Integration of III-V Optoelectronic Components on Si Platform

2003 ◽  
Vol 783 ◽  
Author(s):  
Alex Katsnelson ◽  
Vadim Tokranov ◽  
Michael Yakimov ◽  
Serge Oktyabrsky
Keyword(s):  
Heat Dissipation ◽  
Optoelectronic Device ◽  
Wet Etching ◽  
Integration Scheme ◽  
Thermal Impedance ◽  
Components Separation ◽  
Element Analysis ◽  
Substrate Removal ◽  
Lateral Oxidation ◽  
Lift Off

ABSTRACTA method for hybrid integration of III-V optoelectronic components on Si substrate using BCB was demonstrated. The method included bonding, selective wet etching of the GaAs substrate, components separation by wet etching, two-level metallization and lateral oxidation to form optical apertures. Simulations of thermal behavior and mechanical stresses of this integration scheme were performed using finite element analysis, which revealed adequate heat dissipation. Simulations show that this bonding protocol allows reduction of overheating and mechanical stress that enhances the optoelectronic device performance and increases reliability. Electro-luminescence spectrum, I-V and P-T characteristics were measured and compared with a reference homoepitaxial structure and the results of the simulations. Measured thermal impedance was found to be less then two times higher than that for the devices on a host GaAs wafer. Novel method of substrate removal named oxidation lift-off was proposed and demonstrated. This process allows to release a VCSEL structure with epitaxial DBRs and separate individual components on Si, reduces the number of process steps and eventually reduces cost of the fabricated devices. Au/Ge alloy was used for the metal bonding of the test oxidation lift-off structure. Substrate removal, device separation, bonding and formation of the oxide apertures were done within a single processing step.

DESIGN AND THERMAL ANALYSIS OF BRAKE ROTOR WITH DIFFERENT MATERIALS

2020 ◽  
Vol 15 (2) ◽  
Author(s):  
Sugunarani S ◽  
Santhosh V
Keyword(s):  
Temperature Distribution ◽  
Heat Dissipation ◽  
Brake Disc ◽  
Element Analysis ◽  
Analysis Techniques ◽  
Engineering Software ◽  
The Finite Element Analysis ◽  
Brake Rotor ◽  
Grey Cast ◽  
Aluminium Metal

This work deals with the analysis of heat generation and dissipation in the disc brake of a car during braking and the following release period by using computer-aided engineering software for three different materials of the rotor disc and brake pad. The objective of this work is to analyze the temperature distribution of rotor disc during operation using COMSOL Multiphysics. The work uses the finite element analysis techniques to calculate and predict the temperature distribution on the brake disc and to identify the critical temperature of the brake rotor disc. Conduction, convection and radiation of heat transfer have been analyzed. The results obtained from the analysis indicates that different material on the same retardation of the car during braking shows different temperature distribution. A comparative study was made between grey cast iron (GCI), Aluminium Metal Matrix Composite (AMMC), Alloy steel materials are used for brake disc and the best material for making brake disc based on the rate of heat dissipation have been suggested.

Fabrication on n-Ga2O3/p-GaN diode by wet-etching lift-off and transfer-print

2021 ◽  
Author(s):  
Yang Liu ◽  
Lai Wang ◽  
Yuantao Zhang ◽  
Xin Dong ◽  
Zhibiao Hao ◽  
...  
Keyword(s):  
Wet Etching ◽  
Lift Off

scholarly journals On Hydromechanical Interaction during Propagation of Localized Damage in Rocks

Minerals ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 162
Author(s):  
A.A. Jameei ◽  
S. Pietruszczak
Keyword(s):  
Numerical Study ◽  
Fluid Pressure ◽  
Implicit Time ◽  
Integration Scheme ◽  
Internal Length ◽  
Element Analysis ◽  
Equivalent Permeability ◽  
Mechanical Coupling ◽  
Splitting Test ◽  
Localized Damage

This paper provides a mathematical description of hydromechanical coupling associated with propagation of localized damage. The framework incorporates an embedded discontinuity approach and addresses the assessment of both hydraulic and mechanical properties in the region intercepted by a fracture. Within this approach, an internal length scale parameter is explicitly employed in the definition of equivalent permeability as well as the tangential stiffness operators. The effect of the progressive evolution of damage on the hydro-mechanical coupling is examined and an evolution law is derived governing the variation of equivalent permeability with the continuing deformation. The framework is verified by a numerical study involving 3D simulation of an axial splitting test carried out on a saturated sample under displacement and fluid pressure-controlled conditions. The finite element analysis incorporates the Polynomial-Pressure-Projection (PPP) stabilization technique and a fully implicit time integration scheme.

