Correlation of Melting Results for Both Pure Substances and Impure Substances

1986 ◽  
Vol 108 (3) ◽  
pp. 649-653 ◽  
Author(s):  
E. M. Sparrow ◽  
G. A. Gurtcheff ◽  
T. A. Myrum

Melting experiments were performed encompassing both pure and impure substances. The pure substances included n-octadecane paraffin and n-eicosane paraffin, while the impure substances were mixtures synthesized from the pure paraffins. The experiments were carried out in a closed vertical tube whose wall was subjected to a step-change increase in temperature to initiate the melting. For each impure substance, supplementary measurements were made of two characteristic temperatures: the temperature T** at which melting of the solid phase first begins and the lowest temperature T* at which the melting can go to completion. For a pure substance, T** = T*. The time-dependent melting results for all the investigated substances, both pure and impure, were well correlated as a function of FoSte**(Gr**)1/8 alone, where the ** signifies the presence of T** in the temperature difference which appears in Ste and Gr. This correlation enables melting rates for impure substances to be determined from melting rates for pure substances. The T** values needed for the implementation of the correlation can be obtained from simple experiments, obviating the need for the complete equilibrium phase diagram.

Materials ◽  
2019 ◽  
Vol 12 (9) ◽  
pp. 1494 ◽  
Author(s):  
Rachman Chaim ◽  
Yaron Amouyal

Reactive flash sintering in oxide systems is analyzed assuming the formation of a liquid film at the particle contacts at the flash onset temperature. Formation of intermediate phases, as well as phase assemblage, are predicted upon optimal conditions of the electric field and current density. In single-phase impure oxides, the solidus and the solubility limit determine the flash onset temperature. In reacting binary systems, the composition of the liquidus determines primarily the reaction products during the cooling. In multicomponent systems, the oxide with the lowest flash temperature forms the interfacial liquid film, and the solid phase assemblage follows the equilibrium phase diagram. Examples from literature are consistent with reactive flash sintering and flash sintering assisted by a transient liquid film.


Metals ◽  
2021 ◽  
Vol 11 (3) ◽  
pp. 461
Author(s):  
Konrad Kosiba ◽  
Konda Gokuldoss Prashanth ◽  
Sergio Scudino

The phase and microstructure formation as well as mechanical properties of the rapidly solidified Mg67Ag33 (at. %) alloy were investigated. Owing to kinetic constraints effective during rapid cooling, the formation of equilibrium phases is suppressed. Instead, the microstructure is mainly composed of oversaturated hexagonal closest packed Mg-based dendrites surrounded by a mixture of phases, as probed by X-ray diffraction, electron microscopy and energy dispersive X-ray spectroscopy. A possible non-equilibrium phase diagram is suggested. Mainly because of the fine-grained dendritic and interdendritic microstructure, the material shows appreciable mechanical properties, such as a compressive yield strength and Young’s modulus of 245 ± 5 MPa and 63 ± 2 GPa, respectively. Due to this low Young’s modulus, the Mg67Ag33 alloy has potential for usage as biomaterial and challenges ahead, such as biomechanical compatibility, biodegradability and antibacterial properties are outlined.


2003 ◽  
Vol 10 (04) ◽  
pp. 677-683 ◽  
Author(s):  
E. B. Hannech ◽  
N. Lamoudi ◽  
N. Benslim ◽  
B. Makhloufi

Intermetallic formation at 425°C in the aluminum–copper system has been studied by scanning electron microscopy using welded diffusion couples. Several Al–Cu phases predicted by the equilibrium phase diagram of the elements and voids taking place in the diffusion zone have been detected in the couples. The predominant phases were found to be Al 2 Cu 3 and the solid solution of Al in Cu, α. The growth of the intermetallic layer obeyed the parabolic law.


Author(s):  
Farida Benmouna ◽  
Abdelylah Daoudi ◽  
Fr�d�rick Roussel ◽  
Jean-Marc Buisine ◽  
Xavier Coqueret ◽  
...  

2018 ◽  
Vol 383 ◽  
pp. 31-35 ◽  
Author(s):  
Alexey Rodin ◽  
Nataliya Goreslavets

The study of diffusion processes in the aluminum - copper system was carried out at the temperature 350 and 520 °C. Special attention was paid on the chemical composition of the system near Al/Cu interface. It was determined that the intermediate phases in the system, corresponding to the equilibrium phase diagram, were not formed at low temperature. At high temperature the intermediate phases forms starting with Cu - rich phases. In both cases supersaturated solid solution of copper in aluminum could be observed near the interface.


2018 ◽  
Vol 20 (3) ◽  
pp. 72-84
Author(s):  
Alexey Korolev ◽  
◽  
Gennagy Maltsev ◽  
Konstantin Timofeev ◽  
Vladimir Lobanov ◽  
...  

2002 ◽  
Vol 18 (09) ◽  
pp. 835-837 ◽  
Author(s):  
Sang Shi-Hua ◽  
◽  
Yin Hui-An ◽  
Tang Ming-Lin ◽  
Zhang Yun-Xiang

2021 ◽  
Vol 1016 ◽  
pp. 1114-1120
Author(s):  
Henryk Paul ◽  
Piotr Bobrowski ◽  
Robert Chulist ◽  
Magdalena M. Miszczyk ◽  
Mariusz Prazmowski

The interplay of various hardening and softening processes during explosive welding and post-processing annealing have been analysed in titanium/copper bimetallic sheets using scanning electron microscopy and microhardness measurements. Severe plastic deformation and intermetallics’ formation are typical processes leading to hardening, whereas dynamic/static recrystallization and the transformation of amorphous phases into crystalline ones lead to softening. In the as-welded state the interfacial layers of both parent sheets are severely deformed. However, they can undergo intense recrystalization in areas near large melted zones. Inside the melted zones a wide variety of chemical compositions can be detected, however, most of the phases do not appear in the Ti-Cu equilibrium phase diagram. The post-processing annealing at 973 K for 1 h leads to full recrystallization of severely deformed layers of parent sheets and transforms the non-equilibrium phases forming melted zone into the equilibrium TiCu4 and Ti3Cu4 ones via spinodal decomposition. Simultaneously, the growth of four intermetallic layers: Ti2Cu, TiCu, Ti3Cu4, TiCu4 situated along the whole interface was detected.


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