Realization of Mass Production of Microlens Array by Hot Embossing on Silicon Substrate

2010 ◽  
Vol 139-141 ◽  
pp. 1562-1565
Author(s):  
Xi Qiu Fan
Keyword(s):  
High Resolution ◽  
High Throughput ◽  
Silicon Substrate ◽  
Mass Production ◽  
Low Cost ◽  
Microlens Array ◽  
Hot Embossing ◽  
High Fidelity ◽  
Optical Performance ◽  
Large Area

Tradition lithographic techniques to produce micrlens array are complicated and time consuming. Due to the capability to replicate nanostructures repeatedly in a large area with high resolution and uniformity, hot embossing has been recognized as one of the promising approaches to fabricate microlens array with high throughput and low cost. This paper introduces processes to realize fabricating microlens array in mass production by direct hot embossing on silicon substrate. The mold is fabricated by multi-photolithography and etching steps and polymethyl methacrylate (PMMA) is chosen as the resist. Processes include coating, heating, pressing, etc. Fidelity and optical performance of the embossed microlens array were measured. High fidelity and fine optical performance of the embossed microlens array demonstrate the possibility of hot embossing to fabricate microlens array in mass production.

Realization of Three-Dimensional Nanostructure Fabrication by Nanoimprint on Silicon Substrate

2011 ◽  
Vol 211-212 ◽  
pp. 1105-1109
Author(s):  
Xi Qiu Fan
Keyword(s):  
Silicon Substrate ◽  
Low Cost ◽  
Three Dimensional ◽  
Microlens Array ◽  
Optical Lithography ◽  
High Fidelity ◽  
Fabrication Method ◽  
Nanostructure Fabrication ◽  
Large Area ◽  
3D Nanostructures

Traditional optical lithography techniques to fabricate three-dimensional (3D) nanostructures are complicated and time consuming. Due to the capability to replicate nanostructures repeatedly in a large area with high resolution and uniformity, nanoimprint (NI) has been recognized as one of the promising approaches to fabricate 3-D nanostructures with high throughput and low cost. This paper introduces a novel 3-D nanostructure fabrication method by nanoimprint on silicon substrate. Nanoscale gratings and microlens array are taken as examples of 3-D nanostructures fabricated by nanoimprint. High fidelity demonstrates the possibility of nanoimprint to fabricate 3-D nanostructures on silicon substrate.

Lithography Process Challenges for 3D and 2.5D Applications

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 000398-000424
Author(s):  
Doug Shelton ◽  
Tomii Kume
Keyword(s):  
High Resolution ◽  
Process Optimization ◽  
Mass Production ◽  
Low Cost ◽  
High Density ◽  
Through Silicon Via ◽  
Key Technology ◽  
Lithography Process ◽  
Advanced Packaging

Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon will continue its discussion of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications.

Lithography Process Optimization for 3D and 2.5D Applications

2013 ◽  
Vol 2013 (1) ◽  
pp. 000790-000793 ◽  
Author(s):  
Doug Shelton ◽  
Tomii Kume
Keyword(s):  
High Resolution ◽  
Process Optimization ◽  
Preliminary Data ◽  
Mass Production ◽  
Low Cost ◽  
High Density ◽  
Through Silicon Via ◽  
Key Technology ◽  
Lithography Process ◽  
Advanced Packaging

Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon continues its investigation of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications also preliminary data illustrating 450 mm wafer process challenges.

Fabrication of a Flexible Metal/Polymer Mold With Liquid Crystal Polymer Material for Hot-Embossing Process

2010 ◽  
Author(s):  
Haijing Lu ◽  
Xiao Fang Ang ◽  
Hongping Liu ◽  
Zheng Sun ◽  
Jun Wei
Keyword(s):  
Smooth Surface ◽  
Low Cost ◽  
Hot Embossing ◽  
High Fidelity ◽  
Thermoplastic Polymer ◽  
Flexible Polymer ◽  
Crystal Polymer ◽  
Flexible Metal ◽  
Polymer Mold ◽  
Metal Polymer

A flexible polymer is considered as an alternative of low-cost mold materials. Molds with a high density aspect ratio, smooth surface, vertical sidewalls and lightweight have been fabricated and it is easy-to-use features in the hot embossing process. The study also indicated that the flexible metal/polymer mold could be used for thermoplastic polymer patterning with high fidelity and low cost. Using the flexible metal/polymer mold, 10um and 5um structures were fabricated.

