Investigation of Heat Transfer in Evaporator of Microchannel Loop Heat Pipe

2013 ◽  
Vol 135 (10) ◽  
Author(s):  
Alexander A. Yakomaskin ◽  
Valery N. Afanasiev ◽  
Nikolay N. Zubkov ◽  
Dmitry N. Morskoy
Keyword(s):  
Heat Transfer ◽  
Electronics Cooling ◽  
Open Loop ◽  
Main Element ◽  
Working Fluid ◽  
Vapor Flow ◽  
Loop Heat Pipes ◽  
Evaporation And Condensation ◽  
Flow Geometry ◽  
Compensation Chamber

Loop heat pipes (LHP) are heat transfer devices which use evaporation and condensation of working fluid to transfer heat and use capillary forces to provide fluid circulation in a closed loop. One of the main applications of LHP is cooling of electronic components. Further development of this field is associated with miniaturization. Thus, there are strict limits imposed upon size of elements of heat transfer devices in electronics cooling. One of such elements is an evaporator of the LHP, its main element. This paper deals with the LHP evaporator and is aimed at showing dependence of wick conductivity, thickness, and vapor flow geometry on overall heat transfer performance. An open loop experimental setup was created. Experiments were carried out with various configurations. The evaporator consisted of a microchannel (MC) plate, with groove widths of 100 and 300 μm, wick (metal and nonmetal porous materials were used) and a compensation chamber (CC). Heat load varied from 20 to 140 W in steps of 20 W. The area of the heater was equal to 19 × 19 mm2. The working fluid is de-ionized water. Experimental results include data on temperature distribution across the wick's height, temperature of microchannel's surface, and temperature of water in the compensation chamber. The results reveal a potential for performing optimization of the zone of evaporation in order to produce thinner LHP evaporators.

Investigation of Heat Transfer in Evaporator of Microchannel Loop Heat Pipe

2012 ◽  
Author(s):  
Alexander A. Yakomaskin ◽  
Valery N. Afanasiev ◽  
Nikolay N. Zubkov ◽  
Dmitry N. Morskoy
Keyword(s):  
Heat Transfer ◽  
Electronics Cooling ◽  
Open Loop ◽  
Main Element ◽  
Working Fluid ◽  
Loop Heat Pipes ◽  
Evaporation And Condensation ◽  
Compensation Chamber ◽  
Cooling Of Electronics ◽  
Further Development

Loop heat pipes (LHP) are closed loop heat transfer devices which use evaporation and condensation of a working fluid to transfer heat and use capillary forces to provide fluid circulation. One of the main applications of LHP is cooling of electronics components. Further development in this field is associated with miniaturization. Therefore in electronics cooling there are strict limits imposed upon size of elements of heat transfer devices. One of such elements is evaporator of LHP, its main element. This paper deals with LHP evaporator and aims to find ways of reducing its thickness. An open loop experimental setup was created to investigate heat transfer phenomena in evaporator. Experiments were carried out with variety of configurations. Evaporator consists of microchannel plates with groove width 100 and 300 micrometers, wick (metal and non-metal porous materials were used) and compensation chamber (CC). Heat load varied from 20 to 140 W by steps of 20 W. The area of heater was equal to 19 mm × 19 mm. Working fluid — deionised water. Experiments resulted in data on temperature distribution across wick’s height, temperature of microchannel’s surface and temperature of water in compensation chamber. The results reveal potentials to perform optimization of evaporating zone to produce thinner evaporators.

Reciprocating-Mechanism Driven Heat Loops and Their Applications

2003 ◽  
Author(s):  
Yiding Cao ◽  
Mingcong Gao
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Electronics Cooling ◽  
Working Fluid ◽  
High Heat Flux ◽  
Two Phase ◽  
Condenser Section ◽  
Evaporator Section ◽  
Two Phase Heat Transfer ◽  
Transfer Device

This paper introduces a novel heat transfer mechanism that facilitates two-phase heat transfer while eliminating the so-called cavitation problem commonly encountered by a conventional pump. The heat transfer device is coined as the reciprocating-mechanism driven heat loop (RMDHL), which includes a hollow loop having an interior flow passage, an amount of working fluid filled within the loop, and a reciprocating driver. The hollow loop has an evaporator section, a condenser section, and a liquid reservoir. The reciprocating driver is integrated with the liquid reservoir and facilitates a reciprocating flow of the working fluid within the loop, so that liquid is supplied from the condenser section to the evaporator section under a substantially saturated condition and the so-called cavitation problem associated with a conventional pump is avoided. The reciprocating driver could be a solenoid-operated reciprocating driver for electronics cooling applications and a bellows-type reciprocating driver for high-temperature applications. Experimental study has been undertaken for a solenoid-operated heat loop in connection with high heat flux thermal management applications. Experimental results show that the heat loop worked very effectively and a heat flux as high as 300 W/cm2 in the evaporator section could be handled. The applications of the bellows-type reciprocating heat loop for gas turbine nozzle guide vanes and the leading edges of hypersonic vehicles are also illustrated. The new heat transfer device is expected to advance the current two-phase heat transfer device and open up a new frontier for further research and development.

