Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments

2019 ◽  
Author(s):  
Yuvraj Singh ◽  
Anirudh Udupa ◽  
Srinivasan Chandrasekar ◽  
Ganesh Subbarayan
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
Metal Cutting ◽  
High Strain ◽  
Lead Free ◽  
Strain Rates ◽  
Lead Free Solder ◽  
Orthogonal Metal Cutting ◽  
Free Solder

Abstract Studies on medium to high strain-rate characterization (≥ 0.1s−1) of lead-free solder are relatively few, primarily due to the lack of available methods for testing. Prior work in literature uses Split Hopkinson Bar (SPHB) experiments for high strain-rate characterization (≥ 300s−1) [1,2], while a modified micro-scale tester is used for medium strain-rate characterization (0.005s−1 to 300s−1) [3] and an impact hammer test setup for testing in a strain-rate regime from 1s−1 to 100s−1 [4]. However, there is still limited data in strain-rate regimes of relevance, specifically for drop shock applications. In this paper, we present orthogonal metal cutting as a novel method to characterize lead-free solder alloys. Experiments are carried out using a wedgelike tool that cuts through a work piece at a fixed depth and rake angle while maintaining a constant cutting velocity. These experiments are conducted at room temperature on Sn1.0Ag0.5Cu bulk test specimens with strain-rates varying from 0.32 to 48s−1. The range of strain-rates is only limited by the ball screw driven slide allowing higher strain-rates if needed. The strains and strain-rates are captured through Particle Image Velocimetry (PIV) using sequential images taken from a high-speed camera just ahead of the cutting tool. The PIV enables non-contact recording of high strain-rate deformations, while the dynamometer on the cutting head allows one to capture the forces exerted during the cutting process. Results for the stress-strain response obtained through the experiments are compared to prior work for validation. Orthogonal metal cutting is shown to be a potentially attractive method for characterization of solder at higher strain-rates.

Micro Impact Testing of Lead Free Solder Joints

2008 ◽  
Vol 32 ◽  
pp. 99-102
Author(s):  
Ranjan Rajoo ◽  
Erich H. Kisi ◽  
D.J. O'Connor
Keyword(s):  
Solder Joint ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Intermetallic Layer ◽  
Displacement Transducer ◽  
Impact Testing ◽  
Lead Free ◽  
Linear Variable Displacement Transducer ◽  
Free Solder

This paper presents data obtained from a newly-developed instrument to test the quality of solder interconnections at high strain rate – the ‘micro-impactor’. This shear test of the interconnection at high strain rate mimics the stress experienced by the solder joint when undergoing shock due to drop-impact. Instrumented with a load cell and linear variable displacement transducer (LVDT), it also has the ability to provide dynamic impact force and displacement data. Earlier concepts to characterise the solder joint at high strain rates such as the miniature pendulum impact tester [1] lacked this capability. This micro-impactor was used to study the effect of increasing silver (Ag) and copper (Cu) concentration in solder alloys on the shear strength of the solder joint. The performance of these lead-free alloys was also compared to that of the well-established leaded solder. It was found that increasing the silver content increases the yield strength of the solder, causing the failure to occur at the brittle intermetallic layer instead of in the bulk of the solder.

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

2019 ◽  
Author(s):  
Pradeep Lall ◽  
Vikas Yadav ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Thermal Aging ◽  
High Strain ◽  
Lead Free ◽  
Uniaxial Tensile ◽  
Strain Rates ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
High Strain Rates ◽  
Free Solder ◽  
Sac Solder

