State-of-the-Art and Trends in Through-Silicon Via (TSV) and 3D Integrations

2010 ◽  
Author(s):  
John H. Lau
Keyword(s):  
State Of The Art ◽  
3D Integration ◽  
3D Ic ◽  
Through Silicon Via ◽  
3D Ic Packaging ◽  
Ic Packaging

3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and in general the TSV (through-silicon via) separates 3D IC packaging from 3D IC integration and 3D Si integration since the latter two use TSV but 3D IC packaging does not. TSV (with a new concept that every chip could have two surfaces with circuits) is the focus of this investigation. State-of-the-art, key differences, trends of these three technologies, and a 3D integration roadmap are presented.

Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration

2014 ◽  
Vol 136 (4) ◽  
Author(s):  
John H. Lau
Keyword(s):  
Integrated Circuit ◽  
State Of The Art ◽  
Three Dimensional ◽  
High Volume ◽  
3D Integration ◽  
3D Ic ◽  
3D Ic Packaging ◽  
Ic Packaging ◽  
Circuit Integration ◽  
Three Dimensional Integrated Circuit

3D integration consists of 3D integrated circuit (IC) packaging, 3D Si integration, and 3D IC integration. They are different and in general the through-silicon via (TSV) separates 3D IC packaging from 3D Si/IC integrations since the latter two use TSV but 3D IC packaging does not. 3D Si integration and 3D IC integration are different. 3D IC integration stacks up the thin chips with TSV and microbump, while 3D Si integration stacks up thin wafers with TSV alone (i.e., bumpless). TSV is the heart of 3D Si/IC integrations and is the focus of this investigation. Also, the state-of-the-art, challenge, and trend of 3D integration will be presented and examined. Furthermore, supply chain readiness for high volume manufacturing (HVM) of TSVs is discussed.

Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing

2016 ◽  
Vol 59 ◽  
pp. 84-94 ◽  
Author(s):  
Hsien-Chie Cheng ◽  
Tzu-Chin Huang ◽  
Po-Wen Hwang ◽  
Wen-Hwa Chen
Keyword(s):  
Heat Dissipation ◽  
3D Ic ◽  
Through Silicon Via ◽  
Image Sensing ◽  
3D Ic Packaging ◽  
Ic Packaging

scholarly journals TSV Core Technology for 3D IC Packaging

2009 ◽  
Vol 27 (3) ◽  
pp. 4-9
Author(s):  
Seung-Min Hyun ◽  
Chang-Woo Lee
Keyword(s):  
3D Ic ◽  
Core Technology ◽  
3D Ic Packaging ◽  
Ic Packaging
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