Study on Fine Pitch Flex-on-Flex Assembly Using Nanofiber/Solder Anisotropic Conductive Film and Ultrasonic Bonding Method

2012 ◽  
Vol 2 (12) ◽  
pp. 2108-2114 ◽  
Author(s):  
Sang-Hoon Lee ◽  
Kyung-Lim Suk ◽  
Kiwon Lee ◽  
Kyung-Wook Paik
Keyword(s):  
Anisotropic Conductive Film ◽  
Ultrasonic Bonding ◽  
Fine Pitch ◽  
Conductive Film ◽  
Bonding Method

Composite Anisotropic Conductive Film

2013 ◽  
Vol 302 ◽  
pp. 182-188
Author(s):  
Chao Ming Lin
Keyword(s):  
Failure Probability ◽  
Liquid Crystal Display ◽  
Anisotropic Conductive Film ◽  
Complete Evaluation ◽  
Fine Pitch ◽  
Conductive Film ◽  
Poisson Function ◽  
Curve Method ◽  
And Performance ◽  
Formula Composition

Anisotropic conductive film (ACF), is a lead-free and fine-pitch interconnect materials that is commonly used in liquid crystal display (LCD) manufacturing to make and maintain the electrical and mechanical connections from the driver IC to the substrate. A key issue in the ACF technology is the packaging yield or failure probability, and performance of ACF’s material formula composition. This paper utilizes the V-shaped curve method to analyze the failure probability of composite ACF packages with a smart composition or a functional formula. In the proposed model, the probability of opening failures is modeled using a Poisson function, modified to take into account the average conception on the effective conductive area between opposing pads. Meanwhile, the probability estimation of bridging failures is based on the Box-Strip-Brick model between the neighboring pad pairs in the array. The results show the derived probability formulation can involve the probability conceptions of the composite ACF into a complete evaluation computation.

Anisotropic conductive film interconnects for fine-pitch MEMS

2012 ◽  
Author(s):  
Hoang-Vu Nguyen ◽  
Helge Kristiansen ◽  
Andreas Larsson ◽  
Erik Poppe ◽  
Rolf Johannessen ◽  
...  
Keyword(s):  
Anisotropic Conductive Film ◽  
Fine Pitch ◽  
Conductive Film

scholarly journals Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding

2013 ◽  
Vol 2013 ◽  
pp. 1-10 ◽  
Author(s):  
Tae-Wan Kim ◽  
Kyung-Lim Suk ◽  
Sang-Hoon Lee ◽  
Kyung-Wook Paik
Keyword(s):  
Polyvinylidene Fluoride ◽  
Short Circuit ◽  
Flexible Substrate ◽  
Capture Rate ◽  
Bonding Process ◽  
Conductive Films ◽  
Ultrasonic Bonding ◽  
Fine Pitch ◽  
Solder Balls ◽  
Bonding Method

In this study, solder ball incorporated polyvinylidenefluoride (PVDF) nanofiber was added into the ACF system to overcome short circuit issues of fine pitch flex-on-flex (FOF) assembly. Also, in order to improve the thermal mismatch of the flexible substrate which can lead to electrode misalignment during the bonding process, low melting temperature Sn58Bi solder balls were used with vertical ultrasonic (U/S) bonding method. When performing FOF assembly using PVDF nanofiber/Sn58Bi solder ACF and vertical ultrasonic bonding, PVDF nanofiber/Sn58Bi solder ACFs showed 34% higher solder capture rate on an electrode compared to conventional Ni ACFs and conventional Sn58Bi solder ACFs. Additionally, PVDF nanofiber/Sn58Bisolder ACFs showed 100% insulation between neighboring electrodes where conventional Ni ACFs and conventional Sn58Bi solder ACFs showed 75% and 87.5% insulation. Other electrical properties such as contact resistance and current handling capability as well as reliability test of PVDF nanofiber/Sn58Bi solder ACFs showed improved results compared to those of conventional Ni ACFs, which proves the formation of stable solder joint of PVDF nanofiber/Sn58Bi solder ACFs.

Sign in / Sign up

Export Citation Format

Share Document