Thermal Metamaterials for Heat Flow Control in Electronics

Author(s):  
Ercan M. Dede ◽  
Feng Zhou ◽  
Paul Schmalenberg ◽  
Tsuyoshi Nomura

Rapid advancement of modern electronics has pushed the limits of traditional thermal management techniques. Novel approaches to the manipulation of the flow of heat in electronic systems have potential to open new design spaces. Here, the field of thermal metamaterials as it applies to electronics is briefly reviewed. Recent research and development of thermal meta-material systems with anisotropic thermal conductivity for the manipulation of heat flow in ultra-thin composites is explained. An explanation of fundamental experimental studies on heat flow control using standard printed circuit board technology follows. From this, basic building blocks for heat flux cloaking, focusing, and reversal are reviewed, and their extension to a variety of electronics applications is emphasized. While device temperature control, thermal energy harvesting, and electro-thermal circuit design are the primary focus, some discussion on the extension of thermal-guiding structures to device-scale applications is provided. In total, a holistic view is offered of the myriad of possible applications of thermal metamaterials to heat flow control in future electronics.

2018 ◽  
Vol 140 (1) ◽  
Author(s):  
Ercan M. Dede ◽  
Feng Zhou ◽  
Paul Schmalenberg ◽  
Tsuyoshi Nomura

Rapid advancement of modern electronics has pushed the limits of traditional thermal management techniques. Novel approaches to the manipulation of the flow of heat in electronic systems have potential to open new design spaces. Here, the field of thermal metamaterials as it applies to electronics is briefly reviewed. Recent research and development of thermal metamaterial systems with anisotropic thermal conductivity for the manipulation of heat flow in ultra-thin composites is explained. An explanation of fundamental experimental studies on heat flow control using standard printed circuit board (PCB) technology follows. From this, basic building blocks for heat flux cloaking, focusing, and reversal are reviewed, and their extension to a variety of electronics applications is emphasized. While device temperature control, thermal energy harvesting, and electrothermal circuit design are the primary focus, some discussion on the extension of thermal guiding (TG) structures to device-scale applications is provided. In total, a holistic view is offered of the myriad of possible applications of thermal metamaterials to heat flow control in future electronics.


2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.


Electronics ◽  
2021 ◽  
Vol 10 (5) ◽  
pp. 539
Author(s):  
Ryan P. Tortorich ◽  
William Morell ◽  
Elizabeth Reiner ◽  
William Bouillon ◽  
Jin-Woo Choi

Because modern electronic systems are likely to be exposed to high intensity radiated fields (HIRF) environments, there is growing interest in understanding how electronic systems are affected by such environments. Backdoor coupling in particular is an area of concern for all electronics, but there is limited understanding about the mechanisms behind backdoor coupling. In this work, we present a study on printed circuit board (PCB) backdoor coupling and the effects of via fencing. Existing work focuses on ideal stackups and indicates that edge radiation is significantly reduced by via fencing. In this study, both full wave electromagnetic modeling and experimental verification are used to investigate both ideal and practical PCB stackups. In the ideal scenario, we find that via fencing substantially reduces coupling, which is consistent with prior work on emissions. In the practical scenario, we incorporate component footprints and traces which naturally introduce openings in the top ground plane. Both simulation and experimental data indicate that via fencing in the practical scenario does not substantially mitigate coupling, suggesting that PCB edge coupling is not the dominant coupling mechanism, even at varying angles of incidence and polarization.


2006 ◽  
Vol 34 (7-8) ◽  
pp. 657-666 ◽  
Author(s):  
Chris Y. Yuan ◽  
Hong C. Zhang ◽  
Gregory McKenna ◽  
Carol Korzeniewski ◽  
Jianzhi Li

Author(s):  
Sh. A. Yusufov ◽  
A. M. Ibragimova ◽  
S. A. Peredkov ◽  
T. E. Sarkarov ◽  
R. G. Mitarov

Objectives. The article discusses a thermoelectric cooling system (TECS) for ensuring the thermal regime of modular electronic equipment (MEE) located in a cabinet. The main task of the experimental studies is to determine the temperature dependencies of the air-cooled heat-generating elements of a printed circuit board simulator according to TEСS parameters.Method. In order to conduct experimental studies of a thermoelectric cooling system for printed circuit boards in cassette units using a thermoelectric cooling system, a prototype designed and manufactured in the laboratory was studied on a testing stand.Result. The directions of constructive solutions for using a TECS device are presented along with a description of the testing stand and procedure. The dependencies of the temperature of the printed circuit board simulator on the heat power taken away by the TECS are considered along with the temperatures of hot and cold junctions, the air flow velocity and the distance between the electronic boards.Conclusion. The operability of the developed MEE cooling system is confirmed by the experimental studies; the specified cooling method has advantages over conventional forced or natural method and can achieve the temperatures required by the technical operating conditions; when choosing a fan to provide forced circulation of the air flow in the system, it is necessary to take into account the speed of the air flow in the channel; it is necessary to reserve the power of the power supply for the TECS operation in proportion to the power of the heat sources. An important additional point for the functioning of the thermoelectric cooling device is the necessity of ensuring the effective removal of heat from the hot junctions of the thermoelectric module without which it is impossible to use the proposed system. 


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