Compact Modeling of the I-V Characteristics of ZnO Nanowires Including Nonlinear Series Resistance Effects

2020 ◽  
Vol 19 ◽  
pp. 297-300 ◽  
Author(s):  
Enrique Miranda ◽  
Gianluca Milano ◽  
Carlo Ricciardi
2021 ◽  
Vol 130 (5) ◽  
pp. 054503
Author(s):  
D. Maldonado ◽  
F. Aguirre ◽  
G. González-Cordero ◽  
A. M. Roldán ◽  
M. B. González ◽  
...  

Mathematics ◽  
2021 ◽  
Vol 9 (17) ◽  
pp. 2159
Author(s):  
María José Ibáñez ◽  
Domingo Barrera ◽  
David Maldonado ◽  
Rafael Yáñez ◽  
Juan Bautista Roldán

An advanced new methodology is presented to improve parameter extraction in resistive memories. The series resistance and some other parameters in resistive memories are obtained, making use of a two-stage algorithm, where the second one is based on quasi-interpolation on non-uniform partitions. The use of this latter advanced mathematical technique provides a numerically robust procedure, and in this manuscript, we focus on it. The series resistance, an essential parameter to characterize the circuit operation of resistive memories, is extracted from experimental curves measured in devices based on hafnium oxide as their dielectric layer. The experimental curves are highly non-linear, due to the underlying physics controlling the device operation, so that a stable numerical procedure is needed. The results also allow promising expectations in the massive extraction of new parameters that can help in the characterization of the electrical device behavior.


Author(s):  
N. David Theodore ◽  
Juergen Foerstner ◽  
Peter Fejes

As semiconductor device dimensions shrink and packing-densities rise, issues of parasitic capacitance and circuit speed become increasingly important. The use of thin-film silicon-on-insulator (TFSOI) substrates for device fabrication is being explored in order to increase switching speeds. One version of TFSOI being explored for device fabrication is SIMOX (Silicon-separation by Implanted OXygen).A buried oxide layer is created by highdose oxygen implantation into silicon wafers followed by annealing to cause coalescence of oxide regions into a continuous layer. A thin silicon layer remains above the buried oxide (~220 nm Si after additional thinning). Device structures can now be fabricated upon this thin silicon layer.Current fabrication of metal-oxidesemiconductor field-effect transistors (MOSFETs) requires formation of a polysilicon/oxide gate between source and drain regions. Contact to the source/drain and gate regions is typically made by use of TiSi2 layers followedby Al(Cu) metal lines. TiSi2 has a relatively low contact resistance and reduces the series resistance of both source/drain as well as gate regions


Author(s):  
M. Kasemann ◽  
L.M. Reindl ◽  
B. Michl ◽  
W. Warta ◽  
A. Schütt ◽  
...  

Abstract Conventional series resistance imaging methods require electrical contacts for current injection or extraction in order to generate lateral current flow in the solar cell. This paper presents a new method to generate lateral current flow in the solar cell without any electrical contacts. This reduces the sample handling complexity for inline application and allows for measurements on unfinished solar cell precursors.


2017 ◽  
Vol 9 (2) ◽  
pp. 02018-1-02018-3
Author(s):  
M. R. Panasiuk ◽  
◽  
B. I. Turko ◽  
L. R. Toporovska ◽  
V. B. Kapustianyk ◽  
...  

2020 ◽  
Author(s):  
Jui-Yuan Chen ◽  
Min-Ci Wu ◽  
Yi-Hsin Ting ◽  
Wei-Che Lee ◽  
Ping-Hung Yeh ◽  
...  
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