Studying of fracture joint failure mechanism on board level reliability test process comparing between SnPb and Sn lead finished ICs

2004 ◽  
Author(s):  
N. Kongtongnok ◽  
S. Anuntapong
Keyword(s):  
Failure Mechanism ◽  
Reliability Test ◽  
Joint Failure ◽  
Board Level ◽  
Board Level Reliability ◽  
Test Process

A study of board level reliability test with bump structure of WLCSP lead-free solder joints

2007 ◽  
Author(s):  
Frank Kao ◽  
Zhi Hao Tseng ◽  
Chun Sheng Ho ◽  
Stan Chen ◽  
Chang-Yi Lan ◽  
...  
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Reliability Test ◽  
Lead Free Solder ◽  
Free Solder ◽  
Board Level ◽  
Board Level Reliability

Design Guideline for Ball Impact Test Apparatus

2006 ◽  
Vol 129 (1) ◽  
pp. 98-104 ◽  
Author(s):  
Chang-Lin Yeh ◽  
Yi-Shao Lai
Keyword(s):  
Impact Test ◽  
Test Apparatus ◽  
Design Guideline ◽  
Ball Impact ◽  
Test Methodology ◽  
Force Profile ◽  
Reliability Of Solder Joints ◽  
Board Level ◽  
Board Level Reliability ◽  
Test Process

The ball impact test is developed as a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. Following classical structural dynamics principles, the ball impact test process is analyzed to provide insights into transient characteristics of this particular test methodology. A design guideline for the ball impact test apparatus based on characteristics of the measured impact force profile is proposed.

Board level reliability test of MPBGA assembly

2003 ◽  
Author(s):  
Chi-Sheng Chung ◽  
P.J. Zheng ◽  
S.C. Lee ◽  
J.D. Wu
Keyword(s):  
Reliability Test ◽  
Board Level ◽  
Board Level Reliability

Study on the Board Level Reliability Test of Package on Package (PoP) with 2nd Level Underfill

2007 ◽  
Author(s):  
Joon-Yeob Lee ◽  
Tae-Kyung Hwang ◽  
Jin-Young Kim ◽  
Min Yoo ◽  
Eun-Sook Sohn ◽  
...  
Keyword(s):  
Reliability Test ◽  
Board Level ◽  
Board Level Reliability

Board Level Reliability of Automotive Grade WLCSP for Radar Applications

2020 ◽  
Author(s):  
Nishant Lakhera ◽  
Burt Carpenter ◽  
Trung Duong ◽  
Mollie Benson ◽  
Andrew J Mawer
Keyword(s):  
Radar Applications ◽  
Board Level ◽  
Board Level Reliability

Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing

2006 ◽  
Vol 15-17 ◽  
pp. 633-638 ◽  
Author(s):  
Jong Woong Kim ◽  
Hyun Suk Chun ◽  
Sang Su Ha ◽  
Jong Hyuck Chae ◽  
Jin Ho Joo ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Lead Frame ◽  
Shear Forces ◽  
Microstructural Investigation ◽  
Shock Testing ◽  
Ceramic Capacitor ◽  
Board Level ◽  
Board Level Reliability ◽  
Thermal Shocks

Board-level reliability of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu solder joints was evaluated using thermal shock testing. In the microstructural investigation of the solder joints, the formation of Cu6Sn5 intermetallic compound (IMC) layer was observed between both solders and Cu lead frame, but any crack or newly introduced defect cannot be found even after 2000 cycles of thermal shocks. Shear test of the multi layer ceramic capacitor (MLCC) joints were also conducted to investigate the effect of microstructural variations on the bonding strength of the solder joints. Shear forces of the both solder joints decreased with increasing thermal shock cycles. The reason to the decrease in shear force was discussed with fracture surfaces of the shear tested solder joints.

