A Customized Integrated Circuit for Active EMI Filter with High Reliability and Scalability

2021 ◽  
pp. 1-1
Author(s):  
Sangyeong Jeong ◽  
Junsik Park ◽  
Jingook Kim
Keyword(s):  
Integrated Circuit ◽  
High Reliability ◽  
Emi Filter

Aluminum Reflow Sputtering

MRS Bulletin ◽  
1995 ◽  
Vol 20 (11) ◽  
pp. 53-56 ◽  
Author(s):  
Kuniko Kikuta
Keyword(s):  
Integrated Circuit ◽  
High Speed ◽  
Lower Cost ◽  
High Reliability ◽  
Device Fabrication ◽  
Damascene Process ◽  
Aspect Ratios ◽  
Multi Level ◽  
Poor Adhesion ◽  
Lower Resistivity

The scaling of integrated-circuit device dimensions in the horizontal direction has caused an increase in aspect ratios of contact holes and vias without a corresponding scaledown in vertical dimensions. Conventional sputtering has become unreliable for handling higher aspect-ratio via/contact holes because of its poor step coverage. Several studies have attempted to overcome this problem by using W-CVD and reflow technology. The W-CVD is used for practical device fabrications. However, this technique has several problems such as poor adhesion to SiO2, poor W surface morphology, greater resistivity than Al, and the need of an etch-back process.Al reflow technology using a conventional DC magnetron sputtering system can simplify device-fabrication processes and achieve high reliability without Al/W interfaces. In particular, the Al reflow technology is profitable for multi-level interconnections in combination with a damascene process by using Al chemical mechanical polishing (CMP). These interconnections are necessary for miniaturized and high-speed devices because they provide lower resistivity than W and simplify fabrication processes, resulting in lower cost.This article describes recent Al reflow sputtering technologies as well as application of via and interconnect metallization.

Simple Methods for Design of Narrowband High-Pass FIR Filters

2005 ◽  
pp. 2492-2498
Author(s):  
Gordana Jovanovic-Dolecek
Keyword(s):  
Integrated Circuit ◽  
High Reliability ◽  
Low Cost ◽  
Rapid Development ◽  
Digital Signal ◽  
Fir Filters ◽  
Integrated Circuit Fabrication ◽  
Circuit Fabrication ◽  
Analog Systems ◽  
High Pass

Digital signal processing (DSP) is an area of engineering that “has seen explosive growth during the past three decades” (Mitra, 2001). Its rapid development is a result of significant advances in digital computer technology and integrated circuit fabrication (Smith, 2002; Jovanovic-Dolecek, 2002). Diniz, Silva, and Netto (2002) state that “the main advantages of digital systems relative to analog systems are high reliability, suitability for modifying the system’s characteristics, and low cost.”

Reliability Research on Measurement System for Downhole Storage Pressure Gauge

2013 ◽  
Vol 345 ◽  
pp. 516-520
Author(s):  
Heng Wu ◽  
Yong Peng ◽  
Li Ping Wang
Keyword(s):  
Hydraulic Fracturing ◽  
Integrated Circuit ◽  
High Reliability ◽  
Pressure Gauge ◽  
High Strength ◽  
Vibration Resistance ◽  
Logic Diagram ◽  
In Series ◽  
Working Principle ◽  
Mean Time

Downhole storage pressure gauge should meet the requirements of high strength, high temperature resistance, vibration resistance, and high reliability when hydraulic fracturing. Downhole storage pressure gauge has been designed. Based on the working principle, the logic diagram for reliable analysis has been built, which has been connected by five units in series. With the modules of electronic component and integrated circuit, the operating failure rates of the five units have been calculated. The reliability and Mean Time Between Failure of downhole storage pressure gauge have been obtained. The high reliability of the downhole storage pressure gauge can satisfy the measuring demand for pressure and temperature when hydraulic fracturing.

Capacitive touch sensor

2018 ◽  
Vol 35 (3) ◽  
pp. 153-157 ◽  
Author(s):  
Samuel Zuk ◽  
Alena Pietrikova ◽  
Igor Vehec
Keyword(s):  
Response Time ◽  
Integrated Circuit ◽  
High Reliability ◽  
High Sensitivity ◽  
Mechanical Resistance ◽  
Content Type ◽  
Short Response Time ◽  
Sensing Range ◽  
Touch Sensor ◽  
Mechanical Switch

Purpose The purpose of this paper is to analyse the possibilities of mechanical switch replacement by capacitive film touch sensor in applications requiring high reliability and short response time. Advantage of replacing mechanical switch by capacitive touch sensor is no mechanical wear and possible implementation of sensor in application where the switch could not be used or where the flexibility of the sensor substrate is required. The aim of this work is to develop a capacitive touch sensor with the advantage of maximum mechanical resistance, short response time and high sensitivity. Design/methodology/approach Based on various possible sensors layouts, the authors realized 18 different (14 self-capacitance and four mutual capacitance) topologies of capacitive sensor for touch applications. Three different technologies – PCB, LTCC and polymer technology – were used to characterize sensor’s behaviour. For precise characterization of different layouts realized on various substrates, the authors used integrated circuit FDC2214 capacitance-to-digital converter. Findings Sensing range of the capacitive touch (proximity) sensor is affected by the per cent of area covered by the sensor, and it does not depend on topology of sensor. The highest sensing range offers PCB technology. Flexible substrates can be used as proper substituent to rigid PCB. Originality/value The novelty of this work lies in finding the touch capacitive sensors that allow shorter switching times compared to standard mechanical switches.

scholarly journals Improvement on Fully Filled Through Silicon Vias by Optimized Sputtering and Electroplating Conditions

Materials ◽  
2019 ◽  
Vol 12 (22) ◽  
pp. 3713 ◽  
Author(s):  
Fei Zhao
Keyword(s):  
Electron Microscope ◽  
Integrated Circuit ◽  
Seed Layer ◽  
High Reliability ◽  
Through Silicon Vias ◽  
X Ray ◽  
Layer Structures ◽  
Silicon Vias ◽  
Scanning Electron

The high reliability of electroplating through silicon vias (TSVs) is an attractive hotspot in the application of high-density integrated circuit packaging. In this paper, improvements for fully filled TSVs by optimizing sputtering and electroplating conditions were introduced. Particular attention was paid to the samples with different seed layer structures. These samples were fabricated by different sputtering and treatment approaches, and accompanied with various electroplating profile adjustments. The images were observed and characterized by X-ray equipment and a scanning electron microscope (SEM). The results show that optimized sputtering and electroplating conditions can help improve the quality of TSVs, which could be interpreted as the interface effect of the TSV structure.

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