Thermal fatigue reliability analysis of redistributed flip chip assemblies

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) ◽

10.1109/ectc.1998.678669 ◽

2002 ◽

Author(s):

B. Vandevelde ◽

E. Beyne

Keyword(s):

Reliability Analysis ◽

Thermal Fatigue ◽

Flip Chip ◽

Fatigue Reliability

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Thermal fatigue reliability analysis for PBGA with Sn-3.8Ag-0.7Cu solder joints

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) ◽

10.1109/eptc.2004.1396715 ◽

2005 ◽

Author(s):

F.X. Che ◽

J.H.L. Pang

Keyword(s):

Reliability Analysis ◽

Thermal Fatigue ◽

Solder Joints ◽

Fatigue Reliability

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J0103-2-3 Evaluation of Thermal Fatigue Reliability of Solder Joints in Flip Chip Package using the Digital Image Correlation Method

The proceedings of the JSME annual meeting ◽

10.1299/jsmemecjo.2009.6.0_57 ◽

2009 ◽

Vol 2009.6 (0) ◽

pp. 57-58

Author(s):

Toshifumi KANNO ◽

Nobuyuki SHISHIDO ◽

Toru IKEDA ◽

Noriyuki MIYAZAKI ◽

Hiroyuki TANAKA ◽

...

Keyword(s):

Digital Image Correlation ◽

Thermal Fatigue ◽

Digital Image ◽

Flip Chip ◽

Solder Joints ◽

Correlation Method ◽

Image Correlation ◽

Fatigue Reliability ◽

Digital Image Correlation Method ◽

Reliability Of Solder Joints

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Improved thermal fatigue reliability for flip chip assemblies using redistribution techniques

IEEE Transactions on Advanced Packaging ◽

10.1109/6040.846641 ◽

2000 ◽

Vol 23 (2) ◽

pp. 239-246 ◽

Author(s):

B. Vandevelde ◽

E. Beyne

Keyword(s):

Thermal Fatigue ◽

Flip Chip ◽

Fatigue Reliability

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Thermal Fatigue Reliability Analysis and Structural Optimization Based on a Robust Method for Microelectronics FBGA Packages

IEEE Transactions on Device and Materials Reliability ◽

10.1109/tdmr.2015.2417888 ◽

2015 ◽

Vol 15 (2) ◽

pp. 206-213 ◽

Author(s):

Yi Wan ◽

Hailong Huang ◽

Michael Pecht

Keyword(s):

Structural Optimization ◽

Reliability Analysis ◽

Thermal Fatigue ◽

Robust Method ◽

Fatigue Reliability

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Thermal Fatigue Reliability Optimisation of Flip Chip Assemblies

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics ◽

10.1007/978-1-4757-3159-0_11 ◽

2000 ◽

pp. 165-177 ◽

Author(s):

Bart Vandevelde ◽

Eric Beyne

Keyword(s):

Thermal Fatigue ◽

Flip Chip ◽

Fatigue Reliability

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Thermal fatigue reliability analysis of PBGA with Sn63Pb37 solder joints

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583318 ◽

2016 ◽

Author(s):

Huaicheng Li ◽

Tong An ◽

Xiaorui Bie ◽

Ge Shi ◽

Fei Qin

Keyword(s):

Reliability Analysis ◽

Thermal Fatigue ◽

Solder Joints ◽

Fatigue Reliability

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Optimisation modelling for thermal fatigue reliability of lead‐free interconnects in fine‐pitch flip‐chip packaging

Soldering & Surface Mount Technology ◽

10.1108/09540910910928265 ◽

2009 ◽

Vol 21 (1) ◽

pp. 11-24 ◽

Author(s):

Stoyan Stoyanov ◽

Chris Bailey ◽

Marc Desmulliez

Keyword(s):

Thermal Fatigue ◽

Flip Chip ◽

Lead Free ◽

Fatigue Reliability ◽

Flip Chip Packaging

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The effects of underfill on the thermal fatigue reliability of solder joints in newly developed flip chip on module

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ◽

10.1109/itherm.2012.6231487 ◽

2012 ◽

Author(s):

Jae B. Kwak ◽

Soonwan Chung

Keyword(s):

Thermal Fatigue ◽

Flip Chip ◽

Solder Joints ◽

Fatigue Reliability ◽

Reliability Of Solder Joints

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Contact Fatigue Reliability Analysis of Rolling Bearing based on Elastohydrodynamic Lubrication

International Journal of Performability Engineering ◽

10.23940/ijpe.20.06.p4.855865 ◽

2020 ◽

Vol 16 (6) ◽

pp. 855

Author(s):

Lu Chunyu ◽

Liu Shaojun

Keyword(s):

Reliability Analysis ◽

Contact Fatigue ◽

Elastohydrodynamic Lubrication ◽

Rolling Bearing ◽

Fatigue Reliability

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Novel nonlinear time-varying fatigue reliability analysis based on the probability density evolution method

International Journal of Fatigue ◽

10.1016/j.ijfatigue.2021.106257 ◽

2021 ◽

pp. 106257

Author(s):

Kai Gao ◽

Gang Liu

Keyword(s):

Probability Density ◽

Reliability Analysis ◽

Time Varying ◽

Fatigue Reliability ◽

Density Evolution ◽

Probability Density Evolution Method ◽

Probability Density Evolution

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