scholarly journals Bonding Strength of Cu Sinter Die-Bonding Paste on Ni, Cu, Ag, and Au Surfaces under Pressureless Bonding Process

2020 ◽  
Vol 13 (0) ◽  
pp. E19-017-1-E19-017-11
Author(s):  
Dai Ishikawa ◽  
Bao Ngoc An ◽  
Matthias Mail ◽  
Helge Wurst ◽  
Benjamin Leyrer ◽  
...  
Keyword(s):  
Bonding Strength ◽  
Bonding Process ◽  
Die Bonding

Analysis of Two Electrical Failures Caused by Die Attach of Exposed Pad Package

2014 ◽  
Author(s):  
Jinglong Li ◽  
Motohiko Masuda ◽  
Yi Che ◽  
Miao Wu
Keyword(s):  
Bonding Process ◽  
Die Attach ◽  
Die Bonding ◽  
Generic Analysis

Abstract Die attach is well known in die bonding process. Its electrical character is simple. But some failures caused by die attach are not so simple. And it is not proper to analyze by a generic analysis flow. The analysis of two failures caused by die attach are presented in this paper.

Vacuum Adhesive Bonding and Stress Isolation for MEMS Resonant Pressure Sensor Package

2011 ◽  
Vol 694 ◽  
pp. 896-900 ◽  
Author(s):  
Yu Xin Li ◽  
De Yong Chen ◽  
Jun Bo Wang
Keyword(s):  
Pressure Sensor ◽  
Bonding Strength ◽  
Adhesive Bonding ◽  
Thermal Stresses ◽  
Time Pressure ◽  
Bonding Temperature ◽  
Bonding Process ◽  
Temperature Drift ◽  
Stress Isolation ◽  
Sensor Package

This paper presents a method of low temperature adhesive bonding and stress isolation for MEMS resonant pressure sensor hermetic packaging using non-photosensitive benzo-cyclo-butene (BCB) from Dow Co. According to the bonding process, pre-bake time, pumping time, pressure placed on the sensor and the thickness of crosslink layer are the most important factors. Stress isolation is designed to minimize thermal stresses to the resonant pressure sensor package. Experimental results show that this bonding process is a viable for MEMS resonant pressure sensor with the bonding temperature below 250°C, measured bonding strength more than 30MPa, the temperature drift less than 0.05%/°C in the range of -40°C to 70°C(10% of that without stress isolation), and the bonding strength maintains well after thermal treatments, handling, bench testing and implantations.

Error Proof Inkless Die Bonding Process Development

2006 ◽  
Author(s):  
Wang ZhiJie ◽  
Sonder Wang ◽  
J.H. Wang ◽  
Yao SuYing ◽  
R. Han
Keyword(s):  
Process Development ◽  
Bonding Process ◽  
Die Bonding

Fabrication of Aluminum Nitride Thermal Substrate and Low-Temperature Die-Bonding Process for High Power LED

2018 ◽  
Vol 48 (1) ◽  
pp. 194-200 ◽  
Author(s):  
Pai-Jung Chang ◽  
Yue-Kai Tang ◽  
Wei-Han Lai ◽  
Anthony Shiaw-Tseh Chiang ◽  
C. Y. Liu
Keyword(s):  
Low Temperature ◽  
Aluminum Nitride ◽  
High Power ◽  
Bonding Process ◽  
High Power Led ◽  
Die Bonding

Improvement of bonding strength of a (Pb,Sn)Te–Cu contact manufactured in a low temperature SLID-bonding process

2014 ◽  
Vol 613 ◽  
pp. 46-54 ◽  
Author(s):  
Tung-Han Chuang ◽  
Wei-Ting Yeh ◽  
Chien-Hsun Chuang ◽  
Jenn-Dong Hwang
Keyword(s):  
Low Temperature ◽  
Bonding Strength ◽  
Bonding Process

Effect of Inter-Metallic Phases on the Bonding Strength and Forming Properties of Al/Mg Sandwiched Composite

2014 ◽  
Vol 622-623 ◽  
pp. 467-475 ◽  
Author(s):  
Haitham Saleh ◽  
Stephan Reichelt ◽  
Matthias Schmidtchen ◽  
Friederike Schwarz ◽  
Rudolf Kawalla ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Tensile Test ◽  
Bonding Strength ◽  
Annealing Temperature ◽  
Bonding Process ◽  
Laminate Composites ◽  
Roll Bonding ◽  
Post Annealing ◽  
Treatment Conditions ◽  
Optimum Annealing Temperature

Composite sheet of Twin Roll Cast (TRC) AZ31-Mg alloy and industrial pure Al-1050 was fabricated as Al/Mg/Al with a hot roll bonding process. As the diffusion zone at the interface between the layers plays a crucial role in the formation of bonding strength and formability of clad sheets. It is important to describe the processes of inter-diffusion layer generation in order to assess the abilities of the laminate composites for further processing. Thus, the aim of this study was to investigate the development of the bonding strength, microstructure and mechanical properties of the bonding interface directly after roll bonding and additionally post-annealing processes. Microstructure characterization techniques such as optical and scanning electron microscopy including energy dispersive X-ray analysis (EDX) were applied to investigate the bonding area. No inter-metallic phases were present directly after the roll bonding process. The creation and growth of Al2Mg3 and Al12Mg17 phases were apparent after annealing at temperatures of 250 to 400 °C at different times ranging from five to 120 minutes. The results prove that the growth rate of inter-metallic phases increases considerably with an increase in the annealing temperature. The micro-hardness of the interface-area was also investigated. It was observed that the two inter-metallic phases were significantly harder than the substrate Mg and Al. In order to examine the influence of the inter-metallic phases on the resulting bonding strength after the annealing process, the shear bonding strength test has been conducted for different samples that were annealed at different heat treatment conditions. The results indicate that the optimum annealing temperature is 200 °C leading to a maximum bonding strength. Moreover, the mechanical properties of the composite after roll bonding and post annealing were determined by means of room temperature tensile test. The fracture mechanism after tensile test was also discussed.Keywords:Rollbonding,Al/Mghotrollbonding,TwinrollcastAZ31,bondingstrength

The no-load vacuum eutectic solder die bonding process

2013 ◽  
Author(s):  
Jing Linxiao ◽  
Chen Xianrong ◽  
Feng Xiaocheng ◽  
He Jinchun
Keyword(s):  
Bonding Process ◽  
Eutectic Solder ◽  
Die Bonding
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