Abstract
In order to meet increasing performance demand from high-performance computing (HPC) and edge computing, thermal design power (TDP) of CPU and GPU needs to increase. This creates thermal challenge to corresponding electronic packages with respect to heat dissipation. In order to address this challenge, two-phase immersion cooling is gaining attention as its primary mode of heat of removal is via liquid-to-vapor phase change, which can occur at relatively low and constant temperatures. In this paper, integrated heat spreader (IHS) with boiling enhancement features is proposed. 3D metal printing and metal injection molding (MIM) are the two approaches used to manufacture the new IHS. The resultant IHS with enhancement features are used to build test vehicles (TV) by following standard electronic package assembly process. Experimental results demonstrated that boiling enhanced TVs improved two-phase immersion cooling capability by over 50% as compared to baseline TV without boiling enhanced features.
CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling
