Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design

2010 ◽  
Vol 33 (2) ◽  
pp. 347-358 ◽  
Author(s):  
Kenji Hirohata ◽  
Katsumi Hisano ◽  
Minoru Mukai ◽  
Hideo Aoki ◽  
Chiaki Takubo ◽  
...  
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Reliability Design ◽  
Thermal Stress Analysis

Thermal stress analysis of a directionally solidified Al–1wt%Ni alloy casting

2010 ◽  
Vol 46 (10) ◽  
pp. 889-895 ◽  
Author(s):  
Moisés M. Pariona ◽  
Josuel K. Rugenski ◽  
Manuel V. Canté ◽  
José E. Spinelli ◽  
Amauri Garcia
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Directionally Solidified ◽  
Thermal Stress Analysis ◽  
Alloy Casting ◽  
Ni Alloy

Thermal stress analysis of a multichip package design

1989 ◽  
Vol 12 (4) ◽  
pp. 663-672 ◽  
Author(s):  
R. Darveaux ◽  
I. Turlik ◽  
L.-T. Hwang ◽  
A. Reisman
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Package Design ◽  
Thermal Stress Analysis
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