Circuit Design Considerations for Reducing Parasitic Effects on GaN-Based 1-MHz High-Power-Density High-Step-Up/Down Isolated Resonant Converters

Author(s):  
Xiaonan Zhao ◽  
Cheng-Wei Chen ◽  
Jih-Sheng Lai ◽  
Oscar Yu
2017 ◽  
Vol 32 (8) ◽  
pp. 5953-5963 ◽  
Author(s):  
Akinori Hariya ◽  
Tomoya Koga ◽  
Ken Matsuura ◽  
Hiroshige Yanagi ◽  
Satoshi Tomioka ◽  
...  

2015 ◽  
Vol 821-823 ◽  
pp. 884-888 ◽  
Author(s):  
Otto Kreutzer ◽  
Martin März ◽  
Hideki Nakata

This Paper describes a non-isolated bidirectional full SiC 800V 200kW DCDC-converter power stage for electric and hybrid vehicles that reaches a power density of more than 100 kW/dm3 at a switching frequency of 200 kHz. The high power density is achieved by the use of SiC-MOSFETs sintered on custom made Si3N4DCB-substrates controlled by custom made extremely flat drivers and a resulting very low inductive DC-link connection. All passive components like inductors and capacitor boards are custom made in order to keep all parasitic effects as low as possible. The power is subdivided on six interleaved phases to reduce the required capacitor ripple current capability.


2021 ◽  
Vol 11 (23) ◽  
pp. 11350
Author(s):  
Seyed Abolfazl Mortazavizadeh ◽  
Simone Palazzo ◽  
Arturo Amendola ◽  
Enzo De Santis ◽  
Dario Di Ruzza ◽  
...  

Soft switching for both primary and secondary side devices is available by using LLC converters. This resonant converter is an ideal candidate for today’s high frequency, high efficiency, and high power density applications like adapters, Uninterrupted Power Supplies (UPS), Solid State Transformers (SST), electric vehicle battery chargers, renewable energy systems, servers, and telecom systems. Using Gallium-Nitride (GaN)-based power switches in this converter merits more and more switching frequency, power density, and efficiency. Therefore, the present paper focused on GaN-based LLC resonant converters. The converter structure, operation regions, design steps, and drive system are described precisely. Then its losses are discussed, and the magnets and inductance characteristics are investigated. After that, various interleaved topologies, as a solution to improve power density and decrease current ripples, have been discussed. Also, some challenges and concerns related to GaN-based LLC converters have been reviewed. Commercially available power transistors based on various technologies, i.e., GaN HEMT, Silicon (Si) MOSFET, and Silicon Carbide (SiC) have been compared. Finally, the LLC resonant converter has been simulated by taking advantage of LTspice and GaN HEMT merits, as compared with Si MOSFETs.


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