Effect of Nanoparticle Coating on the Performance of a Miniature Loop Heat Pipe for Electronics Cooling Applications

2017 ◽  
Vol 140 (2) ◽  
Author(s):  
Trijo Tharayil ◽  
Lazarus Godson Asirvatham ◽  
S. Rajesh ◽  
Somchai Wongwises
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Physical Vapor Deposition ◽  
Low Voltage ◽  
Circuit Breaker ◽  
Electronics Cooling ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Transfer Coefficients ◽  
Nanoparticle Coating

The effect of nanoparticle coating on the performance of a miniature loop heat pipe (mLHP) is experimentally investigated for heat inputs of 20–380 W using distilled water as the working fluid. Applications include the cooling of electronic devices such as circuit breaker in low voltage switch board and insulated gate bipolar transistor. Physical vapor deposition method is used to coat the nanoparticles on the evaporator surface for different coating thicknesses of 100 nm, 200 nm, 300 nm, 400 nm, and 500 nm, respectively. An optimum filling ratio (FR) of 30% is chosen for the analysis. Experimental findings show that the nanoparticle coating gives a remarkable improvement in heat transfer of the heat pipe. An average reduction of 6.7%, 11.9%, 17.2%, and 22.6% in thermal resistance is observed with coating thicknesses of 100 nm, 200 nm, 300 nm, and 400 nm, respectively. Similarly, enhancements in evaporator heat transfer coefficients of 47%, 63.5%, 73.5%, and 86% are noted for the same coating thicknesses, respectively. Evaporator wall temperature decreased by 15.4 °C for 380 W with a coating thickness of 400 nm. The repeatability test ensures the repeatability of experiments and the stability of coatings in the long run.

Study on Heat Transfer Characteristics of Loop Heat Pipe for Solar Collector

2012 ◽  
Author(s):  
Shota Sato ◽  
Shigeki Hirasawa ◽  
Tsuyoshi Kawanami ◽  
Katsuaki Shirai
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Heat Transfer Rate ◽  
Solar Collector ◽  
Transfer Rate ◽  
Thermal Conductance ◽  
Filling Ratio ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Single Tube

We experimentally study the thermal conductance of single-tube and loop heat pipes for a solar collector. The evaporator of the heat pipe is 1 m long, 6 mm in diameter and has 30° inclination. The thermal conductance is defined as the heat transfer rate divided by the temperature difference between the evaporator-wall and the condenser-wall. Effects of heat transfer rate, saturation temperature of the working fluid, liquid filling ratio, inclination angle, and position of the evaporator on the thermal conductance are examined. We found that the thermal conductance of the 30°-inclined loop heat pipe with an upper-evaporator is 40–50 (W/K), which is 1.8 times higher than that of the vertical loop type and 3 times higher than that of the single-tube type. Thus, the inclined loop heat pipe is preferable for a solar collector. There is an optimum liquid filling ratio. When the liquid filling ratio is too small, a dry-out portion appears in the evaporator. When the liquid filling ratio is too large, the liquid flows in the condenser to decrease heat transfer area. Also we numerically analyze the thermal conductance of a vertical loop heat pipe.

Experimental Investigation of Area Ratio on Microjet Array Heat Transfer

2009 ◽  
Author(s):  
Gregory J. Michna ◽  
Eric A. Browne ◽  
Yoav Peles ◽  
Michael K. Jensen
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Performance ◽  
Electronics Cooling ◽  
Jet Impingement ◽  
Area Ratio ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Transfer Performance ◽  
Transfer Coefficients ◽  
High Heat Transfer

Electronics cooling is becoming increasingly difficult due to increasing power consumption and decreasing size of processor chips. Heat fluxes in processors and power electronics are quickly approaching levels that cannot be easily addressed by forced air convection over finned heat sinks. Jet impingement cooling offers high heat transfer coefficients and has been used effectively in conventional-scale applications such as turbine blade cooling and the quenching of metals. However, literature in the area of microjet arrays is scarce and has not studied arrays of large area ratios. Hence, the objective of this study is to experimentally assess the heat transfer performance of arrays of microjets. The microjet arrays were fabricated using MEMS processes in a clean room environment. The heat transfer performance of several arrays using deionized water as the working fluid was investigated. Inline and staggered array arrangements were investigated, and the area ratio (total area of the jets divided by the surface area) was varied between 0.036 and 0.35. Reynolds numbers defined by the jet diameter were in the range of 50 to 3,500. Heat fluxes greater than 1,000 W/cm2 were obtained at fluid inlet-to-surface temperature differences of less than 30 °C. Heat transfer performance improved as the area ratio was increased.

scholarly journals Heat-Transfer Characteristics of a Cryogenic Loop Heat Pipe for Space Applications

