Thermal reliability analysis of polymeric materials for PV technology

Author(s):  
Crystal Vanderpan
Author(s):  
Caleb King ◽  
Zhibing Xu ◽  
I.-C. Lee ◽  
Yili Hong

2016 ◽  
Vol 2016 ◽  
pp. 1-7 ◽  
Author(s):  
Y. Shang ◽  
H. Xu ◽  
J. Mo ◽  
Z. Wang ◽  
X. Xu ◽  
...  

A new high-efficiency K-band MMIC medium-power amplifier (PA) is designed with multiharmonic matching using GaAs pHEMT process technology. It has an operation frequency centered at 26 GHz with a bandwidth of 2 GHz. A 20 dBm 1 dB-compression-point output power and 40% efficiency are achieved. A novel thermal reliability analysis method based on ICEPAK is proposed also to evaluate its thermal characteristic. The test result by using a QFI InfraScope™infrared imaging system is compared with the simulation result. It agrees well with an accuracy within ±1°C differences, which reflects the advantages of the thermal analysis method with respect to accuracy and convenience for use.


2008 ◽  
Vol 44 (11) ◽  
pp. 1355-1369 ◽  
Author(s):  
Jin-Huek Hur ◽  
Tae-Gu Lee ◽  
Sun-Ae Moon ◽  
Sang-Jae Lee ◽  
Hoseon Yoo ◽  
...  

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