Fabrication of a Flexible Metal/Polymer Mold With Liquid Crystal Polymer Material for Hot-Embossing Process

2010 ◽  
Author(s):  
Haijing Lu ◽  
Xiao Fang Ang ◽  
Hongping Liu ◽  
Zheng Sun ◽  
Jun Wei
Keyword(s):  
Smooth Surface ◽  
Low Cost ◽  
Hot Embossing ◽  
High Fidelity ◽  
Thermoplastic Polymer ◽  
Flexible Polymer ◽  
Crystal Polymer ◽  
Flexible Metal ◽  
Polymer Mold ◽  
Metal Polymer

A flexible polymer is considered as an alternative of low-cost mold materials. Molds with a high density aspect ratio, smooth surface, vertical sidewalls and lightweight have been fabricated and it is easy-to-use features in the hot embossing process. The study also indicated that the flexible metal/polymer mold could be used for thermoplastic polymer patterning with high fidelity and low cost. Using the flexible metal/polymer mold, 10um and 5um structures were fabricated.

Roll-to-Roll Nanoimprinting Metamaterials

2012 ◽  
Vol 1412 ◽  
Author(s):  
Anton Greenwald ◽  
Jae Ryu ◽  
Yisi Liu ◽  
Rana Biswas ◽  
Jong Ok ◽  
...  
Keyword(s):  
Low Cost ◽  
Aluminum Layer ◽  
Large Area ◽  
Coated Substrate ◽  
Roll To Roll ◽  
Flexible Polymer ◽  
Fine Pattern ◽  
Polymer Mold ◽  
Continuous Fabrication ◽  
Flexible Polymer Substrate

ABSTRACTWe investigated continuous fabrication of a large area 2-D metamaterial comprising a metal dot array on a dielectric coated substrate. We demonstrated patterning of metal dots arrays of varying patterns and shapes with diameter of about 2.5 μm and metal-to-metal spacing from 0.3 to 2.5 μm using a nano-imprinting stamp on a roller. The pattern was first fabricated on a standard photolithography mask, reproduced onto a silicon wafer master mold, and then transferred to a flexible polymer mold that was wrapped around a metal roller. The method was used to pattern a thin Al layer on top of SiO2 on a flexible polymer substrate. The aluminum was coated with a resist and the roller moved over the substrate with adjustable speed and pressure to imprint the fine pattern into the resist. The resist was cured, and a very thin layer of residual resist was removed by RIE, followed by a standard etching treatment for patterning the aluminum layer.The as-etched pattern had very few defects and the optical properties of the metamaterial were excellent and correlated well with simulations. This work has shown that low cost, rapid roll-to-roll processing of 2-D metamaterial structures is possible.

Realization of Mass Production of Microlens Array by Hot Embossing on Silicon Substrate

2010 ◽  
Vol 139-141 ◽  
pp. 1562-1565
Author(s):  
Xi Qiu Fan
Keyword(s):  
High Resolution ◽  
High Throughput ◽  
Silicon Substrate ◽  
Mass Production ◽  
Low Cost ◽  
Microlens Array ◽  
Hot Embossing ◽  
High Fidelity ◽  
Optical Performance ◽  
Large Area

Tradition lithographic techniques to produce micrlens array are complicated and time consuming. Due to the capability to replicate nanostructures repeatedly in a large area with high resolution and uniformity, hot embossing has been recognized as one of the promising approaches to fabricate microlens array with high throughput and low cost. This paper introduces processes to realize fabricating microlens array in mass production by direct hot embossing on silicon substrate. The mold is fabricated by multi-photolithography and etching steps and polymethyl methacrylate (PMMA) is chosen as the resist. Processes include coating, heating, pressing, etc. Fidelity and optical performance of the embossed microlens array were measured. High fidelity and fine optical performance of the embossed microlens array demonstrate the possibility of hot embossing to fabricate microlens array in mass production.

Design and Fabrication of a Multi-Scale Fluidic Motherboard for a Universal Molecular Processing System (uMPS)

2019 ◽  
Author(s):  
D. S. Park ◽  
M. Witek ◽  
X. Zhao ◽  
Y. Kang ◽  
K. Dathathreya ◽  
...  
Keyword(s):  
Low Cost ◽  
Processing System ◽  
Hot Embossing ◽  
High Fidelity ◽  
Average Standard Deviation ◽  
Fusion Bonding ◽  
Multi Scale ◽  
Convection Oven ◽  
Circulating Markers ◽  
Bottom Side

