Design Guideline for Ball Impact Test Apparatus

2006 ◽  
Vol 129 (1) ◽  
pp. 98-104 ◽  
Author(s):  
Chang-Lin Yeh ◽  
Yi-Shao Lai
Keyword(s):  
Impact Test ◽  
Test Apparatus ◽  
Design Guideline ◽  
Ball Impact ◽  
Test Methodology ◽  
Force Profile ◽  
Reliability Of Solder Joints ◽  
Board Level ◽  
Board Level Reliability ◽  
Test Process

The ball impact test is developed as a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. Following classical structural dynamics principles, the ball impact test process is analyzed to provide insights into transient characteristics of this particular test methodology. A design guideline for the ball impact test apparatus based on characteristics of the measured impact force profile is proposed.

Characterizations of Ball Impact Responses of Tin-Silver-Copper Solder Joints Doped With Nickel or Germanium

2007 ◽  
Author(s):  
Yi-Shao Lai ◽  
Jenn-Ming Song ◽  
Hsiao-Chuan Chang ◽  
Ying-Ta Chiu
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
Ball Impact ◽  
Test Methodology ◽  
Surface Finishes ◽  
Reliability Of Solder Joints ◽  
Tin Silver Copper ◽  
Board Level ◽  
Immersion Tin ◽  
Board Level Reliability

The ball impact test (BIT) was developed based on the demand of a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. The BIT itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints under a high-speed shearing load. In this work, we present BIT results conducted at an impact velocity of 500 mm/s on Sn-4Ag-0.5Cu, Sn-1Ag-0.5Cu, Sn-1Ag-0.5Cu-0.05Ni, Sn-1.2Ag-0.5Cu-0.05Ni, and Sn-1Ag-0.5Cu-0.05Ge package-level solder joints, bonded on substrate pads of immersion tin (IT) and direct solder on pad (DSOP) surface finishes. Differences of BIT results with respect to multi-reflow are also reported.

Empirical correlation between package-level ball impact test and board-level drop reliability

2007 ◽  
Vol 47 (7) ◽  
pp. 1127-1134 ◽  
Author(s):  
Chang-Lin Yeh ◽  
Yi-Shao Lai ◽  
Hsiao-Chuan Chang ◽  
Tsan-Hsien Chen
Keyword(s):  
Impact Test ◽  
Empirical Correlation ◽  
Ball Impact ◽  
Board Level

Board Level Reliability of Automotive Grade WLCSP for Radar Applications

2020 ◽  
Author(s):  
Nishant Lakhera ◽  
Burt Carpenter ◽  
Trung Duong ◽  
Mollie Benson ◽  
Andrew J Mawer
Keyword(s):  
Radar Applications ◽  
Board Level ◽  
Board Level Reliability
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