Thermal Design and Thermal Reliability Analysis of SAR Antenna System Unfolding

2021 ◽  
Author(s):  
Liu Liu ◽  
Zhang Xiaofeng ◽  
Liao Xing
Keyword(s):  
Reliability Analysis ◽  
Antenna System ◽  
Thermal Design ◽  
Thermal Reliability

PCB thermal reliability characteristics analysis under ambient temperature

2020 ◽  
Vol 20 (3) ◽  
pp. 853-858
Author(s):  
Hailong Huang ◽  
Yi Wan ◽  
Kai Zhou
Keyword(s):  
Flow Analysis ◽  
Thermal Characteristics ◽  
Thermal Design ◽  
Junction Temperature ◽  
Electrical Transmission ◽  
Thermal Reliability ◽  
Ambient Temperatures ◽  
Reliability Characteristics ◽  
Characteristics Analysis ◽  
Volume Method

PCB is an important component for electronic devices – Mechanical connections and electrical transmission, thermal failure is its main failure mode, the heat flow analysis and thermal design is the basis and premise to improve thermal characteristics of PCBs. In this paper, based on the principles of fluid mechanics, using the finite volume method, the thermal characteristics of the PCB is modeled, and we obtain the maximum junction temperature of the PCB, PCB’s thermal distribution and effect of different ambient temperatures on the PCB thermal characteristics. The study provides a theoretical basis for the PCB thermal design.

scholarly journals The Design and Thermal Reliability Analysis of a High-Efficiency K-Band MMIC Medium-Power Amplifier with Multiharmonic Matching

2016 ◽  
Vol 2016 ◽  
pp. 1-7 ◽  
Author(s):  
Y. Shang ◽  
H. Xu ◽  
J. Mo ◽  
Z. Wang ◽  
X. Xu ◽  
...  
Keyword(s):  
Reliability Analysis ◽  
Power Amplifier ◽  
High Efficiency ◽  
Infrared Imaging ◽  
Imaging System ◽  
Thermal Characteristic ◽  
Analysis Method ◽  
Process Technology ◽  
Thermal Reliability ◽  
K Band

A new high-efficiency K-band MMIC medium-power amplifier (PA) is designed with multiharmonic matching using GaAs pHEMT process technology. It has an operation frequency centered at 26 GHz with a bandwidth of 2 GHz. A 20 dBm 1 dB-compression-point output power and 40% efficiency are achieved. A novel thermal reliability analysis method based on ICEPAK is proposed also to evaluate its thermal characteristic. The test result by using a QFI InfraScope™infrared imaging system is compared with the simulation result. It agrees well with an accuracy within ±1°C differences, which reflects the advantages of the thermal analysis method with respect to accuracy and convenience for use.

Thermal reliability analysis of a BLDC motor in a high-speed axial fan by the accelerated-life test and numerical methods

2008 ◽  
Vol 44 (11) ◽  
pp. 1355-1369 ◽  
Author(s):  
Jin-Huek Hur ◽  
Tae-Gu Lee ◽  
Sun-Ae Moon ◽  
Sang-Jae Lee ◽  
Hoseon Yoo ◽  
...  
Keyword(s):  
Numerical Methods ◽  
Reliability Analysis ◽  
High Speed ◽  
Accelerated Life Test ◽  
Bldc Motor ◽  
Life Test ◽  
Axial Fan ◽  
Thermal Reliability ◽  
Accelerated Life
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