Abstract A multi-scale fluidic motherboard, which can be used in a universal molecular processing system (uMPS) integrated with task-specific processing modules, was designed and fabricated in thermoplastics. The motherboard consists of a coverplate and a substrate. The coverplate included fluidic interconnects and thermal grooves on the top side, and the corresponding interconnects on the bottom side. The substrate was comprised of cell lysis microchannels, micromixers, and flow-connecting microchannels on the top side, and reservoirs for sample inputs and waste output, thermal grooves, and valve seats for flow control on the bottom side. The coverplates and substrates were fabricated with double-sided hot embossing of polycarbonate (PC) using four micromilled brass molds, two for the coverplate and another two for the substrate. Evaluation of the relative front-to-backside alignment for the double-sided hot embossing yielded an accuracy of 25 μm ± 14 μm (average ± standard deviation) for the coverplates and 30 μm ± 20 μm for the substrates. Thermal fusion bonding (TFB) of the coverplate and substrate was done using a spring plunger bonding setup with a range of temperatures and pressures. The motherboard bonded at 154 °C and 12.0 psi for 2 hours in a convection oven produced complete bonding with a little deformation of the valve seats. The complete motherboard will be integrated with the task-specific processing modules in the uMPS for investigating circulating markers from whole blood for precision molecular diagnosis of disease at low cost and with high fidelity.

scholarly journals Flexible Metal/Polymer Composite Films Embedded with Silver Nanowires as a Stretchable and Conductive Strain Sensor for Human Motion Monitoring

Micromachines ◽  
2019 ◽  
Vol 10 (6) ◽  
pp. 372 ◽  
Author(s):  
Jinjin Luan ◽  
Qing Wang ◽  
Xu Zheng ◽  
Yao Li ◽  
Ning Wang
Keyword(s):  
Polymer Composite ◽  
Silver Nanowires ◽  
Composite Films ◽  
Strain Sensor ◽  
High Sensitivity ◽  
Human Motion ◽  
Applied Strain ◽  
Potential Candidate ◽  
Flexible Metal ◽  
Metal Polymer

To avoid conductive failure due to the cracks of the metal thin film under external loads for the wearable strain sensor, a stretchable metal/polymer composite film embedded with silver nanowires (AgNWs) was examined as a potential candidate. The combination of Ag film and AgNWs enabled the fabrication of a conductive film that was applied as a high sensitivity strain sensor, with gauge factors of 7.1 under the applied strain of 0–10% and 21.1 under the applied strain of 10–30%. Furthermore, the strain sensor was demonstrated to be highly reversible and remained stable after 1000 bending cycles. These results indicated that the AgNWs could act as elastic conductive bridges across cracks in the metal film to maintain high conductivity under tensile and bending loads. As such, the strain sensor engineered herein was successfully applied in the real-time detection and monitoring of large motions of joints and subtle motions of the mouth.

REPLICATION OF NANO/MICRO QUARTZ MOLD BY HOT EMBOSSING AND ITS APPLICATION TO BOROSILICATE GLASS EMBOSSING

2008 ◽  
Vol 22 (31n32) ◽  
pp. 6118-6123 ◽  
Author(s):  
SUNG-WON YOUN ◽  
CHIEKO OKUYAMA ◽  
MASHARU TAKAHASHI ◽  
RYUTARO MAEDA
Keyword(s):  
High Performance ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Hot Embossing ◽  
High Fidelity ◽  
Borosilicate Glasses ◽  
Mems Devices ◽  
Barrier Layers ◽  
Multiple Copies ◽  
Micro Electromechanical System

Glass hot-embossing is one of essential techniques for the development of high-performance optical, bio, and chemical micro electromechanical system (MEMS) devices. This method is convenient, does not require routine access to clean rooms and photolithographic equipment, and can be used to produce multiple copies of a quartz mold as well as a MEMS component. In this study, quartz molds were prepared by hot-embossing with the glassy carbon (GC) masters, and they were applied to the hot-emboss of borosilicate glasses. The GC masters were prepared by dicing and focused ion beam (FIB) milling techniques. Additionally, the surfaces of the embossed quartz molds were coated with molybdenum barrier layers before embossing borosilicate glasses. As a result, micro-hot-embossed structures could be developed in borosilicate glasses with high fidelity by hot embossing with quartz molds.

Manufacturing of 316L Stainless Steel Die Mold by Hot Embossing Process for Microfluidic Applications

2013 ◽  
Vol 1 (4) ◽  
Author(s):  
J. Zhang ◽  
J.-C. Gelin ◽  
M. Sahli ◽  
T. Barrière
Keyword(s):  
Stainless Steel ◽  
316L Stainless Steel ◽  
Low Cost ◽  
Hot Embossing ◽  
Solid Loading ◽  
Replication Process ◽  
Hard Materials ◽  
Small Complex ◽  
Replication Technique ◽  
Tolerance Control

Hot embossing process has emerged as a viable method for producing small, complex, precision parts in low volumes. It provides several advantages such as low-cost for molds, high replication accuracy for microfeatures and simple operation. The adaptation of this process for producing high fidelity hot embossed feedstock based metallic powders without the need for machining of the die mold is outlined. This was achieved through a combination of powder metallurgy and plastic hot embossing technologies to produce net-shape metal or hard materials components. In this paper, the manufacturing of molds that are suitable for the production of microfluidic systems using the replication technique is discussed. Variations of parameters in the replication process were investigated. An experimental rheological study was performed to evaluate the influence of the mixing parameters on the rheological behavior and thermal stability of 316L stainless steel feedstock. The effects of the solid loading on the feedstock rheological properties and tolerance control as well as mechanical properties and microstructures were investigated.

Sign in / Sign up

Export Citation Format

Share Document