Energies ◽  
2020 ◽  
Vol 13 (7) ◽  
pp. 1616
Author(s):  
Jaehwan Lee ◽  
Dongmin Kim ◽  
Jeongmin Mun ◽  
Seokho Kim
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Infrared Detectors ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Zero Gravity ◽  
Heat Transfer Characteristics ◽  
Space Applications ◽  
Transfer Characteristics ◽  
Start Up

Infrared detectors on satellites and spacecraft require cooling to increase their measurement sensitivity. To efficiently cool infrared detectors in a zero gravity environment and in limited spaces, a cryogenic loop heat pipe (CLHP) can be used to transfer heat over a certain distance by the capillary forces generated from porous wicks without a mechanical power source. The CLHP presented in this study transfers the heat load to a condenser 0.5 m away from an evaporator at temperatures below −150 °C. The CLHP with two evaporators includes a subloop for initial start-up, and uses a pressure reduction reservoir (PRR) for the supercritical start-up from room to cryogenic temperature. Nitrogen is used as the working fluid to verify the thermal behavior of the CLHP, and the heat-transfer capacity according to the nitrogen charging pressure of the PRR is investigated. To simulate a cryogenic environment, the CLHP is installed inside a space environment simulator, including a single-stage GM (Gifford McMahon) cryocooler to cool the condenser. The CLHP is horizontally installed to simulate zero gravity. The heat-transfer characteristics are experimentally evaluated through the loop circulation of the CLHP.

An Experimental Investigation of a Low Heat Flux, Wickless Heat Pipe

1983 ◽  
Vol 7 (2) ◽  
pp. 96-99
Author(s):  
B.S. Larkin
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Pipe ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Transfer Coefficients ◽  
Electronic Package ◽  
Ambient Temperatures ◽  
Heat Transfer Coefficients ◽  
Flux Charge

This paper reports tests on a wickless heat pipe to be used for transporting heat from the ground to protect an electronic package from low ambient temperatures. Evaporating heat transfer coefficients were measured for low heat fluxes where the behaviour of the evaporating film is unpredictable. The effects of type of working fluid, heat flux, charge quantity and tube inclination were investigated.

Effect of Wick Characteristics on the Thermal Performance of the Miniature Loop Heat Pipe

2009 ◽  
Vol 131 (8) ◽  
Author(s):  
Randeep Singh ◽  
Aliakbar Akbarzadeh ◽  
Masataka Mochizuki
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Heat Pipe ◽  
Thermal Performance ◽  
Working Fluid ◽  
Vapor Flow ◽  
Loop Heat Pipe ◽  
Heat Transfer Characteristics ◽  
Transfer Characteristics

Two phase heat transfer devices based on the miniature version of loop heat pipe (LHP) can provide very promising cooling solutions for the compact electronic devices due to their high heat flux management capability and long distance heat transfer with minimal temperature losses. This paper discusses the effect of the wick properties on the heat transfer characteristics of the miniature LHP. The miniature model of the LHP with disk-shaped evaporator, 10 mm thick and 30 mm disk diameter, was designed using copper containment vessel and water as the working fluid, which is the most acceptable combination in electronic cooling applications. In the investigation, wick structures with different physical properties including thermal conductivity, pore radius, porosity, and permeability and with different structural topology including monoporous or biporous evaporating face were used. It was experimentally observed that copper wicks are able to provide superior thermal performance than nickel wicks, particularly for low to moderate heat loads due to their low heat conducting resistance. With monoporous copper wick, maximum evaporator heat transfer coefficient (hev) of 26,270 W/m2 K and evaporator thermal resistance (Rev) of 0.06–0.10°C/W were achieved. For monoporous nickel wick, the corresponding values were 20,700 W/m2 K for hev and 0.08–0.21°C/W for Rev. Capillary structure with smaller pore size, high porosity, and high permeability showed better heat transfer characteristics due to sufficient capillary pumping capability, low heat leaks from evaporator to compensation chamber and larger surface area to volume ratio for heat exchange. In addition to this, biporous copper wick structure showed much higher heat transfer coefficient of 83,787 W/m2 K than monoporous copper wick due to improved evaporative heat transfer at wick wall interface and separated liquid and vapor flow pores. The present work was able to classify the importance of the wick properties in the improvement of the thermal characteristics for miniature loop heat pipes.

scholarly journals A heat pipe heat recovery heat exchanger for a mini-drier

2006 ◽  
Vol 17 (1) ◽  
pp. 50-57 ◽  
Author(s):  
A Meyer ◽  
R T R T Dobson
Keyword(s):  
Heat Transfer ◽  
Heat Exchanger ◽  
Theoretical Model ◽  
Heat Pipe ◽  
Experimental Testing ◽  
Thermal Design ◽  
Working Fluid ◽  
Transfer Coefficients ◽  
Maximum Heat ◽  
Maximum Heat Transfer

