As in various manufacturing processes, in sliding tests with scanning motions to extend the sliding distance over fresh countersurface, temperature rise during any pass is bolstered by heating during prior passes over neighboring tracks, providing a “heat accumulation effect” with persisting temperature rises contributing to an overall temperature rise of the current pass. Conduction modeling is developed for surface temperature rise as a function of numerous inputs: power and size of heat source; speed and stroke length, and track increment of scanning motion; and countersurface thermal properties. Analysis focused on mid-stroke location for passes of a square uniform heat flux sufficiently far into the rectangular patch being scanned from the first pass at its edge that steady heat accumulation effect response is adopted, focusing on maximum temperature rise experienced across the pass' track. The model is non-dimensionalized to broaden the applicability of the output of its runs. Focusing on practical “high” scanning speeds, represented non-dimensionally by Peclet number (in excess of 40), applicability is further broadened by multiplying non-dimensional maximum temperature rise by the square root of Peclet number as model output. Additionally, investigating model runs at various non-dimensional speed (Peclet number) and reciprocation period values, it appears these do not act as independent inputs, but instead with their product (non-dimensional stroke length) as a single independent input. Modified maximum temperature rise output appears to be a function of only two inputs, increasing with decreasing non-dimensional values of stroke length and scanning increment, with outputs of models runs summarized compactly in a simple chart.
A Low-Cost MEMS Missile-Borne Compound Rotation Modulation Scheme