Micro-Electro-Mechanical Systems (MEMS) Micro-Heater

2012 ◽  
Author(s):  
C. N. Janakos ◽  
F. T. Goericke ◽  
A. P. Pisano
Keyword(s):  
Mechanical Systems ◽  
Testing Device ◽  
Mems Devices ◽  
Micro Electro Mechanical Systems ◽  
Mems Packaging ◽  
Rate Table ◽  
Heating Device ◽  
Localized Heating

This research addresses the problem of not having access to a localized heating device that easily integrates a variety of testing needs with MEMS packaging. This device can heat MEMS while simultaneously in vacuum, exposed to harsh gases and on a rate table. The solution is a micro-heater built directly into its packaging with the capability to test MEMS at vacuum, which can be pumped down to 1 Torr in a fraction of a second and heats the device to approximately 170 degrees Celsius to simulate the temperatures MEMS devices endure. This packaging integrated with a testing device can accommodate a broad range of MEMS devices.

scholarly journals Micro-electro-mechanical systems (MEMS): Technology for the 21st century

2014 ◽  
Vol 68 (5) ◽  
pp. 629-641 ◽  
Author(s):  
Tatjana Djakov ◽  
Ivanka Popovic ◽  
Ljubinka Rajakovic
Keyword(s):  
21St Century ◽  
Low Cost ◽  
Mechanical Systems ◽  
Modern Society ◽  
Global Scale ◽  
Thermal Constant ◽  
Mems Devices ◽  
Micro Electro Mechanical Systems ◽  
Industrial Sectors ◽  
Mems Technology

Micro-electro-mechanical systems (MEMS) are miniturized devices that can sense the environment, process and analyze information, and respond with a variety of mechanical and electrical actuators. MEMS consists of mechanical elements, sensors, actuators, electrical and electronics devices on a common silicon substrate. Micro-electro-mechanical systems are becoming a vital technology for modern society. Some of the advantages of MEMS devices are: very small size, very low power consumption, low cost, easy to integrate into systems or modify, small thermal constant, high resistance to vibration, shock and radiation, batch fabricated in large arrays, improved thermal expansion tolerance. MEMS technology is increasingly penetrating into our lives and improving quality of life, similar to what we experienced in the microelectronics revolution. Commercial opportunities for MEMS are rapidly growing in broad application areas, including biomedical, telecommunication, security, entertainment, aerospace, and more in both the consumer and industrial sectors on a global scale. As a breakthrough technology, MEMS is building synergy between previously unrelated fields such as biology and microelectronics. Many new MEMS and nanotechnology applications will emerge, expanding beyond that which is currently identified or known. MEMS are definitely technology for 21st century.

DYNAMICS OF ELECTROSTATICALLY ACTUATED MICRO-ELECTRO-MECHANICAL SYSTEMS: SINGLE DEVICE AND ARRAYS OF DEVICES

2009 ◽  
Vol 19 (03) ◽  
pp. 1007-1022 ◽  
Author(s):  
V. Y. TAFFOTI YOLONG ◽  
P. WOAFO
Keyword(s):  
Chaotic Behavior ◽  
Equilibrium Points ◽  
Dynamical Behavior ◽  
Mechanical Systems ◽  
Largest Lyapunov Exponent ◽  
Mems Devices ◽  
Micro Electro Mechanical Systems ◽  
Electrostatically Actuated ◽  
In Series ◽  
Electrostatic Coupling

The dynamical behavior of micro-electro-mechanical systems (MEMS) with electrostatic coupling is studied. A nonlinear modal analysis approach is applied to decompose the partial differential equation into a set of ordinary differential equations. The stability analysis of the equilibrium points is investigated. The amplitudes of the harmonic oscillatory states in the triple resonant states are obtained and discussed. Chaotic behavior is investigated using bifurcations diagram and the largest Lyapunov exponent. The dynamics of the MEMS with multiple functions in series is also investigated as well as the transitions boundaries for the complete synchronization state in a shift-invariant set of coupled MEMS devices.

Ceramic Via Wafer-Level Packaging for MEMS

2005 ◽  
Author(s):  
John M. Heck ◽  
Leonel R. Arana ◽  
Bill Read ◽  
Thomas S. Dory
Keyword(s):  
Mems Devices ◽  
Wafer Level ◽  
Micro Electro Mechanical Systems ◽  
Mems Switches ◽  
Mems Packaging ◽  
Wafer Level Packaging ◽  
Novel Approach ◽  
Electrical Interconnection ◽  
Tin Silver Copper ◽  
Board Level

We will present a novel approach to wafer level packaging for micro-electro-mechanical systems. Like most common MEMS packaging methods today, our approach utilizes a wafer bonding process between a cap wafer and a MEMS device wafer. However, unlike the common methods that use a silicon or glass cap wafer, our approach uses a ceramic wafer with built-in metal-filled vias, that has the same size and shape as a standard 150 mm silicon wafer. This ceramic via wafer packaging method is much less complex than existing methods, since it provides hermetic encapsulation and electrical interconnection of the MEMS devices, as well as a solderable interface on the outside of the package for board-level interconnection. We have demonstrated successful ceramic via wafer-level packaging of MEMS switches using eutectic gold-tin solder as well as tin-silver-copper solder combined with gold thermo-compression bonding. In this paper, we will present the ceramic via MEMS package architecture and discuss the associated bonding and assembly processes.