This paper considers the thermal design and the experimental testing of a heat pipe (thermosyphon) heat exchanger for a relatively small commercially available mini-drier. The purpose of the heat exchanger is to recover heat from the moist waste air stream to preheat the fresh incoming air. The working fluid used was R134a and the correlations are given for the evaporator and condenser inside heat transfer coefficients as well as for the maximum heat transfer rate. The theoretical model and computer simulation program used for the thermal design calculations are described. The validity of the as-designed and manufactured heat exchanger coupled to the drier is experimentally verified. The theoretical model accurately predicted the thermal performance and a significant energy savings and a reasonable payback period was achieved.

Thermal Performance of the Mini-Loop Heat Pipe (LHP)

2009 ◽  
Author(s):  
K. Tanaka ◽  
M. Katsuta ◽  
Y. Ohuchi ◽  
K. Saitho
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Thermal Performance ◽  
Physical Development ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Transfer Capability ◽  
Heat Transfer Capability ◽  
Basic Equations ◽  
Test Result

In this paper, we describe the outline of experimental manufacture of the LHP. This LHP is made of a copper. The evaporator is φ19×95mm, the vapor tube is φ5×300mm, the condenser is φ3.5×600mm and the liquid tube is φ 3.5×300mm. The wick is made of the sintering copper. The working fluid is methanol. Second, we describe the test result of heat transfer capability of this LHP. Finally, I describe the basic equations that resolve the physical development of the LHP and how to estimate the each temperatures of the LHP.

Experimental Study on Heat Transfer Capability of a Miniature Loop Heat Pipe

2016 ◽  
Author(s):  
Guohui Zhou ◽  
Ji Li ◽  
Lucang Lv
Keyword(s):  
Heat Pipe ◽  
Heat Load ◽  
Electronics Cooling ◽  
High Heat ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Evaporator Temperature ◽  
Liquid Line ◽  
Horizontal Orientation ◽  
Flat Evaporator

In this paper, a miniature loop heat pipe (mLHP) with a flat evaporator is illustrated and investigated experimentally, with water as the working fluid. The mLHP can be applied for the mobile electronics cooling, such as tablet computers and laptop computers, with a 1.2 mm thick ultra-thin flat evaporator and a thickness of 1.0 mm for the vapor line, liquid line and condenser. A narrow sintered copper mesh in the liquid line and a part of the condenser as the secondary wick can promote the flow of the condensed working fluid back to the evaporator. The experimental results showed that the mLHP could start up successfully and operate stably at low heat load of 3 W in the horizontal orientation, and transport a high heat load of 12 W (the heat flux of 4 W/cm2) with the evaporator temperature below 100 °C in different test orientations by natural convection, showing good operational performance against gravity field. The minimum mLHP thermal resistance of 0.32 K/W was achieved at the input heat load of 12 W in the horizontal orientation.

An Experimental Study of Heat Transfer Characteristics in Miniature Loop Heat Pipes With Rectangular Shaped Evaporator

2011 ◽  
Author(s):  
Z. R. Lin ◽  
Z. Y. Lee ◽  
L. W. Zhang ◽  
S. F. Wang ◽  
A. A. Merrikh ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Heat Transport ◽  
Heat Sink ◽  
Thermal Design ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Heat Transfer Characteristics ◽  
Transfer Characteristics ◽  
Heat Transport Capability

Loop heat pipe (LHP) is a highly efficient cooling device. It has gained great attention in the electronics cooling industry due to its superior heat transport capability — that is, its ability to carry heat over long distances. For this article, a miniature flat loop heat pipe (MFLHP) with rectangular-shaped evaporator was developed. The LHP’s evaporator was combined with the compensation chamber. MFLHPs with different diameters and lengths for the connecting pipeline were selected for a series of experimental studies on their heat transfer characteristics. In these experiments, pure water was used as the working fluid. The studies showed that the heat transport capability of a MFLHP with 4 mm diameter was better than that a MFLHP with 3 mm diameter. At a low thermal resistance of 0.04°C /W (at 200W), an optimal length for the connecting pipeline for a particular MFLHP with 4 mm diameter was identified. Finally, a heat sink attached to a MFLHP was developed for cooling a graphics processing unit (GPU), the thermal design power (TDP) of which was 200 W. The results showed the GPU heat sink with MFLHP had good performance and satisfied GPU cooling requirements. Compared to the conventional heat pipe solutions, only one MFLHP was able to cope with high power dissipation, offering the potential to make a lighter heat sink.

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