Attributes of Advanced Thinning and Planarization Processes in 2.5D and 3D Packaging Recognized by Market Demands

Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales ◽

10.1115/ipack2015-48387 ◽

2015 ◽

Cited By ~ 1

Author(s):

Frank Wei

Keyword(s):

Fine Line ◽

Market Requirements ◽

3D Packaging

During the fabrications of 2.5D and 3D advanced packages, the needs for intermediate thinning and planarization processes persistently exit. This paper highlights the attributes of successful implementations, i.e., increased performances and yields for these processes, which have been identified by the market requirements for a variety of applications. Different packages with different materials systems and product goals lead to different requirements. This paper includes the thinning and polishing of TSV wafers in bonded wafer pairs for Si IC devicess or interposers, the thinning of overmolded, reconstituted wafers in eWLB applications, and the planarizations of metal bumps and RDL features in PoP, CSP, or fine line-and-space (L/S) substrate fabrications.

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"Fine Line: Mental Health/Mental Illness" Photo Exhibit Opens at SAMHSA

PsycEXTRA Dataset ◽

10.1037/e476592006-001 ◽

2005 ◽

Cited By ~ 1

Author(s):

Keyword(s):

Mental Health ◽

Mental Illness ◽

Fine Line

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A Fine Line Between Schizophrenia and Hashimoto Encephalopathy

10.26226/morressier.58a41cf9d462b8028d891b54 ◽

2017 ◽

Author(s):

Inês Amado

Keyword(s):

Fine Line ◽

Hashimoto Encephalopathy

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Magnetic Field Imaging on Stacked Flash Memories by Laser Probing and SQUID Scanning

ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2017p0495 ◽

2017 ◽

Author(s):

K. Sanchez ◽

G. Bascoul ◽

F. Infante ◽

N. Courjault ◽

T. Nakamura

Keyword(s):

Magnetic Field ◽

Failure Analysis ◽

Two Dimensions ◽

Analysis Tool ◽

Active Device ◽

Current Path ◽

3D Packaging ◽

Magnetic Field Imaging ◽

The Magnetic Field ◽

Field Imaging

Abstract Magnetic field imaging is a well-known technique which gives the possibility to study the internal activity of electronic components in a contactless and non-invasive way. Additional data processing can convert the magnetic field image into a current path and give the possibility to identify current flow anomalies in electronic devices. This technique can be applied at board level or device level and is particularly suitable for the failure analysis of complex packages (stacked device & 3D packaging). This approach can be combined with thermal imaging, X-ray observation and other failure analysis tool. This paper will present two different techniques which give the possibility to measure the magnetic field in two dimensions over an active device. Same device and same level of current is used for the two techniques to give the possibility to compare the performance.

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Microstructural Considerations on the Reliability of 3D Packaging

ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2012p0044 ◽

2012 ◽

Author(s):

Zhiheng Huang ◽

Zhiyong Wu ◽

Hua Xiong ◽

Yucheng Ma

Keyword(s):

Mechanical Behavior ◽

Grain Growth ◽

Spinodal Decomposition ◽

Elastic Energy ◽

Modeling Approach ◽

3D Packaging ◽

Ultrafine Interconnects

Abstract Microstructure and its effect on mechanical behavior of ultrafine interconnects have been studied in this paper using a modeling approach. The microstructure from the processes of solidification, spinodal decomposition, and grain growth in ultrafine interconnects has highlighted its importance. The size, geometry and composition of interconnects as well as the elastic energy can influence microstructure and thus the mechanical behavior. Quantification of microstructure in ultrafine interconnects is a necessary step to establish the linkage between microstructure and reliability.

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A Fine Line between Protection and Humanisation: The Interplay between the Scope of Application of International Humanitarian Law and Jurisdiction Over Alleged War Crimes Under International Criminal Law

SSRN Electronic Journal ◽

10.2139/ssrn.3207181 ◽

2018 ◽

Author(s):

Rogier Bartels

Keyword(s):

Criminal Law ◽

International Criminal ◽

War Crimes ◽

International Criminal Law ◽

International Humanitarian Law ◽

Humanitarian Law ◽

Fine Line ◽

Scope Of Application

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No Hard Feelings

10.1093/oso/9780190871536.003.0002 ◽

2018 ◽

Author(s):

Janet O'Shea

Keyword(s):

Martial Arts ◽

Fine Line ◽

The Rich

This chapter continues the examination of how martial arts differ from violence by delving into the symbolism attached to sport fighting. Here, this section investigates the significance of seemingly small gestures such as handshakes and fist bumps, treating them as play markers that separate the mat or the ring from the outside world. The rich symbolism of play markers run alongside an inversion of the meaning attached to strikes: in the outside world a punch devalues, whereas in sport fighting it signals respect for an opponent’s abilities. In this sense, sport fighting differentiates but also walks a fine line between the form and the function of violence. This consideration of significance in martial arts practice includes an investigation of martial arts and combat sport’s vexed relationship to real violence.

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