Feasibility Study of Solid-phase Epitaxial Regrowth (SPER) as an Ultra-shallow Junction (USJ) Technology for High-performance CMOS Devices

2006 ◽  
Author(s):  
T. Miyashita ◽  
K. Ookoshi ◽  
K. Okabe ◽  
H. Minakata ◽  
K. Suzuki ◽  
...  
Keyword(s):  
Feasibility Study ◽  
High Performance ◽  
Solid Phase ◽  
Shallow Junction ◽  
Epitaxial Regrowth

Modeling and Simulation of the Influence of SOI Structure on Damage Evolution and Ultra-shallow Junction Formed by Ge Preamorphization Implants and Solid Phase Epitaxial Regrowth

2006 ◽  
Vol 912 ◽  
Author(s):  
Caroline Mok ◽  
B. Colombeau ◽  
M. Jaraiz ◽  
P. Castrillo ◽  
J. E. Rubio ◽  
...  
Keyword(s):  
Damage Evolution ◽  
Solid Phase ◽  
Kinetic Monte Carlo ◽  
Silicon On Insulator ◽  
Bulk Silicon ◽  
Shallow Junction ◽  
Defect Interaction ◽  
Epitaxial Regrowth ◽  
Junction Formation ◽  
Ultra Shallow Junctions

AbstractPreamorphization implant (PAI) prior to dopant implantation, followed by solid phase epitaxial regrowth (SPER) is of great interest due to its ability to form highly-activated ultra-shallow junctions. Coupled with growing interest in the use of silicon-on-insulator (SOI) wafers, modeling and simulating the influence of SOI structure on damage evolution and ultra-shallow junction formation is required. In this work, we use a kinetic Monte Carlo (kMC) simulator to model the different mechanisms involved in the process of ultra-shallow junction formation, including amorphization, recrystallization, defect interaction and evolution, as well as dopant-defect interaction in both bulk silicon and SOI. Simulation results of dopant concentration profiles and dopant activation are in good agreement with experimental data and can provide important insight for optimizing the process in bulk silicon and SOI.

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