scholarly journals High-Power GaN-Based Vertical Light-Emitting Diodes on 4-Inch Silicon Substrate

Nanomaterials ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 1178 ◽  
Author(s):  
Qiang Zhao ◽  
Jiahao Miao ◽  
Shengjun Zhou ◽  
Chengqun Gui ◽  
Bin Tang ◽  
...  
Keyword(s):  
High Power ◽  
Silicon Substrate ◽  
Flip Chip ◽  
Heat Dissipation ◽  
Light Emitting Diodes ◽  
Light Output ◽  
Current Spreading ◽  
Light Emitting ◽  
Fabry Perot ◽  
Lift Off

We demonstrate high-power GaN-based vertical light-emitting diodes (LEDs) (VLEDs) on a 4-inch silicon substrate and flip-chip LEDs on a sapphire substrate. The GaN-based VLEDs were transferred onto the silicon substrate by using the Au–In eutectic bonding technique in combination with the laser lift-off (LLO) process. The silicon substrate with high thermal conductivity can provide a satisfactory path for heat dissipation of VLEDs. The nitrogen polar n-GaN surface was textured by KOH solution, which not only improved light extract efficiency (LEE) but also broke down Fabry–Pérot interference in VLEDs. As a result, a near Lambertian emission pattern was obtained in a VLED. To improve current spreading, the ring-shaped n-electrode was uniformly distributed over the entire VLED. Our combined numerical and experimental results revealed that the VLED exhibited superior heat dissipation and current spreading performance over a flip-chip LED (FCLED). As a result, under 350 mA injection current, the forward voltage of the VLED was 0.36 V lower than that of the FCLED, while the light output power (LOP) of the VLED was 3.7% higher than that of the FCLED. The LOP of the FCLED saturated at 1280 mA, but the light output saturation did not appear in the VLED.

Surface Preparations Impact on 248nm Deep UV Photo Resists Adhesion during a Wet Etch

2012 ◽  
Vol 195 ◽  
pp. 58-61 ◽  
Author(s):  
Mathieu Foucaud ◽  
Philippe Garnier ◽  
Vincent Joseph ◽  
Erwine Pargon ◽  
Névine Rochat ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Plasma Etching ◽  
Integration Scheme ◽  
Metal Gate ◽  
Covalent Bonds ◽  
Gate Oxides ◽  
Process Step ◽  
High K ◽  
Lift Off ◽  
Wet Etch

Integrated circuits manufacturing still requires several wet etching operations in presence of photo resist. They are usually used to define the gate oxides or metal in a high k metal gate, gate first integration scheme. During this process step, the resist is used for masking and prevents the underneath material from being etched away. Wet treatments are preferred to plasma etching to perform this operation. Indeed, a smooth channels surface is mandatory to obtain a high carriers mobility. It is then critical to avoid any resist lift-off during the wet treatment in order to guarantee the underlying layers integrity. The observation of the lift-off phenomenon (figure 1) points out two possible root causes: 1) a lateral degradation of the covalent bonds at the interface between the polymer and the underlying material, and 2) a vertical resist degradation, due to the penetration of the etching chemicals into the resist down to the underlying material. Previous observations tend to link the lift-off severity to the bake temperature and the oxidation state of the surface on which the resist is coated.

scholarly journals Modeling and Simulating the Static Structural Response and Lift Off of a Preloaded Bolted Joint on a Flange

Proceedings ◽  
2020 ◽  
Vol 63 (1) ◽  
pp. 10
Author(s):  
Rami Alfattani
Keyword(s):  
Structural Response ◽  
Segment Length ◽  
Bolted Joint ◽  
Element Analysis ◽  
Linear Finite Element ◽  
Bolt Preload ◽  
Gap Opening ◽  
Parametric Studies ◽  
Contact Surfaces ◽  
Lift Off

The present paper describes the structural analysis performed on a preloaded bolted joint. The first joint modeled was comprised of a conventional cylindrical flange that was sliced to simplify the analysis for two bolts in lieu of four. This involved an L-shaped flat segment flange. Parametric studies were performed using elastic, large-deformation, non-linear finite element analysis to determine the influence of several factors on the bolted-joint response. The factors considered included bolt preload, contact surfaces, edge boundary conditions, and joint segment length in this first approach. The second model applied the previous preloaded torque on a complex flange to study the flange lift off. Joint response is reported in terms of displacements, gap opening, and surface strains. Most of the factors studied were determined to have minimal effect on the bolted joint response.

