Deformation of Polymers During Hydrostatic Extrusion

1978 ◽  
Vol 100 (4) ◽  
pp. 400-405 ◽  
Author(s):  
N. Inoue ◽  
T. Nakayama ◽  
M. Shimono
Keyword(s):  
Atmospheric Pressure ◽  
High Density Polyethylene ◽  
Theoretical Basis ◽  
Superposition Principle ◽  
Amorphous Polymers ◽  
Extrusion Process ◽  
Extrusion Ratio ◽  
Tension Tests ◽  
Effects Of Temperature ◽  
Temperature Time

Crystalline as well as amorphous polymers and a thermosetting resin were hydrostatically extruded with pressures up to 4 kilobars. A linear relation was obtained between the extrusion pressure and extrusion ratio. Temperature of the billets during the extrusion process was determined, along with the flow pattern of the deformation. Tension tests at the temperature, to which the billet was exposed during the extrusion, was carried out at atmospheric pressure on the high-density polyethylene specimen to supply a theoretical basis to the experimental formula. Effects of temperature and strain rate on the extrusion process are discussed in the light of the temperature-time superposition principle.

EFFECTS OF TEMPERATURE-TIME COMBINATIONS ON DONENESS AND YIELDS OF WATER-COOKED BROILER THIGHS

1975 ◽  
Vol 40 (1) ◽  
pp. 129-132 ◽  
Author(s):  
C. E. LYON ◽  
B. G. LYON ◽  
A. A. KLOSE ◽  
J. P. HUDSPETH
Keyword(s):  
Effects Of Temperature ◽  
Temperature Time

Large-area Nanosilver Die-attach by Hot-pressing Below 200°C and 5 MPa

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000129-000134 ◽  
Author(s):  
Kewei Xiao ◽  
Jesus N. Calata ◽  
Hanguang Zheng ◽  
Khai D.T. Ngo ◽  
Guo-Quan Lu
Keyword(s):  
Atmospheric Pressure ◽  
Hot Pressing ◽  
Applied Pressure ◽  
Fractional Factorial ◽  
Maintenance Cost ◽  
Pressing Pressure ◽  
Hot Press ◽  
Large Area ◽  
Die Attach ◽  
Temperature Time

Sintered nanoscale silver joint is an emerging lead-free die-attach solution for high-temperature packaging because of silver's high melting temperature. For bonding small chips, the nanosilver solution can be achieved with a simple heating profile under atmospheric pressure. However, for bonding large-area chips, e.g. > 1 cm2 IGBT chips, uniaxial pressure of a few MPa has been found necessary during the sintering stage of the bonding process, which is carried out at temperatures below 275°C. Hot-pressing at high temperatures can cause significant wear and tear on the processing equipment, resulting in high maintenance cost. In this study, we ran a series of experiments aimed at lowering the hot-pressing temperature. Specifically, we examined a process involving hot-press drying, followed by sintering without any applied pressure. A fractional factorial design of experiments was used to identify the importance and interaction of various processing parameters, such as hot-pressing pressure/temperature/time and sintering temperature/time, on the final bond quality of sintered nanosilver joints. Based on the results, a simpler process, consisting of hot-press drying at 180°C under 3 MPa, followed by sintering at 275°C under atmospheric pressure was found to produce attachments with die-shear strength in excess of 30 MPa.

Effects of Temperature, Time and Composition on Food Oil Surface Tension

2017 ◽  
Vol 12 (1) ◽  
pp. 88-96 ◽  
Author(s):  
Tong Xu ◽  
Veronica Rodriguez-Martinez ◽  
Shreya N. Sahasrabudhe ◽  
Brian E. Farkas ◽  
Stephanie R. Dungan
Keyword(s):  
Surface Tension ◽  
Effects Of Temperature ◽  
Temperature Time

scholarly journals Effects of temperature on nucleation and collapse of volatile bubbles in the high density polyethylene melt

2021 ◽  
Vol 93 ◽  
pp. 106932
Author(s):  
Lei Xu ◽  
Zhengliang Huang ◽  
Yao Yang ◽  
Binbo Jiang ◽  
Jingyuan Sun ◽  
...  
Keyword(s):  
High Density Polyethylene ◽  
High Density ◽  
Effects Of Temperature ◽  
Polyethylene Melt

scholarly journals Improving the bonding between henequen fibers and high density polyethylene using atmospheric pressure ethylene-plasma treatments

2014 ◽  
Vol 8 (7) ◽  
pp. 491-504 ◽  
Author(s):  
A. Aguilar-Rios ◽  
P. J. Herrera-Franco ◽  
A. de J. Martinez-Gomez ◽  
A. Valadez-Gonzalez
Keyword(s):  
Atmospheric Pressure ◽  
High Density Polyethylene ◽  
High Density ◽  
Plasma Treatments

Deformation Behaviors of Non-Metallic Inclusion in FGH96 Superalloy during Different Plastic Processes

2012 ◽  
Vol 538-541 ◽  
pp. 1187-1191
Author(s):  
Min Cong Zhang ◽  
Chen Yi Liu ◽  
Shu Yun Wang
Keyword(s):  
Transition Zone ◽  
Extrusion Direction ◽  
Extrusion Process ◽  
Extrusion Ratio ◽  
Metallic Inclusion ◽  
Isothermal Forging ◽  
Forging Process ◽  
Discontinuous Line ◽  
Metallic Inclusions ◽  
Deformation Behaviors

The non-metallic inclusions in FGH96 superalloy during different plastic processes were studied. The results show that SiO2 react with aluminum and titanium in FGH96 superalloy and the reaction zone is formed in the interface between SiO2 and alloy, whereas Al2O3 react with no elements in FGH96 superalloy and the transition zone between them is mechanical combination during the plastic processes. In addition the sizes of non-metallic inclusions increase in the direction perpendicular to deformation during isothermal forging process. The non-metallic inclusions are pulled into a discontinuous line in extrusion direction and areas of non-metallic inclusions in each direction are constricted during extrusion process. The non-metallic inclusions of FGH96 superalloy is conditioned by the state of the as-extrusion inclusions during extrusion+isothermal forging process. In summary, extrusion process with large extrusion ratio can break the non-metallic inclusions in FGH96 alloy effectively and improve forging quality.

Fabrication of Copper Clad Aluminum Wire (CCAW) by Indirect Extrusion and Drawing

2004 ◽  
Vol 449-452 ◽  
pp. 317-320 ◽  
Author(s):  
Hyouk Chon Kwon ◽  
Taek Kyun Jung ◽  
Sung Chul Lim ◽  
Mok Soon Kim
Keyword(s):  
Bonding Strength ◽  
Annealing Temperature ◽  
Extrusion Process ◽  
Extrusion Ratio ◽  
Extrusion Temperature ◽  
Core Material ◽  
Aluminum Wire ◽  
The Core ◽  
The Difference ◽  
Sheath Material

The optimized extrusion conditions from the present research were the extrusion temperature of 573~623K and the extrusion ratio(A0/A) of 21.39. Above the extrusion temperature of 623K, the fracture of sheath material was observed. It is due to the difference of flow stress between the sheath material and the core material during extrusion process. The bonding strength increased with increasing the extrusion temperature and the extrusion ratio. The bonding strength increased with increasing the annealing temperature. However, over 573K, it decreased abruptly since the thick and brittle intermetallic compounds of larger than 3µm were formed. The electricalconductivity of copper clad aluminum wire was about 70%IACS without annealing.

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