Field Effect Resistor, a single-device-at-pad solution for ESD protection in deeply scaled SOI technology

Author(s):  
Shuqing Cao ◽  
Akram A. Salman ◽  
Jung-Hoon Chun ◽  
Stephen G. Beebe ◽  
Mario M. Pelella ◽  
...  
2011 ◽  
Vol 51 (4) ◽  
pp. 756-764 ◽  
Author(s):  
Shuqing Cao ◽  
Jung-Hoon Chun ◽  
Akram A. Salman ◽  
Stephen G. Beebe ◽  
Robert W. Dutton

Author(s):  
Shuqing Cao ◽  
Stephen G. Beebe ◽  
Akram A. Salman ◽  
Mario M. Pelella ◽  
Jung-Hoon Chun ◽  
...  

2005 ◽  
Vol 14 (05) ◽  
pp. 931-937 ◽  
Author(s):  
IRAJ SHEIKHIAN ◽  
FARSHID RAISSI

In a field effect diode, carriers of a p–n junction can be modulated on-line. The p and n regions are created by two oppositely biased, and closely spaced, gates in CMOS SOI technology. Using gates as the third terminal, the field effect diode can operate as a switch or as an amplifying element. In this paper, a conventional differential comparator is designed and its performance is compared with a circuit which uses field effect diodes in its output stage. It is shown that the large current sinking and supplying capability of the field effect diode causes this comparator to operate faster than the conventional circuit, consumes less power and covers less chip area.


2013 ◽  
pp. 73-80
Author(s):  
D. E. Ioannou ◽  
Z. Chbili ◽  
A. Z. Badwan ◽  
Q. Li ◽  
Y. Yang ◽  
...  
Keyword(s):  

2017 ◽  
Vol 31 (19-21) ◽  
pp. 1740004 ◽  
Author(s):  
Yibo Jiang ◽  
Hui Bi ◽  
Liangwei Dong ◽  
Qinglong Li

Implementation of Electrostatic Discharge (ESD) protection in Silicon on Insulator (SOI) technology is a challenge because of the inherent properties of poor heat conductor and heat trapping. In this paper, a novel device as ESD clamp is proposed as Fix-Base SOI FinFET clamp which addresses the troublesome problem of floating base. Moreover, its manufacturing process is compatible to the normal SOI process flow well. Finally, a detailed discussion including current density and thermal distribution are presented with the technique of 3D TCAD simulation.


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