Comparison of Micro-Fabrication Routes for Magneto-Impedance Elements: Lift-Off and Wet-Etching

2012 ◽  
Vol 48 (4) ◽  
pp. 1601-1604 ◽  
Author(s):  
A. Garcfa-Arribas ◽  
E. Fernandez ◽  
A. Barrainkua ◽  
A. V. Svalov ◽  
G. V. Kurlyandskaya ◽  
...  
Author(s):  
Yang Liu ◽  
Lai Wang ◽  
Yuantao Zhang ◽  
Xin Dong ◽  
Zhibiao Hao ◽  
...  
Keyword(s):  

2009 ◽  
Vol 517 (9) ◽  
pp. 2900-2904 ◽  
Author(s):  
Yasuhiro Saito ◽  
Shinya Okamoto ◽  
Hiroyuki Inomata ◽  
Junji Kurachi ◽  
Takeshi Hidaka ◽  
...  

2010 ◽  
Vol 24 (15n16) ◽  
pp. 2639-2644 ◽  
Author(s):  
W. B. PARK ◽  
J. H. CHOI ◽  
C. W. PARK ◽  
G. M. KIM ◽  
H. S. SHIN ◽  
...  

In this study, the mass fabrication of microelectrode tools for microelectrochemical machining (MECM) was studied using microfabrication processes. The cantilever type geometry of microelectrodes was defined by photolithography processes, and metal patterns were made for electrical contacts. Various fabrication processes were studied for the fabrication of microelectrode tools, such as wet etching, lift-off, and electroforming for metal layer patterning. MECM test results showed feasibility of the fabricated electrode tools. The microfabricated electrodes can be used as micromachining tools for various electrical micromachining of steel mold and parts of microdevices.


2017 ◽  
Vol 254 (8) ◽  
pp. 1770241 ◽  
Author(s):  
Chris Youtsey ◽  
Robert McCarthy ◽  
Rekha Reddy ◽  
Kamran Forghani ◽  
Andy Xie ◽  
...  
Keyword(s):  

2003 ◽  
Vol 783 ◽  
Author(s):  
Alex Katsnelson ◽  
Vadim Tokranov ◽  
Michael Yakimov ◽  
Serge Oktyabrsky

ABSTRACTA method for hybrid integration of III-V optoelectronic components on Si substrate using BCB was demonstrated. The method included bonding, selective wet etching of the GaAs substrate, components separation by wet etching, two-level metallization and lateral oxidation to form optical apertures. Simulations of thermal behavior and mechanical stresses of this integration scheme were performed using finite element analysis, which revealed adequate heat dissipation. Simulations show that this bonding protocol allows reduction of overheating and mechanical stress that enhances the optoelectronic device performance and increases reliability. Electro-luminescence spectrum, I-V and P-T characteristics were measured and compared with a reference homoepitaxial structure and the results of the simulations. Measured thermal impedance was found to be less then two times higher than that for the devices on a host GaAs wafer. Novel method of substrate removal named oxidation lift-off was proposed and demonstrated. This process allows to release a VCSEL structure with epitaxial DBRs and separate individual components on Si, reduces the number of process steps and eventually reduces cost of the fabricated devices. Au/Ge alloy was used for the metal bonding of the test oxidation lift-off structure. Substrate removal, device separation, bonding and formation of the oxide apertures were done within a single processing step.


2021 ◽  
Vol 42 (4) ◽  
pp. 509-512
Author(s):  
Yang Liu ◽  
Lai Wang ◽  
Yuantao Zhang ◽  
Xin Dong ◽  
Xiankai Sun ◽  
...  
Keyword(s):  

Author(s):  
Andres M. Cardenas-Valencia ◽  
David P. Fries ◽  
Larry C. Langebrake ◽  
Robert F. Benson

The need for efficient metering control of liquids in small devices has led to a boom in the advent of different micro-fluidic actuation mechanisms. Here we present a brief study on a thermal-pneumatic actuation mechanism for an on-demand delivery of minute amounts of liquids. A closely coupled, iterative design-fabrication strategy is used for optimization of a system in which no freely moving membranes are included. Special consideration was given to the heating device, minimizing the energy consumed. The fabrication method and performance of two types of fabricated resistors are compared herein. The first, a conventional Nickel-Chromium resistor using, lift-off micro-fabrication techniques, was initially tested. The second, a Copper cladded liquid crystal polymer in conjunction with a novel mask-less patterning system was used to produce nonconventional heating micro-ohmic heaters. The heating efficiency was proven to be superior using the latter approach. Various micro-fabricated fluidic devices have been designed as case studies and have been fabricated and integrated using a variety of materials to illustrate the functionality of the approach. The combination of design and fabrication steps, the simplicity of the resistive device, and the materials selected combined, yield a direct path to making fluidic transport devices for micro-analytical and power systems.


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