Abstract Electronic components in downhole oil drilling and gas industry applications, automotive and avionics may exposed to high temperatures (> 150°C) and high strain rates (1–100 per sec) during storage, operation and handling which can contribute to the failures of electronics devices. Temperatures in these applications can exceed 200°C, which is closed to melting point for SAC alloys. The microstructure for lead free solder alloys constantly evolves when subjected to thermal aging for sustained periods with accompanying degradation in mechanical properties of solder alloys. In this paper, evolution of microstructure and Anand parameters for unaged and aged SAC (SAC105 and SAC-Q) lead free solder alloys at high strain rates has been investigated induced due to thermal aging. The microstructure of the SAC solder is studied using scanning electron microscopy (SEM) for different strain rate and elevating temperature. The thermal aged leadfree SAC solder alloys specimen has been tested at high strain rates (10–75 per sec) at elevated temperatures of (25°C–200°C). The SAC leadfree solder samples were subjected to isothermal aging at 50°C up to 1-year before testing. To describe the material constitutive behavior, Anand Viscoplastic model has been used. Effect of thermal aging on Anand parameters has been investigated. In order to verify the accuracy of the model, the computed Anand parameters have been used to simulate the uniaxial tensile test. FEA based method has been used to simulate the drop events using Anand constitutive model. Hysteresis loop and Plastic work density has been computed from FEA.

Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot

2013 ◽  
Author(s):  
Pradeep Lall ◽  
Geeta Limaye ◽  
Sandeep Shantaram ◽  
Jeff Suhling
Keyword(s):  
Elevated Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
Material Properties ◽  
Isothermal Aging ◽  
High Strain ◽  
Image Correlation ◽  
Lead Free ◽  
Strain Rates ◽  
Full Field

Industry migration to lead-free solders has resulted in a proliferation of a wide variety of solder alloy compositions. The most popular amongst these are the Tin-Silver-Copper (Sn-Ag-Cu or SAC) family of alloys like SAC105, SAC305 etc. Recent studies have highlighted the detrimental effects of isothermal aging on the material properties of these alloys. SAC alloys have shown up to 50% reduction in their initial elastic modulus and ultimate tensile strength within a few months of elevated temperature aging. This phenomenon has posed a severe design challenge across the industry and remains a road-block in the migration to Pb-free. Multiple compositions with additives to SAC have been proposed to minimize the effect of aging and creep while maintaining the melting temperatures, strength and cost at par with SAC. Innolot is a newly developed high-temperature, high-performance lead-free substitute by InnoRel™ targeting the automotive electronics segment. Innolot contains Nickel (Ni), Antimony (Sb) and Bismuth (Bi) in small proportions in addition to Sn, Ag and Cu. The alloy has demonstrated enhanced reliability under thermal cycling as compared to SAC alloys. In this paper, the high strain rate material properties of Innolot have been evaluated as the alloy ages at an elevated temperature of 50°C. The strain rates chosen are in the range of 1–100 per-second which are typical at second level interconnects subjected to drop-shock environments. The strain rates and elevated aging temperature have been chosen also to correspond to prior tests conducted on SAC105 and SAC305 alloys at this research center. This paper presents a comparison of material properties and their degradation in the three alloys — SAC105, SAC305 and Innolot. Full field strain measurements have been accomplished with the use of high speed imaging in conjunction with Digital Image Correlation (DIC). Ramberg-Osgood non-linear model parameters have been determined to curve-fit through the experimental data. The parameters have been implemented in Abaqus FE model to obtain full-field stresses which correlates with contours obtained experimentally by DIC.

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

2015 ◽  
Author(s):  
Pradeep Lall ◽  
Vikas Yadav ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Mechanical Properties ◽  
Elevated Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Lead Free ◽  
Electronic Systems ◽  
Strain Rates ◽  
High Strain Rates ◽  
Solder Interconnects

