Low-profile contactless battery charger using planar printed circuit board windings as energy transfer device

2003 ◽  
Author(s):  
Wonseok Lim ◽  
Jaehyun Nho ◽  
Byungcho Choi ◽  
Taeyoung Ahn
Keyword(s):  
Energy Transfer ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Battery Charger ◽  
Printed Circuit ◽  
Low Profile ◽  
Transfer Device

scholarly journals Highly Compact Through-Wire Microstrip to Empty Substrate Integrated Coaxial Line Transition

2021 ◽  
Vol 11 (15) ◽  
pp. 6885
Author(s):  
Marcos D. Fernandez ◽  
José A. Ballesteros ◽  
Angel Belenguer
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Coaxial Line ◽  
Circuit Board ◽  
Central Layer ◽  
Printed Circuit ◽  
Integrated Technology ◽  
Low Profile ◽  
The Many ◽  
High Degree

Empty substrate integrated coaxial line (ESICL) technology preserves the many advantages of the substrate integrated technology waveguides, such as low cost, low profile, or integration in a printed circuit board (PCB); in addition, ESICL is non-dispersive and has low radiation. To date, only two transitions have been proposed in the literature that connect the ESICL to classical planar lines such as grounded coplanar and microstrip. In both transitions, the feeding planar lines and the ESICL are built in the same substrate layer and they are based on transformed structures in the planar line, which must be in the central layer of the ESICL. These transitions also combine a lot of metallized and non-metallized parts, which increases the complexity of the manufacturing process. In this work, a new through-wire microstrip-to-ESICL transition is proposed. The feeding lines and the ESICL are implemented in different layers, so that the height of the ESICL can be independently chosen. In addition, it is a highly compact transition that does not require a transformer and can be freely rotated in its plane. This simplicity provides a high degree of versatility in the design phase, where there are only four variables that control the performance of the transition.

Coreless printed-circuit board transformers for signal and energy transfer

1998 ◽  
Vol 34 (11) ◽  
pp. 1052 ◽  
Author(s):  
S.Y.R. Hui ◽  
S.C. Tang ◽  
H. Chung
Keyword(s):  
Energy Transfer ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit

scholarly journals Miniaturized Printed Inverted-F Antenna for Internet of Things: A Design on PCB with a Meandering Line and Shorting Strip

2018 ◽  
Vol 2018 ◽  
pp. 1-5 ◽  
Author(s):  
Cheuk Yin Cheung ◽  
Joseph S. M. Yuen ◽  
Steve W. Y. Mung
Keyword(s):  
Internet Of Things ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Ism Band ◽  
Printed Circuit ◽  
Iot Applications ◽  
Low Profile ◽  
Measurement Results

This paper focuses on a printed inverted-F antenna (PIFA) with meandering line and meandering shorting strip under 2.4 GHz industrial, scientific, and medical (ISM) band for Internet of things (IoT) applications. Bluetooth Low Energy (BLE) technology is one of potential platforms and technologies for IoT applications under ISM band. Printed circuit board (PCB) antenna commonly used in commercial and medical applications because of its small size, low profile, and low cost compared to low temperature cofired ceramic (LTCC) technology. The proposed structure of PIFA is implemented on PCB to gain all these advantages. Replacing conventional PCB line in PIFA by the meandering line and meandering shorting strip improves the efficiency of the PIFA as well as the bandwidth. As a case study, design and measurement results of the proposed PIFA are presented.

High Speed, High Density Separable Interconnect - 1000 plus I/O ultra-low profile interfaces

2015 ◽  
Vol 2015 (1) ◽  
pp. 000761-000765
Author(s):  
James Rathburn
Keyword(s):  
High Speed ◽  
Printed Circuit Board ◽  
Polymer Materials ◽  
Circuit Board ◽  
System Level ◽  
Printed Circuit ◽  
Fine Pitch ◽  
Low Profile ◽  
Flex Cable ◽  
Very High

HSIO Technologies has developed several interconnect technologies that enable very high speed, fine pitch separable interconnect between a semiconductor package, flex cable or printed circuit assembly and a system level printed circuit board. In basic terms, connector technology has been produced that allows of direct socketing of the SoC, PoP, CPU, RF Module or Memory device directly in a mobile platform in an ultra-low profile interface that also extends to a ganged RF capable interface for flex cable and board to board applications. The technology revolves around matching very small metallic contacts with fusion bonded Liquid Crystal Polymer materials to create a high speed interface on very fine pitch. Applications to be detailed are socketing of mobile processors, memory devices, and RF modules directly in a cell phone handset, tablet and notebook computer. Emerging complexity with mobile platforms dictates that traditional methods of validating platform performance is not adequate with significant value in the ability to plug packaged IC devices into the actual consumer platform to validate silicon and performance. The paper will document the package substrate to connector interface as well as introduce very high performance connector and flex cable interconnects on 0.35 mm pitch area array for mobile, desktop, and server applications.

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