Anisotropic conductive film (ACF), is a lead-free and fine-pitch interconnect materials that is commonly used in liquid crystal display (LCD) manufacturing to make and maintain the electrical and mechanical connections from the driver IC to the substrate. A key issue in the ACF technology is the packaging yield or failure probability, and performance of ACF’s material formula composition. This paper utilizes the V-shaped curve method to analyze the failure probability of composite ACF packages with a smart composition or a functional formula. In the proposed model, the probability of opening failures is modeled using a Poisson function, modified to take into account the average conception on the effective conductive area between opposing pads. Meanwhile, the probability estimation of bridging failures is based on the Box-Strip-Brick model between the neighboring pad pairs in the array. The results show the derived probability formulation can involve the probability conceptions of the composite ACF into a complete evaluation computation.
