Fabrication of Aluminum Nitride Thermal Substrate and Low-Temperature Die-Bonding Process for High Power LED

2018 ◽  
Vol 48 (1) ◽  
pp. 194-200 ◽  
Author(s):  
Pai-Jung Chang ◽  
Yue-Kai Tang ◽  
Wei-Han Lai ◽  
Anthony Shiaw-Tseh Chiang ◽  
C. Y. Liu
2016 ◽  
Vol 67 ◽  
pp. 120-128 ◽  
Author(s):  
M.Y. Tsai ◽  
C.H. Lin ◽  
K.F. Chuang ◽  
Y.H. Chang ◽  
C.T. Wu ◽  
...  

2012 ◽  
Vol 521 ◽  
pp. 35-38 ◽  
Author(s):  
Youyi Ding ◽  
Shixiang Liu ◽  
Xingyun Li ◽  
Rui Wang ◽  
Ji Zhou

Author(s):  
Jinglong Li ◽  
Motohiko Masuda ◽  
Yi Che ◽  
Miao Wu

Abstract Die attach is well known in die bonding process. Its electrical character is simple. But some failures caused by die attach are not so simple. And it is not proper to analyze by a generic analysis flow. The analysis of two failures caused by die attach are presented in this paper.


2019 ◽  
Vol 1309 ◽  
pp. 012016
Author(s):  
A D Kurilov ◽  
V V Belyaev ◽  
K D Nessemon ◽  
E D Besprozvannyi ◽  
A O Osin ◽  
...  

2017 ◽  
Vol 19 ◽  
pp. 348-351 ◽  
Author(s):  
Alberto Sabin Moura Borba ◽  
Sângela Maria da Silva Pereira ◽  
Mellyna Cavalcante Mendes Borba ◽  
Marco Aurélio Benini Paschoal ◽  
Rudys Rodolfo de Jesus Tavarez ◽  
...  

PLoS ONE ◽  
2015 ◽  
Vol 10 (7) ◽  
pp. e0133479 ◽  
Author(s):  
Khaled Sayed Elbadawi Ramadan ◽  
Stephane Evoy

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