Change Detection Within Pipeline ROWs: Environmental Change Analysis Using High Resolution Satellite Imagery

2015 ◽  
Author(s):  
Otto Huisman ◽  
Arash Gharibi
Keyword(s):  
Decision Making ◽  
High Resolution ◽  
Environmental Change ◽  
Satellite Imagery ◽  
Vegetation Index ◽  
Low Cost ◽  
Comparison Method ◽  
Large Area ◽  
Change Analysis ◽  
High Resolution Satellite Images

One of the major concerns for pipeline operators is to efficiently monitor the events happening over the pipeline corridor, or right-of-way (ROW). Monitoring of the ROW is an important part of ensuring the safe and efficient transportation of oil and gas. Events occurring within this zone require rapid assessment and, if necessary, mitigation. These events could be physical intrusions such as encroachment from growing settlements, impact of vegetation, pipeline leakage or geo-environmental hazards. Analysis of satellite imagery can provide an efficient and low cost solution to access and quantify change across the ROW. Examining these events over a periodic interval requires implementation of specific methods that can support the on-going monitoring and decision making practices. In this context, satellite remote sensing images can provide a low cost and efficient solution for monitoring the physical and environmental impacts over the ROW of pipeline system. This paper reports on the development of a methodological approach for environmental change analysis using high resolution satellite images that can help decision making in pipeline systems. Analysis results and maps produced during this work provide an insight into landcover change over the study area and expected to support in on-going pipeline management practices. Two methods, Vegetation index differencing and post classification comparison have been implemented to identify change areas in the Taranaki region of the North Island of New Zealand. Vegetation index differencing with NDVI shows increase or decrease of overall vegetation within the study area. Special focus was given on large area increase and decrease with area threshold value above 0.2 hectare. Detailed analysis of change was conducted with post classification comparison method that uses land cover classification results of year 2010 and 2013. An overall change of 10% has been observed throughout the study area with large area change of approximately 5%. Results obtained from post classification comparison method were further analyzed with 6 focus areas and compared with the existing soil data and rainfall data. The methods adopted during this study are expected to provide a base for environmental change analysis in similar pipeline corridors to support decision making.

Rectangular Microlens Array Having High Sag for Multi Chip LED Packaging

2006 ◽  
Vol 326-328 ◽  
pp. 1491-1494 ◽  
Author(s):  
Won Kyu Jeung ◽  
Chang Hyun Lim ◽  
Tae Hoon Kim ◽  
Seog Moon Choi
Keyword(s):  
Mass Production ◽  
Light Emitting Diode ◽  
Low Cost ◽  
Large Diameter ◽  
Optical Loss ◽  
Microlens Array ◽  
Wafer Level ◽  
Rectangular Shape ◽  
Replication Method ◽  
Optical Extraction

A novel rectangular shape microlens array having high sag for solid-state lighting is presented. The rectangular shape of proposed microlens can maximize the fill factor of silicon based light-emitting-diode (LED) packaging and minimize the optical loss through the reduction of unnecessary reflection at the same time. Microlens, which has high sag, over 3 75 μm and large diameter, over 3 mm can enormously enhance output optical extraction eff iciency. Moreover wafer level packaging technology is adopted to improve the aligning accu racy and mass production of LED packaging. This wafer level microlens array can be direc tly fabricated on LED packaging using replication method. It has many advantages in optica l properties, low cost, high aligning accuracy, and mass production.

Low cost fabrication of the large-area anti-reflection films from polymer by nanoimprint/hot-embossing technology

2008 ◽  
Vol 19 (20) ◽  
pp. 205301 ◽  
Author(s):  
Chia-Jen Ting ◽  
Meng-Chi Huang ◽  
Hung-Yin Tsai ◽  
Chang-Pin Chou ◽  
Chien-Chung Fu
Keyword(s):  
Low Cost ◽  
Hot Embossing ◽  
Large Area

scholarly journals Rolic® LCMO Photo Alignment Technology: Mechanism and Application to Large LCD Panels

