RFIC and RF Module for 5G Applications

Abstract Light is a propagation of electromagnetic waves that spread all directions that play an important role in everyday life because it is an absolute part of life and without the light of life on earth can not develop. The amount of light illuminance is necessary to know because basically humans require adequate lighting. The instrument for measuring light illuminance is a luxmeter or light meter. However, this gauge is difficult to obtain and the price of the tool is expensive so that it can only be found in certain school laboratories or colleges. While telemetry is the process of measuring the parameters of an object (objects, space, natural conditions) that the measurement results are transmitted to other places via data transmission without or using a cable (wireless). The purpose of this study is to measure, to know the conditions of light intensity. This research uses experimental model of light intensity measurement using independent measuring instrument with combination of LDR and Arduino uno consisting of transmitter and receiver. In the transmitter there are LDR, Arduino Uno, and RF Module Board 433 MHz components, while the receiver consists of Arduino Uno, laptop, and RF Module Board 433 MHz. In this design is also done a variety of testing tools using distance variables. Overall this tool is working well. The system has successfully delivered telemetry measurement results with a range of conditions without a wall barrier with a maximum distance of <28 m. And conditions there are obstacles diding with a maximum distance <13.2.

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Thermal resistance analysis for a high power 3D integrated RF Module based on TSV interposer

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc47984.2019.9026586 ◽

2019 ◽

Author(s):

Xinxin Hu ◽

Bin Zhou ◽

Shenglin Ma ◽

Dan Gong ◽

Mengcheng Wang ◽

...

Keyword(s):

Thermal Resistance ◽

High Power ◽

Resistance Analysis ◽

Rf Module

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Efficient Modeling of DC-RF module of Space Solar Power Satellite with Improved Antenna design and Metasurface

2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS) ◽

10.1109/comcas44984.2019.8958029 ◽

2019 ◽

Author(s):

Amit Kumar Baghel ◽

Shashank Satish Kulkarni ◽

Sisir Kumar Nayak

Keyword(s):

Solar Power ◽

Antenna Design ◽

Space Solar Power ◽

Rf Module ◽

Efficient Modeling

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MEMS above IC technology applied to a compact RF module (Keynote Paper)

10.1117/12.609383 ◽

2005 ◽

Author(s):

K. Grenier ◽

L. Mazenq ◽

D. Dubuc ◽

E. Ojefors ◽

P. Lindberg ◽

...

Keyword(s):

Keynote Paper ◽

Rf Module ◽

Ic Technology

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Modeling Strategy in Evaluating Thermal Performance of an RF Module for Wireless Communications

Heat Transfer, Volume 2 ◽

10.1115/imece2004-62077 ◽

2004 ◽

Cited By ~ 2

Author(s):

Victor Chiriac ◽

Tien-Yu Tom Lee

Keyword(s):

Thermal Performance ◽

Thermal Characteristics ◽

Simulation Models ◽

Operating Conditions ◽

Peak Temperature ◽

Load Cells ◽

Die Temperature ◽

Rf Module ◽

Modeling Strategy ◽

The Impact

A detailed study was performed to evaluate the thermal performance of RF Modules and to identify meaningful correlations between specific design characteristics and the power dissipation needed to satisfy the required thermal budget under various critical operating conditions. The investigation focuses on the thermal characteristics of the RF module die layout and transistor cells, and on the thermal impact of the metallic air bridges connecting the load cells to the collector pads/vias to the overall thermal performance of the RF module. A first-pass modeling predicts higher temperatures than IR measurement, by ~20–30%. The addition of the die layout air bridges connecting the load cells in the detailed simulation models leads to a predicted air bridge temperature of ~9% higher than the IR measurement. Additional modeling reveals that between the open (not encapsulated) and the closed module, the die peak temperature differs by less than 3 °C, most of the heat being dissipated through the substrate and board to the heat stage. Thus, the impact of mold compound is insignificant. For a closed module, the mold compound helps dissipate the heat, so the die temperature is slightly cooler than for the open module (<<3°C). This suggests that the die peak temperature measured in an open module can be adjusted (by subtracting 2–3°C) to represent the die temperature in a closed module.

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