Effects of Surface Coating of Nanoparticles on Thermal Performance of Open Loop Pulsating Heat Pipes

2012 ◽  
Author(s):  
Mehdi Taslimifar ◽  
Maziar Mohammadi ◽  
Ali Adibnia ◽  
Hossein Afshin ◽  
Mohammad Hassan Saidi ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Heat Transfer ◽  
Heat Pipe ◽  
Thermal Performance ◽  
Surface Coating ◽  
Heat Pipes ◽  
Open Loop ◽  
Working Fluid ◽  
Pulsating Heat Pipe ◽  
Performance Of Heat Transfer

Homogenous dispersing of nanoparticles in a base fluid is an excellent way to increase the thermal performance of heat transfer devices especially Heat Pipes (HPs). As a wickless, cheap and efficient heat pipe, Pulsating Heat Pipes (PHPs) are important candidates for thermal application considerations. In the present research an Open Loop Pulsating Heat Pipe (OLPHP) is fabricated and tested experimentally. The effects of working fluid namely, water, Silica Coated ferrofluid (SC ferrofluid), and ferrofluid without surface coating of nanoparticles (ferrofluid), charging ratio, heat input, and application of magnetic field on the overall thermal performance of the OLPHPs are investigated. Experimental results show that ferrofluid has better heat transport capability relative to SC ferrofluid. Furthermore, application of magnetic field improves the heat transfer performance of OLPHPs charged with both ferrofluids.

Experimental Investigation of Enhanced Two-Phase Evaporator Using Aluminum Foams

2015 ◽  
Author(s):  
Francesco Agostini ◽  
Waylon Puckett ◽  
Ryan Nelson ◽  
Daniele Torresin ◽  
Bruno Agostini ◽  
...  
Keyword(s):  
Aluminum Foam ◽  
Metal Foam ◽  
Electronics Cooling ◽  
Base Plate ◽  
Heat Fluxes ◽  
Experimental Results ◽  
Working Fluid ◽  
Vapor Flow ◽  
Base Temperature ◽  
Two Phase

A novel two-phase thermosyphon with a metal foam based evaporator is presented as a solution for the cooling of power-electronic semiconductor modules. A horizontal evaporator configuration is investigated: the evaporator consists of an aluminum chamber, with aluminum foam brazed to the base plate in three different configurations. One of the configurations has an open vapor chamber above the foam, another has foam filling the entire evaporator chamber, and the third has bores drilled in the foam parallel to the base plate from inlet to outlet along the direction of the vapor flow. The aluminum foam has a porosity of 95%, and a pore density of 20 PPI (pores per inch). A liquid distribution and a vapor collector chamber are respectively present at the entrance and at the exit of the evaporator. The power modules are attached on the evaporator body that collects the heat generated during the operation of the semiconductor devices. A vapor riser guides the vapor to a finned-tube air-cooled heat exchanger. A liquid downcomer from the condenser constantly feeds the evaporator channels. The system works with gravity-driven circulation only. The described system was designed and tested with an extensive experimental campaign. The evaporators were tested for power losses ranging between 500 and 3000 W, corresponding to applied heat fluxes between 3 and 20 W/cm2. The experimental results will be presented for inlet air at ambient temperature of 20°C with volumetric flow rates between 100 and 680 m3/h. The working fluid was refrigerant R245fa. The fluid filling effect was investigated. For each evaporator the results will be presented in terms of maximum thermal resistance and cooler base temperature. The base temperature distribution between different evaporators will also be presented and discussed being an important design parameter in power electronics cooling. Thermal resistances were measured between 15 and 30 K/kW. The experimental results indicated a promising conclusion favoring the implementation of aluminum foam evaporators for enhancement of heat transfer during pool boiling.

Modeling for Fluid Flow and Heat Transfer in Closed Loop Pulsating Heat Pipe

2020 ◽  
pp. 1-34
Author(s):  
Radhakanta Sarangi ◽  
Satya Prakash Kar ◽  
Abhilas Swain ◽  
Lalit Kumar Pothal
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Vapor Bubble ◽  
Closed Loop ◽  
Working Fluid ◽  
Vapour Bubble ◽  
Pulsating Heat Pipe ◽  
Time Step ◽  
Liquid Plug ◽  
Evaporation And Condensation

