1 (5) ◽  
pp. 115-117
Author(s):  
Jahnavi KRM Jahnavi KRM ◽  
◽  
Raghavendra Rao K ◽  
Padma Suvarna R
Keyword(s):  
Embedded Systems ◽  
Toxic Compounds ◽  
Textile Industries

Proposal and Evaluation of Mutual Exclusion Method using Lock-free Algorism for Embedded Systems using Multi-core Processor

2019 ◽  
Vol 139 (7) ◽  
pp. 802-811
Author(s):  
Kenta Fujimoto ◽  
Shingo Oidate ◽  
Yuhei Yabuta ◽  
Atsuyuki Takahashi ◽  
Takuya Yamasaki ◽  
...  
Keyword(s):  
Embedded Systems ◽  
Mutual Exclusion ◽  
Exclusion Method ◽  
Multi Core Processor

Towards Okinawa-style Robot-embedded Systems

2013 ◽  
Vol 133 (2) ◽  
pp. 111-115 ◽  
Author(s):  
Takashi Anezaki ◽  
Suriyon Tansuriyavong ◽  
Chikatoshi Yamada
Keyword(s):  
Embedded Systems

Low-Dielectric-Constant Materials for ULSI Interlayer-Dielectric Applications

MRS Bulletin ◽  
1997 ◽  
Vol 22 (10) ◽  
pp. 19-27 ◽  
Author(s):  
Wei William Lee ◽  
Paul S. Ho
Keyword(s):  
Packing Density ◽  
Propagation Delay ◽  
Single Chip ◽  
Crosstalk Noise ◽  
Metal Line ◽  
Total Delay ◽  
Interlayer Dielectric ◽  
Low Dielectric ◽  
Interconnect Delay ◽  
Interconnect Technology

Continuing improvement of microprocessor performance historically involves a decrease in the device size. This allows greater device speed, an increase in device packing density, and an increase in the number of functions that can reside on a single chip. However higher packing density requires a much larger increase in the number of interconnects. This has led to an increase in the number of wiring levels and a reduction in the wiring pitch (sum of the metal line width and the spacing between the metal lines) to increase the wiring density. The problem with this approach is that—as device dimensions shrink to less than 0.25 μm (transistor gate length)—propagation delay, crosstalk noise, and power dissipation due to resistance-capacitance (RC) coupling become significant due to increased wiring capacitance, especially interline capacitance between the metal lines on the same metal level. The smaller line dimensions increase the resistivity (R) of the metal lines, and the narrower interline spacing increases the capacitance (C) between the lines. Thus although the speed of the device will increase as the feature size decreases, the interconnect delay becomes the major fraction of the total delay and limits improvement in device performance.To address these problems, new materials for use as metal lines and interlayer dielectrics (ILD) as well as alternative architectures have been proposed to replace the current Al(Cu) and SiO2 interconnect technology.

Sign in / Sign up

Export Citation Format

Share Document