Fabrication of Nanochannels on Polymer Thin Film

Author(s):  
Vinh-Nguyen Phan ◽  
Patrick Abgrall ◽  
Nam-Trung Nguyen ◽  
Peige Shao ◽  
Jeroen Anton Van Kan

Recent advances in nanotechnology allow the fabrication of structures down to the nanometer range. Various theoretical and experimental studies on the characteristics of fluid in nanochannels have been carried out in recent years. The results show that transport phenomena in nanoscale promise a wide range of applications in biological and chemical analysis. Practical applications require fabrication of nanochannels with a short production time and at a low cost. Polymer is considered as a suitable material for mass production of nanochannels due to the wide range of properties available, as well as the low cost of material and fabrication process. This paper reports the fabrication of planar nanochannels using hot embossing and thermal bonding technique on a polymer thin film. The mold for hot embossing was fabricated on a silicon wafer using photolithography and Reactive Ion Etching (RIE). Polymethylmethacrylate (PMMA) thin film with a thickness of 250 μm was used as the base material to emboss the nanochannels from the silicon mold. Temperature and pressure were controlled and recorded continuously during the embossing process. The channels then were examined by Atomic Force Microscope (AFM) in tapping mode to verify the width and the depth of the channel. Next, another piece of PMMA thin film was bonded to the first piece by thermal bonding process to make closed nanochannels. Temperature and pressure during the bonding process were controlled and recorded. Access to the channels was made on the thin film by a laser cutter before embossing. The results showed that open planar channels with the depth down to 30nm can be fabricated on PMMA thin film with a process time less than 30 minutes. Width and depth of the channels agree well with appropriate dimensions on the mold. Bonding can be achieved within 40 minutes. Closed planar channels with the depth of 300nm were fabricated successfully by a combination of embossing and thermal bonding processes. This project demonstrates the possibility of fabricating nanochannels with low cost and short processing time using polymer material. The processes are suitable not only for nanochannels but also for more complicated nanostructures. The presented technique allows the fabrication of nanodevices with various designs.

2012 ◽  
Vol 1399 ◽  
Author(s):  
Kajal Jindal ◽  
Monika Tomar ◽  
Vinay Gupta

ABSTRACTTemperature dependent optical properties of RF-sputtered c-axis oriented ZnO:N thin film have been investigated. Surface Plasmon modes are excited at the metal-dielectric interface in the Kretschmann-Reather configuration using prism coupling technique. Effect of ZnO:N thin film deposited over Prism-Au structure on the SPR reflectance is studied over a wide range of temperature from 300–500 K at 633 nm wavelength. The value of dielectric constant of ZnO:N film obtained by fitting the experimentally obtained data with the theoretically generated SPR curve at the optical frequency is found to increase linearly with temperature. The increase in dielectric constant (4.03 to 4.11) with increase in temperature from 300 K to 500 K indicates a promising application of the system as an efficient low-cost temperature sensor.


2011 ◽  
Vol 22 (8) ◽  
pp. 1248-1253
Author(s):  
Masao Kaneko ◽  
Takashi Suzuki ◽  
Hirohito Ueno ◽  
Yuki Fujii ◽  
Junichi Nemoto ◽  
...  

2020 ◽  
Vol 21 (4) ◽  
pp. 660-668
Author(s):  
Z. R. Zapukhlyak ◽  
L.I. Nykyruy ◽  
G. Wisz ◽  
V.M. Rubish ◽  
V.V. Prokopiv ◽  
...  

The authors have developed a simple, cheap and reproducible technology for obtaining thin-film heterostructures based on CdTe with a given surface morphology during vacuum deposition, which contributes to their low cost [1, 2]. The critical dimensions (thicknesses) of individual layers of the heterostructure were substantiated, a simulation was performed and a wide range of optical properties was investigated [3]. It is shown that for the deposited CdS / CdTe heterostructure on glass it is possible to obtain an efficiency of 15.8%. Given that thin films are relatively new systems, their study can offer much wider opportunities for technological improvement of photovoltaic energy converters. According to the analysis of modern literature data, the efficiency can be increased by performing deposition on ITO films and introducing nanoparticles of controlled sizes.


2013 ◽  
Vol 365-366 ◽  
pp. 1078-1081 ◽  
Author(s):  
Ching Wen Lou ◽  
Ting Ting Li ◽  
Jan Yi Lin ◽  
Mei Chen Lin ◽  
Jia Horng Lin

The effect of Kevlar fibers amount, number of layers, thermal bonding and fabric type on constant-rate puncture resistance of low-cost compound fabrics are discussed. Therein, compound fabrics were prepared by nonwovens and woven fabric via needle-punching and thermal bonding processes. The result shows that, Kevlar fibers amount and number of layers are both positive to improvement of puncture resistance. And thermal bonding process increases the wearer safety of puncture-resistance materials. For different kinds of fabrics, compound Kevlar fabric shows the maximum puncture resistance.


