Effects of Heating Rate on Material Properties of Anisotropic Conductive Film (ACF) and Thermal Cycling Reliability of ACF Flip Chip Assembly

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2008.2001701 ◽

2009 ◽

Vol 32 (2) ◽

pp. 339-346 ◽

Author(s):

Kyung-Woon Jang ◽

Kyung-Wook Paik

Keyword(s):

Thermal Cycling ◽

Heating Rate ◽

Material Properties ◽

Flip Chip ◽

Anisotropic Conductive Film ◽

Conductive Film ◽

Flip Chip Assembly

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Effects of Heating Rate During ACFs Curing Process on Material Properties and Thermal Cycling Reliability of Flip Chip Assembly

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.374028 ◽

2007 ◽

Author(s):

Kyung-Woon Jang ◽

Kyung-Wook Paik

Keyword(s):

Thermal Cycling ◽

Heating Rate ◽

Material Properties ◽

Flip Chip ◽

Curing Process ◽

Flip Chip Assembly

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A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages

Microelectronics Reliability ◽

10.1016/j.microrel.2011.12.022 ◽

2012 ◽

Vol 52 (6) ◽

pp. 1174-1181 ◽

Author(s):

Kyung-Woon Jang ◽

Jin-Hyoung Park ◽

Soon-Bok Lee ◽

Kyung-Wook Paik

Keyword(s):

Thermal Cycling ◽

Flip Chip ◽

Anisotropic Conductive Film ◽

Conductive Film ◽

Flip Chip Assembly

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Influence of the Bonding Force, Anisotropic Conductive Film (ACF) and Reflow Process on the Flip Chip Assembly

ECS Transactions ◽

10.1149/1.3474158 ◽

2019 ◽

Vol 31 (1) ◽

pp. 189-196

Author(s):

Natiara V. Madalossi ◽

Marcio Otta ◽

Talita Mazon

Keyword(s):

Flip Chip ◽

Anisotropic Conductive Film ◽

Reflow Process ◽

Bonding Force ◽

Conductive Film ◽

Flip Chip Assembly

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Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly

Journal of Electronic Materials ◽

10.1007/s11664-006-0203-0 ◽

2006 ◽

Vol 35 (1) ◽

pp. 189-189

Author(s):

J. W. Hwang ◽

M. J. Yim ◽

K. W. Paik

Keyword(s):

Flip Chip ◽

Resin Content ◽

Test Reliability ◽

Anisotropic Conductive Film ◽

Thermoplastic Resin ◽

Conductive Films ◽

Conductive Film ◽

Flip Chip Assembly

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Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly

Journal of Electronic Materials ◽

10.1007/s11664-005-0205-3 ◽

2005 ◽

Vol 34 (11) ◽

pp. 1455-1461 ◽

Author(s):

J. W. Hwang ◽

M. J. Yim ◽

K. W. Paik

Keyword(s):

Flip Chip ◽

Resin Content ◽

Test Reliability ◽

Anisotropic Conductive Film ◽

Thermoplastic Resin ◽

Conductive Films ◽

Conductive Film ◽

Flip Chip Assembly

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Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film

IEEE Transactions on Electronics Packaging Manufacturing ◽

10.1109/6104.873244 ◽

2000 ◽

Vol 23 (3) ◽

pp. 171-176 ◽

Author(s):

Myung Jin Yim ◽

Young-Doo Jeon ◽

Kyung-Wook Paik

Keyword(s):

Flip Chip ◽

Thermal Strain ◽

Organic Substrate ◽

Anisotropic Conductive Film ◽

Conductive Film ◽

Flip Chip Assembly

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Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/6144.814974 ◽

1999 ◽

Vol 22 (4) ◽

pp. 575-581 ◽

Author(s):

Myung-Jin Yim ◽

Woonghwan Ryu ◽

Young-Doo Jeon ◽

Junho Lee ◽

Seungyoung Ahn ◽

...

Keyword(s):

High Frequency ◽

Flip Chip ◽

Anisotropic Conductive Film ◽

Conductive Film

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Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications

Microelectronics Reliability ◽

10.1016/j.microrel.2008.03.002 ◽

2008 ◽

Vol 48 (7) ◽

pp. 1052-1061 ◽

Author(s):

Kyung-Woon Jang ◽

Chang-Kyu Chung ◽

Woong-Sun Lee ◽

Kyung-Wook Paik

Keyword(s):

Material Properties ◽

Flash Memory ◽

Flip Chip ◽

Nand Flash Memory ◽

Conductive Films ◽

Flip Chip Assembly ◽

Memory Applications

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Visible Light-Emitting Diodes With Thin-Film-Flip- Chip-Based Wafer-Level Chip-Scale Package Technology Using Anisotropic Conductive Film Bonding

IEEE Electron Device Letters ◽

10.1109/led.2015.2434053 ◽

2015 ◽

Vol 36 (7) ◽

pp. 702-704 ◽

Author(s):

Keon Hwa Lee ◽

Seung Hwan Kim ◽

Woo-Sik Lim ◽

June-O Song ◽

Jae-Hyun Ryou

Keyword(s):

Thin Film ◽

Visible Light ◽

Flip Chip ◽

Light Emitting Diodes ◽

Anisotropic Conductive Film ◽

Wafer Level ◽

Light Emitting ◽

Conductive Film ◽

Chip Scale Package

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Review paper: Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA)

Current Applied Physics ◽

10.1016/j.cap.2013.05.009 ◽

2013 ◽

Vol 13 ◽

pp. S14-S25 ◽

Author(s):

Sun-Chul Kim ◽

Young-Ho Kim

Keyword(s):

Flip Chip ◽

Review Paper ◽

Anisotropic Conductive Film ◽

Flip Chip Bonding ◽

Conductive Film

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