scholarly journals Test-Cost Modeling and Optimal Test-Flow Selection of 3-D-Stacked ICs

Author(s):  
Mukesh Agrawal ◽  
Krishnendu Chakrabarty
2022 ◽  
Vol 54 (1) ◽  
pp. 525-553
Author(s):  
Paul M. Danehy ◽  
Ross A. Burns ◽  
Daniel T. Reese ◽  
Jonathan E. Retter ◽  
Sean P. Kearney

Long-lasting emission from femtosecond excitation of nitrogen-based flows shows promise as a useful mechanism for a molecular tagging velocimetry instrument. The technique, known as femtosecond laser electronic excitation tagging (FLEET), was invented at Princeton a decade ago and has quickly been adopted and used in a variety of high-speed ground test flow facilities. The short temporal scales offered by femtosecond amplifiers permit nonresonant multiphoton excitation, dissociation, and weak ionization of a gaseous medium near the beam's focus without the generation of a laser spark observed with nanosecond systems. Gated, intensified imaging of the resulting emission enables the tracking of tagged molecules, thereby measuring one to three components of velocity. Effects of local heating and acoustic disturbances can be mitigated with the selection of a shorter-wavelength excitation source. This review surveys the development of FLEET over the decade since its inception, as it has been implemented in several test facilities to make accurate, precise, and seedless velocimetry measurements for studying complex high-speed flows.


2015 ◽  
Vol 2015 (1) ◽  
pp. 000702-000706
Author(s):  
Amy Palesko

Many factors affect the selection of the assembly and interconnect processes used to package a die. For example, the size of the die and package, the type of substrate, and the number of IOs all must be considered. In this paper, two processes are compared: a flip chip process using mass reflow with capillary underfill versus a flip chip thermocompression bonding process using nonconductive paste. Activity based cost modeling is used for the analysis. Both of the process flows are presented in detail, then multiple cost comparisons are presented. Examples of the variables that will change are package size, material cost, and equipment cost. In most cases, the bonding and material portions of the process flows are focused on rather than the entire assembly and substrate processes—this allows for a better analysis of particular details. Conclusions are drawn about which design scenarios are suitable for each process flow. Key cost drivers that may affect future cost comparisons as the technologies advance are also indicated.


Author(s):  
Puneet Jain ◽  
Danielle Andrade ◽  
Elizabeth Donner ◽  
David Dyment ◽  
Asuri N. Prasad ◽  
...  

AbstractMultiple genes/variants have been implicated in various epileptic conditions. However, there is little general guidance available on the circumstances in which genetic testing is indicated and test selection in order to guide optimal test appropriateness and benefit. This is an account of the development of guidelines for genetic testing in epilepsy, which have been developed in Ontario, Canada. The Genetic Testing Advisory Committee was established in Ontario to review the clinical utility and validity of genetic tests and the provision of genetic testing in Ontario. As part of their mandate, the committee also developed recommendations and guidelines for genetic testing in epilepsy. The recommendations include mandatory prerequisites for an epileptology/geneticist/clinical biochemical geneticist consultation, prerequisite diagnostic procedures, circumstances in which genetic testing is indicated and not indicated and guidance for selection of genetic tests, including their general limitations and considerations. These guidelines represent a step toward the development of evidence-based gene panels for epilepsy in Ontario, the repatriation of genetic testing for epilepsy into Ontario molecular genetic laboratories and public funding of genetic tests for epilepsy in Ontario.


1994 ◽  
Vol 22 (3) ◽  
pp. 577-585
Author(s):  
J. C. Bakker ◽  
W. K. Bleeker ◽  
P. J. Den Boer ◽  
P. T. M. Biessels ◽  
J. Agterberg ◽  
...  

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