Finite Element Analysis of Printed Circuit Boards Using Isotropic Elastoplastic Model and Application to Drop Simulation for Mobile Phone

2012 ◽  
Author(s):  
Hojin Jeon ◽  
Myunghyun Park ◽  
Hyongwon Seo ◽  
Myunghan Kim ◽  
Yonghee Lee
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Mobile Phone ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Flexural Test ◽  
Elastoplastic Model ◽  
Element Analysis ◽  
Element Modeling ◽  
Printed Circuit

Flexural behavior of printed circuit boards (PCB) is well known for the major failure mechanism under board level or product level mobile phone drop tests. This behavior induces high peeling stress between PCB and IC package. This stress causes failure including both solder joint crack and pad cratering, which leads to malfunction such as phone dead or power off. Therefore, for a more reliable mobile phone design, it is important to accurately predict behavior of the PCB. In the past, isotropic or orthogonal linear elastic model have been used for simulating PCB in finite element analysis. Also, since PCB consists of multiple layers with woven glass fiber epoxy resin composite (FR-4) and copper foils, a multilayered PCB model was developed in order to consider material properties that change along the different plies. In this paper, the isotropic elastoplastic model was employed in order to efficiently predict behavior of PCB. Tensile and flexural test of PCB were conducted initially to evaluate mechanical characteristics and obtain representative material properties. Then, simulation of flexural test was performed to develop the finite element modeling. Finally, a drop test of mobile phone adopted with PCB bare board, which did not include IC packages, was examined. Also, the strain gage was used for measuring strain of PCB. This result was compared with drop simulation results of mobile phone, which used finite element modeling suggested. In conclusion, from an industry standpoint, finite element modeling of PCB using isotropic elasoplastic model was useful and efficient.

Forced Response and Random Vibration Analysis of Printed Circuit Boards

2000 ◽  
Author(s):  
James F. Tarter
Keyword(s):  
Random Vibration ◽  
Printed Circuit Boards ◽  
Random Excitation ◽  
Forced Response ◽  
Circuit Boards ◽  
Element Analysis ◽  
Design Data ◽  
Improve Design ◽  
Printed Circuit ◽  
Contour Plots

Abstract Finite element analysis has been used in conjunction with developed algorithms to analyze forced response and random vibration response of printed circuit boards. Analytical predictions have been compared to random vibration test data for model correlation and validation of the analysis methods. The described methods provide design data for predicting deflections and G levels as a function of frequency or predicting RMS levels for random excitation. These data are utilized for initiating design changes and guiding component placement. Deflection versus frequency contributions for random excitation are analyzed to identify critical design frequencies. Forced response contour plots include effects of modal coupling, modal participation factors, and system damping. These data provide a better description of the expected operating deflection shapes man a simple mode shape. All of these methods are used to improve design integrity and ensure specification compliance prior to hardware fabrication. The analyses utilize aggregate board properties, and do not currently provide data for individual components which are installed on the board.

scholarly journals Developing an Extended IFC Data Schema and Mesh Generation Framework for Finite Element Modeling

2019 ◽  
Vol 2019 ◽  
pp. 1-19
Author(s):  
Zhao Xu ◽  
Zezhi Rao ◽  
Vincent J. L. Gan ◽  
Youliang Ding ◽  
Chunfeng Wan ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Finite Element Modeling ◽  
Mesh Generation ◽  
Geometric Model ◽  
Information Modeling ◽  
Element Analysis ◽  
Element Modeling ◽  
The Finite Element Analysis ◽  
Ifc Standard

Mesh generation plays an important role in determining the result quality of finite element modeling and structural analysis. Building information modeling provides the geometry and semantic information of a building, which can be utilized to support an efficient mesh generation. In this paper, a method based on BRep entity transformation is proposed to realize the finite element analysis using the geometric model in the IFC standard. The h-p version of the finite element analysis method can effectively deal with the refined expression of the model of bending complex components. By meshing the connection model, it is suggested to adopt the method of scanning to generate hexahedron, which improves the geometric adaptability of the mesh model and the quality and efficiency of mesh generation. Based on the extension and expression of IFC information, the effective finite element structure information is extracted and extended into the IFC standard mode. The information is analyzed, and finally the visualization of finite element analysis in the building model can be realized.

A Meta-Object Based Approach to Finite Element Modeling

2001 ◽  
Author(s):  
Santosh Shanbhag ◽  
Ian R. Grosse ◽  
Jack C. Wileden ◽  
Alan Kaplan
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Production Model ◽  
Engineering Analysis ◽  
Demand Model ◽  
Element Analysis ◽  
Modeling And Analysis ◽  
Element Modeling ◽  
Molded Part ◽  
Analysis Models

Abstract With the integration of CAD and FEA software packages, design engineers who are not skilled in finite element analysis are performing finite element modeling and analysis. Furthermore, in the analysis of a system, engineers often make numerous modeling simplifications and analysis assumptions depending on the trade-off between cost, accuracy, precision or other engineering analysis objectives. Thus, reusability or interoperability of engineering analysis models is difficult and often impractical due to the wealth of knowledge involved in the creation of such models and the lack of formal methods to codify and explicitly represent this critical modeling knowledge. Most institutions and organizations have started documenting these simplifications and assumptions, making them understandable for the other engineers within the organization. However, this does not allow a seamless exchange of data or interoperability with other analysis models of similar or dissimilar nature. This plays a very important role in today’s market, which is moving away from the traditional make-to-stock production model to a build-to-demand model. We address these issues in this paper by adopting and extending the computer science concept of meta-object, and applying it in novel ways to the domain of FEA and the representation of finite element modeling knowledge. We present a taxonomy for engineering models that aids in the definition of the various object analysis classes. A simple beam analysis example, followed by a more realistic injection-molded part example. The latter example involves injection-mold filling simulation, thermal cooling, and part ejection analyses which are subclasses for a generic manufacturing analysis meta-object class. Prototype implementations of automated support for this meta-object approach to finite element modeling is in progress.

Contact Stiffness Parameters for Finite Element Modeling of Contact

2019 ◽  
Vol 799 ◽  
pp. 211-216
Author(s):  
Alina Sivitski ◽  
Priit Põdra
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Contact Stiffness ◽  
Influential Factors ◽  
Element Analysis ◽  
Normal Contact ◽  
Element Modeling ◽  
Contact Models ◽  
Machine Elements ◽  
Normal Contact Pressure

Contact modeling could be widely used for different machine elements normal contact pressure calculations and wear simulations. However, classical contact models as for example Hertz contact models have many assumptions (contact bodies are elastic, the contact between bodies is ellipse-shaped, contact is frictionless and non-conforming). In conditions, when analytical calculations cannot be performed and experimental research is economically inexpedient, numerical methods have been applied for solving such engineering tasks. Contact stiffness parameters appear to be one of the most influential factors during finite element modeling of contact. Contact stiffness factors are usually selected according to finite element analysis software recommendations. More precise analysis of contact stiffness parameters is often required for finite element modeling of contact.

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