Abstract Numerical modelling of multi turn Closed Loop Pulsating Heat Pipe (CLPHP) is presented in this paper for ethanol as working fluid. Modelling is carried out for 1mm and 2mm ID PHP for different number of turns, different orientations and at constant wall temperature boundary conditions. Momentum and heat transfer variations with time are investigated numerically solving the one dimensional governing equations for vapor bubble and liquid plugs. Evaporation and condensation takes place by heat transfer through liquid film present around the vapour bubble. The code takes into account the realistic phenomena such as vapour bubble generation, liquid plug merging and super heating of vapor bubbles above its saturation temperature. During merging of liquid plugs, a time step adaptive scheme is implemented and this minimum time step was found to be 10−7 s. Nature of flow is investigated by momentum variation plot. Model results are compared with the experimental results from literature for nine different cases. Maximum variation in heat transfer for all these cases is found to be below ±34%. Keywords: Closed Loop Pulsating Heat Pipe, Liquid Plug, Plug momentum, Vapor Bubble, Heat Transfer, Thin Film Evaporation and Condensation

Experimental Investigation of Area Ratio on Microjet Array Heat Transfer

2009 ◽  
Author(s):  
Gregory J. Michna ◽  
Eric A. Browne ◽  
Yoav Peles ◽  
Michael K. Jensen
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Performance ◽  
Electronics Cooling ◽  
Jet Impingement ◽  
Area Ratio ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Transfer Performance ◽  
Transfer Coefficients ◽  
High Heat Transfer

Electronics cooling is becoming increasingly difficult due to increasing power consumption and decreasing size of processor chips. Heat fluxes in processors and power electronics are quickly approaching levels that cannot be easily addressed by forced air convection over finned heat sinks. Jet impingement cooling offers high heat transfer coefficients and has been used effectively in conventional-scale applications such as turbine blade cooling and the quenching of metals. However, literature in the area of microjet arrays is scarce and has not studied arrays of large area ratios. Hence, the objective of this study is to experimentally assess the heat transfer performance of arrays of microjets. The microjet arrays were fabricated using MEMS processes in a clean room environment. The heat transfer performance of several arrays using deionized water as the working fluid was investigated. Inline and staggered array arrangements were investigated, and the area ratio (total area of the jets divided by the surface area) was varied between 0.036 and 0.35. Reynolds numbers defined by the jet diameter were in the range of 50 to 3,500. Heat fluxes greater than 1,000 W/cm2 were obtained at fluid inlet-to-surface temperature differences of less than 30 °C. Heat transfer performance improved as the area ratio was increased.

Effect of Nanoparticle Coating on the Performance of a Miniature Loop Heat Pipe for Electronics Cooling Applications

2017 ◽  
Vol 140 (2) ◽  
Author(s):  
Trijo Tharayil ◽  
Lazarus Godson Asirvatham ◽  
S. Rajesh ◽  
Somchai Wongwises
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Physical Vapor Deposition ◽  
Low Voltage ◽  
Circuit Breaker ◽  
Electronics Cooling ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Transfer Coefficients ◽  
Nanoparticle Coating

The effect of nanoparticle coating on the performance of a miniature loop heat pipe (mLHP) is experimentally investigated for heat inputs of 20–380 W using distilled water as the working fluid. Applications include the cooling of electronic devices such as circuit breaker in low voltage switch board and insulated gate bipolar transistor. Physical vapor deposition method is used to coat the nanoparticles on the evaporator surface for different coating thicknesses of 100 nm, 200 nm, 300 nm, 400 nm, and 500 nm, respectively. An optimum filling ratio (FR) of 30% is chosen for the analysis. Experimental findings show that the nanoparticle coating gives a remarkable improvement in heat transfer of the heat pipe. An average reduction of 6.7%, 11.9%, 17.2%, and 22.6% in thermal resistance is observed with coating thicknesses of 100 nm, 200 nm, 300 nm, and 400 nm, respectively. Similarly, enhancements in evaporator heat transfer coefficients of 47%, 63.5%, 73.5%, and 86% are noted for the same coating thicknesses, respectively. Evaporator wall temperature decreased by 15.4 °C for 380 W with a coating thickness of 400 nm. The repeatability test ensures the repeatability of experiments and the stability of coatings in the long run.

Steady State Parametric Modeling of Non-Conventional Loop Heat Pipes

2013 ◽  
Author(s):  
Karthik S. Remella ◽  
Frank M. Gerner ◽  
Ahmed Shuja
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Steady State ◽  
Transfer Coefficient ◽  
Thermal Energy ◽  
Heat Pipes ◽  
Parametric Model ◽  
Parametric Modeling ◽  
Working Fluid ◽  
Loop Heat Pipes

