19.5 Three-dimensional 128Gb MLC vertical NAND Flash-memory with 24-WL stacked layers and 50MB/s high-speed programming

Author(s):  
Ki-Tae Park ◽  
Jin-man Han ◽  
Daehan Kim ◽  
Sangwan Nam ◽  
Kihwan Choi ◽  
...  
2015 ◽  
Vol 50 (1) ◽  
pp. 204-213 ◽  
Author(s):  
Ki-Tae Park ◽  
Sangwan Nam ◽  
Daehan Kim ◽  
Pansuk Kwak ◽  
Doosub Lee ◽  
...  

2021 ◽  
Vol 7 (3) ◽  
pp. eabe1341 ◽  
Author(s):  
Min-Kyu Kim ◽  
Ik-Jyae Kim ◽  
Jang-Sik Lee

Ferroelectric memory has been substantially researched for several decades as its potential to obtain higher speed, lower power consumption, and longer endurance compared to conventional flash memory. Despite great deal of effort to develop ferroelectric memory based on perovskite oxides on Si, formation of unwanted interfacial layer substantially compromises the performance of the ferroelectric memory. Furthermore, three-dimensional (3D) integration has been unimaginable because of high processing temperature, non-CMOS compatibility, difficulty in scaling, and complex compositions of perovskite oxides. Here, we demonstrate a unique strategy to tackle critical issues by applying hafnia-based ferroelectrics and oxide semiconductors. Thus, it is possible to avoid the formation of interfacial layer that finally allows unprecedented Si-free 3D integration of ferroelectric memory. This strategy yields memory performance that could be achieved neither by the conventional flash memory nor by the previous perovskite ferroelectric memories. Device simulation confirms that this strategy can realize ultrahigh-density 3D memory integration.


2012 ◽  
Vol E95.C (5) ◽  
pp. 837-841 ◽  
Author(s):  
Se Hwan PARK ◽  
Yoon KIM ◽  
Wandong KIM ◽  
Joo Yun SEO ◽  
Hyungjin KIM ◽  
...  

2012 ◽  
Vol 59 (8) ◽  
pp. 2078-2084 ◽  
Author(s):  
Moon-Sik Seo ◽  
Bong-Hoon Lee ◽  
Sung-Kye Park ◽  
Tetsuo Endoh

2018 ◽  
Vol 1 (1) ◽  
pp. 60-67 ◽  
Author(s):  
Jae Woong Yoon ◽  
Seong-Min Ma ◽  
Gun Pyo Kim ◽  
Yoonshik Kang ◽  
Joonseong Hahn ◽  
...  

2014 ◽  
Vol 513-517 ◽  
pp. 2094-2098 ◽  
Author(s):  
Wen Zhe Zhao ◽  
Kai Zhao ◽  
Qiu Bo Chen ◽  
Min Jie Lv ◽  
Zuo Xun Hou

This paper concerns the design of high-speed and low-cost LDPC code bit-flipping decoder. Due to its inferior error correction strength, bit-flipping decoding received very little attention compared with message-passing decoding. Nevertheless, emerging flash-based solid-state data storage systems inherently favor a hybrid bit-flipping/message-passing decoding strategy, due to the significant dynamics and variation of NAND flash memory raw storage reliability. Therefore, for the first time highly efficient silicon implementation of bit-flipping decoder becomes a practically relevant topic. To address the drawbacks caused by the global search operation in conventional bit-flipping decoding, this paper presents a novel bit-flipping decoder design. Decoding simulations and ASIC design show that the proposed design solution can achieve upto 80% higher decoding throughput and meanwhile consume upto 50% less silicon cost, while maintaining almost the same decoding error correction strength.


2013 ◽  
Vol 13 (9) ◽  
pp. 6382-6388 ◽  
Author(s):  
Byeong-In Choe ◽  
Byung-Gook Park ◽  
Jung-Kyu Lee ◽  
Jong-Ho Lee

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