Interfacial microstructures and solder joint strengths of the Sn–8Zn–3Bi and Sn-9Zn–lAl Pb–free solder pastes on OSP finished printed circuit boards
2008 ◽
Vol 459
(1-2)
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pp. 225-231
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2010 ◽
Vol 97-101
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pp. 2940-2943
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2010 ◽
Vol 22
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pp. 400-411
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2019 ◽
Vol 0
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pp. 60-70
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2005 ◽
Vol 127
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pp. 96-105
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2017 ◽
Vol 2017
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pp. 000477-000481
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