Fabrication and Electrical Characterization of Printed Microresistors of Silver Nanoparticles Using Microcantilever-Based Printing Technology

ABSTRACTStructural and electrical characterization of laser recrystallized LPCVD silicon films on amorphous substrates using a shaped cw laser beam have been performed. In comparing the results to data obtained using a circular beam, it was found that a significant increase in grain size can be achieved and that the surface morphology of the shaped beam recrystallized material was much smoother. It was also found that whereas circular beam recrystallized material has a random grain structure, shaped beam material is highly oriented with a <100> texture. Finally the electrical characteristics of the recrystallized film were very good when measured in directions parallel to the grain boundaries.

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Synthesis and Characterization of Silver Nanoplates by a Seed-mediated Method

Communications in Physics ◽

10.15625/0868-3166/29/3/13763 ◽

2019 ◽

Vol 29 (3) ◽

Author(s):

Mai Ngọc Tuan Anh

Keyword(s):

Hydrogen Peroxide ◽

Silver Nanoparticles ◽

Ascorbic Acid ◽

Silver Nitrate ◽

Sodium Borohydride ◽

Trisodium Citrate ◽

Synthesis And Characterization ◽

Silver Nanoplates ◽

Seed Mediated

Silver nanoplates (SNPs) having different size were synthesized by a seed-mediated method. The seeds -silver nanoparticles with 4 – 6 nm diameters were synthesized first by reducing silver nitrate with sodium borohydride in the present of Trisodium Citrate and Hydrogen peroxide. Then these seeds were developed by continue reducing Ag\(^+\) ions with various amount of L-Ascorbic acid to form SNPs. Our analysis showed that the concentratrion of L-Ascorbic acid, a secondary reducing agent, played an important role to form SNPs. In addition, the size and in-plane dipole plasmon resonance wavelenght of silver nanoplates were increased when the concentration of added silver nitrate increased. The characterization of SNPs were studied by UV-Vis, FE-SEM, EDS and TEM methods.

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Vapor Deposition Polymerization and Electrical Characterization of TPD Thin Films

IEICE Transactions on Electronics ◽

10.1587/transele.e94.c.157 ◽

2011 ◽

Vol E94-C (2) ◽

pp. 157-163 ◽

Cited By ~ 4

Author(s):

Masakazu MUROYAMA ◽

Ayako TAJIRI ◽

Kyoko ICHIDA ◽

Seiji YOKOKURA ◽

Kuniaki TANAKA ◽

...

Keyword(s):

Thin Films ◽

Vapor Deposition ◽

Electrical Characterization

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Electrical Characterization of Different Failure Modes in Sub-100 nm Devices Using Nanoprobing Technique

ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2009p0081 ◽

2009 ◽

Author(s):

E. Hendarto ◽

S.L. Toh ◽

J. Sudijono ◽

P.K. Tan ◽

H. Tan ◽

...

Keyword(s):

Electron Microscope ◽

Focused Ion Beam ◽

Failure Modes ◽

Ion Beam ◽

Electrical Characterization ◽

Nickel Silicide ◽

Fault Isolation ◽

Technology Nodes ◽

Scanning Electron

Abstract The scanning electron microscope (SEM) based nanoprobing technique has established itself as an indispensable failure analysis (FA) technique as technology nodes continue to shrink according to Moore's Law. Although it has its share of disadvantages, SEM-based nanoprobing is often preferred because of its advantages over other FA techniques such as focused ion beam in fault isolation. This paper presents the effectiveness of the nanoprobing technique in isolating nanoscale defects in three different cases in sub-100 nm devices: soft-fail defect caused by asymmetrical nickel silicide (NiSi) formation, hard-fail defect caused by abnormal NiSi formation leading to contact-poly short, and isolation of resistive contact in a large electrical test structure. Results suggest that the SEM based nanoprobing technique is particularly useful in identifying causes of soft-fails and plays a very important role in investigating the cause of hard-fails and improving device yield.

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