Thermal Fatigue Reliability Analysis and Structural Optimization Based on a Robust Method for Microelectronics FBGA Packages
2015 ◽
Vol 15
(2)
◽
pp. 206-213
◽
Keyword(s):
2012 ◽
Vol 204-208
◽
pp. 3128-3131
2020 ◽
Vol 16
(6)
◽
pp. 855
Keyword(s):