Heat Dissipation and Temperature Distribution of Brake Liner Using Steady State Analysis

2012 ◽  
Vol 249-250 ◽  
pp. 712-717
Author(s):  
M.P. Natarajan ◽  
B. Rajmohan
Keyword(s):  
Heat Dissipation ◽  
Friction Material ◽  
Automotive Application ◽  
Element Analysis ◽  
Slowing Down ◽  
Drum Brake ◽  
The Coefficient Of Friction ◽  
Machine Elements ◽  
Braking Process ◽  
Good Agreement

Brakes are machine elements that absorb kinetic energy in the process of slowing down or stopping a moving part. Brake capacity depends upon the unit pressure between the braking surfaces, the coefficient of friction, and the ability of the brake to dissipate heat equivalent to the energy being absorbed. In braking system, drum brake is used mostly for automotive application. During the braking process, the forces and pressures in a drum brake are difficult to determine because of the manner in which the shoe contacts the drum. Finite Element analysis has been used to predict interface temperatures and heat flows and the results have been compared with experimental measurements made using fine thermocouples. Good agreement has been achieved, showing that the proportion of heat which flows into the friction material varies with time and temperature.

Bump Electromigration and Back End Design Rules

2007 ◽  
Author(s):  
Vishal Nagaraj ◽  
Saket Karajgikar ◽  
Dereje Agonafer ◽  
Senol Pekin
Keyword(s):  
Flip Chip ◽  
Heat Dissipation ◽  
High Current Density ◽  
Electrical Performance ◽  
High Current ◽  
Current Crowding ◽  
Element Analysis ◽  
Chip Technology ◽  
Flip Chip Packaging ◽  
Current Densities

As there is continuous demand for miniaturization of electronic devices, flip chip technology is predominantly used for high density packaging. The technology offers several advantages like excellent electrical performance and better heat dissipation ability. Original invention of flip chip packaging utilized ceramic substrates and high lead bumps. Low cost commercialization of this packaging technology, however, required organic laminate substrates coupled with SnPb eutectic bumped interconnects on the die side. While organic laminate flip chip packaging may be a good option for many low power applications, current carrying capability of the eutectic bumped interconnect causes a catastrophic failure mechanism called electromigration. Previously, researchers have identified and addressed few issues regarding electromigration. Electomigration leads to the formation of metal voids in the conductors which eventually increases the resistance drop across the conductor causing electrical opens. Electromigration is very significant at high current densities. Temperature is the other parameter of concern for electromigration. High current density causes temperature to rise due to Joule heating, there by reducing the life of package. In order to determine the factors responsible for high current densities, we formed a full factorial design of experiments (DOE) that contained parameters such as passivation opening, UBM size, UBM thickness and trace width. Finite Element Analysis (FEA) was performed in order to study the effect of above parameters on current crowding and temperature in the bumped interconnects. Based on the results, hierarchy of the most important parameters to be considered while selecting the appropriate flip chip technology is proposed.

Design of a Massively Reconfigurable Origami Space Structure Incorporating Shape Memory Alloys

2012 ◽  
Author(s):  
Darren Hartl ◽  
Kathryn Lane ◽  
Richard Malak
Keyword(s):  
Shape Memory ◽  
Three Dimensional ◽  
Passive Layer ◽  
Space Structure ◽  
Integration Scheme ◽  
Cylindrical Shape ◽  
Material System ◽  
Analysis Model ◽  
Element Analysis ◽  
Design Assessment

The subject of origami design has recently garnered increasing attention from the science, mathematics, and engineering communities. Mathematically rigorous frameworks have been developed that allow the identification of folding patterns needed to obtain a final three-dimensional goal shape. However, relatively little research exists on the problem of understanding the behavioral aspects of the material system undergoing the folding operations. This work considers the design and analysis of a novel concept for a self-folding material system. The system consists of an active, self-morphing laminate structure that includes thermally actuated shape memory alloy (SMA) layers and a compliant passive layer. Multiple layers allow folds in both directions (e.g., cross-folds). The layers are configured to allow continuously variable folding operations based only on which regions are heated. For the purposes of demonstration, an example problem is considered whereby an autonomous planetary landing craft is designed that can be stored in a flat sheet configuration, morph using a set of folds into a stable shape for safe descent through a gaseous atmosphere, and then, once landed, morph again toward a cylindrical shape for the purpose of rolling locomotion. We examine the effects of fold width, layer thicknesses, and activation parameters on the geometric configurations that can be obtained. The design efforts are supported by realistic morphing structural analysis tools. These include a comprehensive and accurate three-dimensional constitutive model for SMAs implemented into a finite element analysis (FEA) framework (the Abaqus Unified FEA suite) using a robust and efficient numerical integration scheme. Shell elements and laminate theory are used to increase the computational efficiency of the analysis. Model pre-processing, submission, and post-processing scripting methods are used to automate the design assessment tasks.

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