Influence of Silver Glue on the Die Bonding Process of MEMS Gas Sensors

2021 ◽  
Author(s):  
Shi-Yan Fang ◽  
Yu-Quan Zhuang ◽  
Ting-Jen Hsueh ◽  
Tien-Tsorng Shih
Keyword(s):  
Gas Sensors ◽  
Bonding Process ◽  
Die Bonding

Analysis of Two Electrical Failures Caused by Die Attach of Exposed Pad Package

2014 ◽  
Author(s):  
Jinglong Li ◽  
Motohiko Masuda ◽  
Yi Che ◽  
Miao Wu
Keyword(s):  
Bonding Process ◽  
Die Attach ◽  
Die Bonding ◽  
Generic Analysis

Abstract Die attach is well known in die bonding process. Its electrical character is simple. But some failures caused by die attach are not so simple. And it is not proper to analyze by a generic analysis flow. The analysis of two failures caused by die attach are presented in this paper.

Error Proof Inkless Die Bonding Process Development

2006 ◽  
Author(s):  
Wang ZhiJie ◽  
Sonder Wang ◽  
J.H. Wang ◽  
Yao SuYing ◽  
R. Han
Keyword(s):  
Process Development ◽  
Bonding Process ◽  
Die Bonding

scholarly journals Bonding Strength of Cu Sinter Die-Bonding Paste on Ni, Cu, Ag, and Au Surfaces under Pressureless Bonding Process

2020 ◽  
Vol 13 (0) ◽  
pp. E19-017-1-E19-017-11
Author(s):  
Dai Ishikawa ◽  
Bao Ngoc An ◽  
Matthias Mail ◽  
Helge Wurst ◽  
Benjamin Leyrer ◽  
...  
Keyword(s):  
Bonding Strength ◽  
Bonding Process ◽  
Die Bonding

Fabrication of Aluminum Nitride Thermal Substrate and Low-Temperature Die-Bonding Process for High Power LED

2018 ◽  
Vol 48 (1) ◽  
pp. 194-200 ◽  
Author(s):  
Pai-Jung Chang ◽  
Yue-Kai Tang ◽  
Wei-Han Lai ◽  
Anthony Shiaw-Tseh Chiang ◽  
C. Y. Liu
Keyword(s):  
Low Temperature ◽  
Aluminum Nitride ◽  
High Power ◽  
Bonding Process ◽  
High Power Led ◽  
Die Bonding

A Micro-Machined Ceramic Hot-Plate for Gas Sensor Applications

2011 ◽  
Vol 228-229 ◽  
pp. 558-562
Author(s):  
Yan Bing Xue ◽  
Zhen An Tang
Keyword(s):  
Power Consumption ◽  
Gas Sensors ◽  
Alumina Ceramic ◽  
Bonding Process ◽  
Low Power Consumption ◽  
Hot Plate ◽  
Sensor Applications ◽  
Working Temperature ◽  
First Results ◽  
Lift Off

A novel suspended ceramic hot-plate and wire-free bonding interconnection was investigated. The device was made on the popular alumina ceramic flakes with a platinum heater prepared by lift-off process. The structure of suspended beam was machined by laser micromachining technique. This contribution presents first results for single-layer’s ceramic hot-plates that include design, manufacturing and tests of such devices. The results show that the ceramic hot-plate has lower power consumption (280 mW at 400 °C) than classical ceramic gas sensors. Moreover, it has less expensive manufacturing and bonding process than Si manufacturing technology. Low power consumption and good performance at high working temperature (600 °C or more) makes it possibly to be used in some specific applications for gas sensors.

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