Errors in micro-electro-mechanical systems inertial measurement and a review on present practices of error modelling

2017 ◽  
Vol 40 (9) ◽  
pp. 2843-2854 ◽  
Author(s):  
Renu Bhardwaj ◽  
Neelesh Kumar ◽  
Vipan Kumar
Keyword(s):  
Inertial Sensors ◽  
Inertial Sensor ◽  
Mechanical Systems ◽  
Stochastic Modelling ◽  
Future Research ◽  
Mems Devices ◽  
Specific System ◽  
Micro Electro Mechanical Systems ◽  
Inertial Measurement ◽  
Calibration Methods

Micro-electro-mechanical systems (MEMS) technology-based accelerometers and gyroscopes are small size, mass produced, low cost inertial sensors, which are now being used in aerospace, underwater vehicles, automotive, robotics, mobiles, gaming consoles, prosthetic devices and many other applications. MEMS inertial sensors are available in many grades in market and selecting the appropriate grade sensor is very important. Owing to interaction of different types of energies, different noises are generated in MEMS devices; these noises cause significant change in output and the first section of this paper illustrates that. In application, where MEMS inertial sensors are used, the accuracy, repeatability and reproducibility of inertia measurement is probed primarily by complex testing, using extensive range of physical stimuli. Noises in inertial measurement are generally dealt by designing a unit measurement model. Noises are treated as additive error in linear unit model and are modelled using various techniques so that errors can be compensated to improve the accuracy. This paper reviews the theory, framework and methodology used in the error model of a MEMS inertial sensor and stochastic modelling of measurement. Experimental results from the most commonly used Allan variance techniques are discussed. Error modelling methodology, consisting of testing and calibration methods, designing thermal model, stochastic modelling and parameter estimation techniques, is illustrated. Figures and tables under each section summarize features, merits, limitation and future research scope. This paper should serve as a single reference for researchers and engineers working on application specific system design and instrumentation using MEMS inertial sensors. Conclusion from the study should help in selecting the appropriate grade of sensor as well as the best error modelling as per the trade-off existing between accuracy and development cost of error modelling.

scholarly journals Design and Analysis of the Elastic-Beam Delaying Mechanism in a Micro-Electro-Mechanical Systems Device

Micromachines ◽  
2018 ◽  
Vol 9 (11) ◽  
pp. 567 ◽  
Author(s):  
Fufu Wang ◽  
Lu Zhang ◽  
Long Li ◽  
Zhihong Qiao ◽  
Qian Cao
Keyword(s):  
Three Dimensional ◽  
Mechanical Systems ◽  
Elastic Beam ◽  
Element Model ◽  
Test Results ◽  
Mems Devices ◽  
Three Dimensional Model ◽  
Micro Electro Mechanical Systems ◽  
The Mathematical Model ◽  
Centrifugal Test

The delaying mechanism is an important part of micro-electro-mechanical systems (MEMS) devices. However, very few mechanical delaying mechanisms are available. In this paper, an elastic-beam delaying mechanism has been proposed innovatively through establishing a three-dimensional model of an elastic-beam delay mechanism, establishing the force and the parameters of an elastic-beam delay mechanism, deriving the mathematical model according to the rigid dynamic mechanics theory, establishing the finite element model by using Ls-dyna solver of the Ansys software, and carrying out the centrifugal test. Simulation and test results match theoretical results quite well. It is believed that the elastic-beam delaying mechanism is quite effective and useful to slow the speed of the movable part in MEMS devices.

Device and Reliability Physics of Capacitive MEMS

2007 ◽  
Author(s):  
Evgeni Gusev
Keyword(s):  
Initial Phase ◽  
Turning Point ◽  
Mechanical Systems ◽  
Mems Devices ◽  
Micro Electro Mechanical Systems ◽  
Fast Growing ◽  
Reliability Characteristics ◽  
Capacitive Mems

Micro-electro-mechanical systems (MEMS) and its younger “brother” nano-electro-mechanical systems (NEMS) are fast growing fields. In fact, in many areas, it is now at a turning point from the initial phase of device concept research and prototyping to volume manufacturing. To large extent, this transition is due to better general understanding of MEMS devices, materials and processes, major advances in packaging methods, and, as a result, significantly improved reliability characteristics up to billions of operation cycles.

scholarly journals Editorial for the Special Issue on MEMS Accelerometers

Micromachines ◽  
2019 ◽  
Vol 10 (5) ◽  
pp. 290
Author(s):  
Mahmoud Rasras ◽  
Ibrahim (Abe) M. Elfadel ◽  
Ha Duong Ngo
Keyword(s):  
Mechanical Systems ◽  
Mems Devices ◽  
Special Issue ◽  
Micro Electro Mechanical Systems ◽  
Sensing Applications ◽  
Mems Accelerometers ◽  
Ultrasound Sensing

Micro-Electro-Mechanical Systems (MEMS) devices are widely used for motion, pressure, light, and ultrasound sensing applications [...]

A capacitance and optical method for the static and dynamic characterization of micro electro mechanical systems (MEMS) devices

2006 ◽  
Vol 12 (10-11) ◽  
pp. 1053-1061 ◽  
Author(s):  
Eleonora Ferraris ◽  
Irene Fassi ◽  
Biagio De Masi ◽  
Richard Rosing ◽  
Andrew Richardson
Keyword(s):  
Optical Method ◽  
Mechanical Systems ◽  
Mems Devices ◽  
Dynamic Characterization ◽  
Micro Electro Mechanical Systems
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