2006 ◽  
Vol 83 (2) ◽  
pp. 298-302 ◽  
Author(s):  
Fengliang Xue ◽  
Zhengchun Liu ◽  
Yi Su ◽  
Kody Varahramyan

Author(s):  
Youssef Ahmed Mobarak ◽  
Moamen Atef

<span>The potential impact of high permittivity gate dielectrics on thin film transistors short channel and circuit performance has been studied using <a name="OLE_LINK110"></a><a name="OLE_LINK118"></a>highly accurate analytical models. In addition, the gate-to-channel capacitance and parasitic fringe capacitances have been extracted. The suggested model in this paper has been <a name="OLE_LINK37"></a><a name="OLE_LINK36"></a>increased the surface potential and decreased the <a name="OLE_LINK93"></a><a name="OLE_LINK92"></a>threshold voltage, whenever the conventional silicon dioxide gate dielectric<a name="OLE_LINK290"></a><a name="OLE_LINK280"></a> is replaced by high-K gate dielectric novel nanocomposite PVP/La<sub>2</sub>O<sub>3</sub>K<sub>ox</sub>=25. Also, it has been investigated that a decrease in parasitic outer fringe capacitance and gate-to-channel capacitance, whenever the conventional silicon nitride is replaced by low-K gate sidewall spacer dielectric novel nanocomposite PTFE/SiO<sub>2</sub>K<sub>sp</sub>=2.9. Finally, it has been demonstrated that using low-K gate sidewalls with high-K gate insulators can be decreased the gate fringing field and threshold voltage. In addition, fabrication of nanocomposites from polymers and nano-oxide particles found to have potential candidates for using it in a wide range of applications in low cost due to low process temperature of these nanocomposites materials.</span>


2005 ◽  
Vol 872 ◽  
Author(s):  
I. Stoyanov ◽  
M. Tewes ◽  
S. Glass ◽  
M. Koch ◽  
M. Löhndorf

AbstractLow-cost and chemical resistant microfluidic devices based on thermoplastic elastomers have been fabricated by hot embossing technology. Commercial available thermoplastic elastomer foils based on polyurethane (PU) in a thickness range of 100-600 μm have been used. Prior to the fabrication of the microfluidic devices the chemical resistance of the material against a wide range of standard biological buffer solutions and solvents had been analysed. We created systems of channels, reservoirs and holes for the connections to external capillaries by double-sided hot embossing with an alignment accuracy of +/- 3 micrometer. Closed channel structures were produced by an additional chemical bonding process of the embossed devices with another thermoplastic elastomer foil. The total volume of the fluidic cell was 2 μl/sensor for the use with SAW (surface-acoustic wave) sensor chip and about 0.2 μ/sensor for the impedance sensors. A novel multi-chamber fluidic device was successfully tested for in-situ immobilization of thrombin antibodies and Bovin Serum Albumin (BSA) on different sensor elements of the same sensor chip.


1999 ◽  
Vol 145 (1) ◽  
pp. 95-102 ◽  
Author(s):  
Gerd Kleideiter ◽  
Oswald Prucker ◽  
Harald Bock ◽  
Curtis W. Frank ◽  
Manfred Dieter Lechner ◽  
...  

Optik ◽  
2012 ◽  
Vol 123 (15) ◽  
pp. 1400-1403 ◽  
Author(s):  
Manoj M. Varma
Keyword(s):  
Low Cost ◽  

Author(s):  
Vijay Subramanian ◽  
Tsgereda Alazar ◽  
Kyle Yazzie ◽  
Bharat Penmecha ◽  
Pilin Liu ◽  
...  

As semiconductor packaging technologies continues to scale, it drives the use of existing and new materials in thin layer form factors. Additionally, packaging technologies continue to increase in complexity such as multi-chip packages, 3D packaging, embedded dies/passives, and system in package. This increasing packaging complexity implies that materials in thin layers are subject to non-trivial loading conditions, which may exceed the toughness of the material, leading to cracks. Furthermore, the continued focus on cost leads to a growing interest in novel, low-cost materials. It is important to ensure that the reliability of these low-cost materials is at par or better than currently used materials. This in turn, leads to significant efforts in the area of material characterization at the lab level to speed up the development process. The chosen test methods must not only provide accurate and consistent data, but they must also be applicable across a suitably wide range of materials to aid in the optimization process. Methods for testing and characterizing fracture induced failures in various material systems in electronic packaging are investigated in this paper. The learnings from the different tests methods are compared and discussed here. More specifically, different fracture characterization techniques on (a) freestanding ‘thin’ solder resist films, and (b) filled ‘bulk’ epoxy materials like underfills and epoxy mold compounds are investigated. For thin films, learnings from different test methods for measuring fracture toughness, namely, uniaxial tension (with and without an edge pre-crack) and membrane penetration tests, are discussed. The test methods are compared by characterizing several different thin films, to gauge how well each method could distinguish differences in material (and thickness). Reasonably good agreement was found between the various thin film toughness test methods; however, ease of sample preparation, fixture, and adaptability to environmental testing will be discussed. In the case of filled epoxy resin systems, the single-edge-notch bending (SENB) technique is utilized to obtain the fracture toughness of underfills and mold compounds with filler materials. Learnings on different methods of creating pre-cracks in SENB samples are also investigated and presented. Two methods are explored in this study, namely, razor blade and laser milling. Good agreement in fracture toughness values was obtained with the two precracking methods, along with considerations about ease of sample preparation and consistency of pre-crack dimensions also examined. Morphology of the pre-cracks obtained by these methods, and their effects on fracture toughness measurements, are also discussed.


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