Loop Heat Pipes (LHPs) are used in many thermal management applications, especially for micro-electronics cooling, because of their ability to passively transport thermal energy from a source to a sink. This paper describes the development of a parametric model for a non-conventional LHP operating in steady state, employed to cool Light Emitting Diodes (LEDs). This device is comprised of a flat evaporator, and a finned circular loop wherein condensation and sub-cooling of the working fluid takes place. Unlike a conventional LHP, this device has no compensation chamber. In the mesh screen of the evaporator, the vapor flow entrains liquid and hence the quality of the two-phase mixture leaving the evaporator (xevap) is less than unity (unlike in a conventional LHP where saturated vapor leaves the evaporator). Since this lower quality (approximately 0.2) results in a smaller ratio of latent energy to sensible energy being removed by the condenser and sub-cooler respectively; the ratio of the length of the sub-cooler to condenser length is significantly larger. This results in more stable and controlled operation of the device. Mathematical models of the evaporator, the condenser and the sub-cooler sections are developed, and two closure conditions are employed in this model. For consistency and accuracy, some parameters in the model, such as the natural convection heat transfer coefficient (h o) and a few thermal resistances in the evaporator, are estimated empirically from test data on the device. The empirically obtained value of the heat transfer coefficient is in very good agreement with correlations from the literature. The parametric model accurately predicts the LED board temperature and other temperatures for a specific amount of thermal energy dissipated by the LEDs.

Effect of Wick Characteristics on the Thermal Performance of the Miniature Loop Heat Pipe

2009 ◽  
Vol 131 (8) ◽  
Author(s):  
Randeep Singh ◽  
Aliakbar Akbarzadeh ◽  
Masataka Mochizuki
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Heat Pipe ◽  
Thermal Performance ◽  
Working Fluid ◽  
Vapor Flow ◽  
Loop Heat Pipe ◽  
Heat Transfer Characteristics ◽  
Transfer Characteristics

Two phase heat transfer devices based on the miniature version of loop heat pipe (LHP) can provide very promising cooling solutions for the compact electronic devices due to their high heat flux management capability and long distance heat transfer with minimal temperature losses. This paper discusses the effect of the wick properties on the heat transfer characteristics of the miniature LHP. The miniature model of the LHP with disk-shaped evaporator, 10 mm thick and 30 mm disk diameter, was designed using copper containment vessel and water as the working fluid, which is the most acceptable combination in electronic cooling applications. In the investigation, wick structures with different physical properties including thermal conductivity, pore radius, porosity, and permeability and with different structural topology including monoporous or biporous evaporating face were used. It was experimentally observed that copper wicks are able to provide superior thermal performance than nickel wicks, particularly for low to moderate heat loads due to their low heat conducting resistance. With monoporous copper wick, maximum evaporator heat transfer coefficient (hev) of 26,270 W/m2 K and evaporator thermal resistance (Rev) of 0.06–0.10°C/W were achieved. For monoporous nickel wick, the corresponding values were 20,700 W/m2 K for hev and 0.08–0.21°C/W for Rev. Capillary structure with smaller pore size, high porosity, and high permeability showed better heat transfer characteristics due to sufficient capillary pumping capability, low heat leaks from evaporator to compensation chamber and larger surface area to volume ratio for heat exchange. In addition to this, biporous copper wick structure showed much higher heat transfer coefficient of 83,787 W/m2 K than monoporous copper wick due to improved evaporative heat transfer at wick wall interface and separated liquid and vapor flow pores. The present work was able to classify the importance of the wick properties in the improvement of the thermal characteristics for miniature loop heat pipes.

Development and Experimental Validation of a Micro/Nano Thermal Ground Plane

2011 ◽  
Author(s):  
H. Peter J. de Bock ◽  
Shakti Chauhan ◽  
Pramod Chamarthy ◽  
Chris Eastman ◽  
Stanton Weaver ◽  
...  
Keyword(s):  
Experimental Validation ◽  
Ground Plane ◽  
Electronics Cooling ◽  
Heat Pipes ◽  
Working Fluid ◽  
Heat Sources ◽  
Two Phase ◽  
Evaporation And Condensation ◽  
Two Phase Heat Transfer ◽  
Thermal Ground Plane

Heat pipes are commonly used in electronics cooling applications to spread heat from a concentrated heat source to a larger heat sink. Heat pipes work on the principles of two-phase heat transfer by evaporation and condensation of a working fluid. The amount of heat that can be transported is limited by the capillary and hydrostatic forces in the wicking structure of the device. Thermal ground planes are two-dimensional high conductivity heat pipes that can serve as thermal ground to which heat can be rejected by a multitude of heat sources. As hydrostatic forces are dependent on gravity, it is commonly known that heat pipe and thermal ground plane performance is orientation dependent. The effect of variation of gravity force on performance is discussed and the development of a miniaturized thermal ground plane for high g operation is described. In addition, experimental results are presented from zero to −10g acceleration. The study shows and discusses that minimal orientation or g-force dependence can be achieved if pore dimensions in the wicking structure can be designed at micro/nano-scale dimensions.

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