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

2012 ◽  
Vol 134 (4) ◽  
Author(s):  
D. N. Borza ◽  
I. T. Nistea
Keyword(s):  
Solder Joint ◽  
Fundamental Frequency ◽  
Printed Circuit Board ◽  
Speckle Interferometry ◽  
Circuit Board ◽  
Joint Failure ◽  
Printed Circuit ◽  
Out Of Plane ◽  
Fringe Patterns ◽  
Board Level

Reliability of electronic assemblies at board level and solder joint integrity depend upon the stress applied to the assembly. The stress is often of thermomechanical or of vibrational nature. In both cases, the behavior of the assembly is strongly influenced by the mechanical boundary conditions created by the printed circuit board (PCB) to casing fasteners. In many previously published papers, the conditions imposed to the fasteners are mostly aiming at an increase of the fundamental frequency and a decrease of static or dynamic displacement values characterizing the deformation. These conditions aim at reducing the fatigue in different parts of these assemblies. In the photomechanics laboratory of INSA Rouen, the origins of solder joint failure have been investigated by means of full-field measurements of the flexure deformation induced by vibrations or by forced thermal convection. The measurements were done both at a global level for the whole printed circuit board assembly (PCBA) and at a local level at the solder joints where failure was reported. The experimental technique used was phase-stepped laser speckle interferometry. This technique has a submicrometer sensitivity with respect to out-of-plane deformations induced by bending and its use is completely nonintrusive. Some of the results were comforted by comparison with a numerical finite elements model. The experimental results are presented either as time-average holographic fringe patterns, as in the case of vibrations, or as wrapped phase patterns, as in the case of deformation under thermomechanical stress. Both types of fringe patterns may be processed so as to obtain the explicit out-of-plane static deformation (or vibration amplitude) maps. Experimental results show that the direct cause of solder joint failure may be a high local PCB curvature produced by a supplementary fastening screw intended to reduce displacements and increase fundamental frequency. The curvature is directly responsible for tensile stress appearing in the leads of a large quad flat pack (QFP) component and for shear in the corresponding solder joints. The general principle of increasing the fundamental frequency and decreasing the static or dynamic displacement values has to be checked against the consequences on the PCB curvature near large electronic devices having high stiffness.

Use-Conditions-Based Board Level Shock Test Development for Handheld Components

2004 ◽  
Author(s):  
Shubhada Sahasrabudhe ◽  
Vinayak Pandey ◽  
Betty Phillips ◽  
Kang Joon Lee ◽  
Lei Mercado
Keyword(s):  
Solder Joint ◽  
Cell Phone ◽  
Standardized Test ◽  
Test Development ◽  
Failure Mechanisms ◽  
Reliability Test ◽  
Shock Test ◽  
Board Level ◽  
Test Repeatability

For handheld electronic applications such as cell phones and Personal Digital Assistants (PDAs), drop/impact could result in considerable flexure of the printed circuit board (PCB) mounted inside the cell phone housing. The mechanical stresses may cause electrical failure of the components, with typical failure mechanisms of board trace cracking, solder joint fatigue, and solder pad cracking. A standardized test needs to be developed to assess reliability of handheld components subjected to impacts. The test should facilitate high volume testing, maximize margin for safety factors, and capture the failure mechanisms in the field environment. To develop the reliability test using use conditions based reliability methodology, comprehensive characterization of the mechanical field stresses during end use conditions is particularly essential. This paper discusses complete cell phone drop characterization along with the shock test developed to test the components subjected to such drops. Novel fixtures have been designed to simulate free fall of the cell phone in specific orientations. After the complete characterization of cell phone use conditions, board level shock test has been selected to assess component reliability. Test repeatability, number of components on the test board, and layout of the components are some of the factors considered during the board level shock test development. Several parameters like screw and washer designs, torque have been studied to yield excellent test repeatability. Nonlinear Dynamic Finite Element Simulation has been performed to provide more insight into the interaction of the bending modes and its impact on the solder joint failures. This paper demonstrates the process of understanding use conditions, developing reliability tests, validating test results and driving industry standards.

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