2011 ◽  
Vol 181-182 ◽  
pp. 3-13 ◽  
Author(s):  
Mohammed Ibn-Elhaj ◽  
Sabrina Chappellet ◽  
Frédéric Lincker
Keyword(s):  
High Resolution ◽  
Mass Production ◽  
State Of The Art ◽  
Production Costs ◽  
Advanced Materials ◽  
Large Area ◽  
Wide Range ◽  
Fast Processing ◽  
Homeotropic Orientation ◽  
Photo Alignment

Rolic® Light Controlled Molecular Orientation (LCMO) technology is the basis for todays advanced mass production technologies for large LCD-TV panel, high-resolution 3D patterned-retarders and high-resolution optical security devices. This fundamental technology allows an easy achievement of high resolution azimuthal LC-director patterns with defined bias angles, from homogeneous planar to homeotropic orientation, depending on the target application [1-7]. In addition to the control of bias angles, LCD panel manufacturers require alignment layers with a wide range of optimized properties. Thin alignment films must be easily coatable and should have high photosensitivity in order to achieve fast processing. The photoalignment film should also have high stability and good electrical properties such as Voltage Holding Ratio (VHR), Residual DC (RDC) and image sticking. Because of in-situ photo crosslinking during processing [1, 2], our proprietary LCMO photoalignment technology is shown to be thermally and optically stable. Last years, enormous progress has been made in the development of advanced materials that meet all requirements for mass production of large-area flat panel displays. LCMO-VA technology, for vertical alignment LCDs, is the basis for the state of the art UV2A production technology recently used in the manufacturing of advanced new generation LCD-TV panel displays with reduced production costs and low energy consumption [8, 9]. LCMO-VA mechanism and performances of state of the art materials will be discussed.

Hologram Images Patterned in Shrink BOPP Film by Large-Area Roller Nanoimprint Lithography

2013 ◽  
Vol 873 ◽  
pp. 503-506 ◽  
Author(s):  
Meng Lin Jiang ◽  
Shi Wei Lin ◽  
Wen Kai Jiang
Keyword(s):  
Formation Mechanism ◽  
High Throughput ◽  
Nanoimprint Lithography ◽  
Low Cost ◽  
Nanometer Scale ◽  
Flexible Substrates ◽  
Large Area ◽  
Biaxially Oriented Polypropylene ◽  
Oriented Polypropylene ◽  
Lithography Technique

Thermal roller nanoimprint lithography with the ability of larger area micro-to nanometer-scale patterning on flexible substrates possesses the advantages of low cost and high throughput, and is widely being practiced in industry. Hologram images have been successfully embossed in shrink biaxially oriented polypropylene films by the large-area roller nanoimprint lithography technique. The defects which occur during embossing processes have been studied in order to identify the underlying formation mechanism.

scholarly journals Large-area metasurface on CMOS-compatible fabrication platform: driving flat optics from lab to fab

Nanophotonics ◽  
2020 ◽  
Vol 9 (10) ◽  
pp. 3071-3087 ◽  
Author(s):  
Nanxi Li ◽  
Zhengji Xu ◽  
Yuan Dong ◽  
Ting Hu ◽  
Qize Zhong ◽  
...  
Keyword(s):  
Mass Production ◽  
Low Cost ◽  
Complementary Metal Oxide Semiconductor ◽  
Critical Dimension ◽  
Optical Devices ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Large Area ◽  
Immersion Lithography ◽  
Manufacturing Technologies

AbstractA metasurface is a layer of subwavelength-scale nanostructures that can be used to design functional devices in ultrathin form. Various metasurface-based optical devices – coined as flat optics devices – have been realized with distinction performances in research laboratories using electron beam lithography. To make such devices mass producible at low cost, metasurfaces over a large area have also been defined with lithography steppers and scanners, which are commonly used in semiconductor foundries. This work reviews the metasurface process platforms and functional devices fabricated using complementary metal-oxide-semiconductor-compatible mass manufacturing technologies. Taking both fine critical dimension and mass production into account, the platforms developed at the Institute of Microelectronics (IME), A*STAR using advanced 12-inch immersion lithography have been presented with details, including process flow and demonstrated optical functionalities. These developed platforms aim to drive the flat optics from lab to fab.

Sign in / Sign up

Export Citation Format

Share Document