Electronics products may often be exposed to high temperature during storage, operation and handling in addition to high strain rate transient dynamic loads during drop-impact. Electronics subjected to drop-impact, shock and vibration may experience strain rates of 1–100 per sec. There are no material properties available in published literature at high strain rate at elevated temperature. High temperature and vibrations can contribute to the failures of electronic system. The reliability of electronic products can be improved through a thorough understanding of the weakest link in the electronic systems which is the solder interconnects. The solder interconnects accrue damage much faster when subjected to Shock and vibration at elevated temperatures. There is lack of fundamental understanding of reliability of electronic systems subjected to thermal loads. Previous studies have showed the effect of high strain rates and thermal aging on the mechanical properties of leadfree alloys including elastic modulus and the ultimate tensile strength. Extended period of thermal aging has been shown to affect the mechanical properties of lead free alloys including elastic modulus and the ultimate tensile strength at low strain rates representative of thermal fatigue [Lee 2012, Motalab 2012]. Previously, the microstructure, mechanical response and failure behavior of leadfree solder alloys when subjected to elevated isothermal aging and/or thermal cycling [Darveaux 2005, Ding 2007, Pang 2004] have been measured. Pang [1998] has showed that young’s modulus and yield stress of Sn-Pb are highly depending on strain rate and temperature. The ANAND viscoplastic constitutive model has been widely used to describe the inelastic deformation behavior of solders in electronic components. Previously, Mechanical properties of lead-free alloys, at different high strain rates (10, 35, 50, 75 /sec) and elevated temperature (25 C-125 C) for pristine samples have been studied [Lall 2012 and Lall 2014]. Previous researchers [Suh 2007 and Jenq 2009] have determined the mechanical properties of SAC105 at very high strain rate (Above 1000 per sec) using compression testing. But there is no data available in published literature at high strain rate and at elevated temperature for aged conditions. In this study, mechanical properties of lead free SAC105 has been determined for high strain rate at elevated temperature for aged samples. Effect of aging on mechanical properties of SAC105 alloy a high strain rates has been studied. Stress-Strain curves have been plotted over a wide range of strain rates and temperatures for aged specimen. Experimental data for the aged specimen has been fit to the ANAND’s viscoplastic model. SAC105 leadfree alloys have been tested at strain rates of 10, 35, 50 and 75 per sec at various operating temperatures of 50°C, 75°C, 100°C and 125°C. The test samples were exposed to isothermal aging conditions at 50°C for different aging time (30, 60, and 120 Days) before testing. Full-field strain in the specimen have been measured using high speed imaging at frame rates up to 75,000 fps in combination with digital image correlation. The cross-head velocity has been measured prior-to, during, and after deformation to ensure the constancy of cross-head velocity.

Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys

2020 ◽  
Vol 143 (2) ◽  
Author(s):  
Pradeep Lall ◽  
Vikas Yadav ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Constitutive Model ◽  
Thermal Aging ◽  
High Strain ◽  
Lead Free ◽  
Constitutive Behavior ◽  
Strain Rates ◽  
Lead Free Solder ◽  
High Strain Rates ◽  
Shock Event ◽  
Free Solder

Abstract Electronic components in downhole oil drilling and gas industry applications, automotive, and avionics may be exposed to high temperatures (>150 °C) and high strain rates (1–100 per sec) during storage, operation, and handling, which can contribute to the failures of electronic devices. Temperatures in these applications can exceed 200 °C, which is close to melting point for SnAgCu (SAC) alloys. Prior studies at low strain rates have shown property evolution even under moderate exposure to high temperature. In this paper, the evolution of Anand parameters for unaged and aged SAC (SAC105 and SAC-Q) lead-free solder alloys at high strain rates has been investigated induced under sustained periods of thermal aging. The thermal aged lead-free SAC solder alloys specimen has been tested at high strain rates (10–75 per sec) at elevated temperatures of (25 °C–200 °C). The SAC lead-free solder samples were subjected to isothermal aging at 50 °C up to 1-year before testing. To describe the material constitutive behavior, the Anand Viscoplastic model has been used. The effect of thermal aging on Anand parameters also has been investigated. In order to verify the accuracy of the model, the computed Anand parameters have been used to simulate the uni-axial tensile test. The material constitutive behavior has been implemented in a finite element framework to simulate the drop events using the Anand constitutive model and determine the plastic work per shock event. The plastic work per shock event is a measure of the damage progression in the solder interconnects. The constitutive model has been used to simulate the shock event of a ball-grid array package on printed circuit board assembly.

scholarly journals Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations

2011 ◽  
Vol 133 (4) ◽  
Author(s):  
Etienne L. Bonnaud
Keyword(s):  
Material Behavior ◽  
Drop Test ◽  
Lead Free ◽  
Strain Rates ◽  
Electronic Packages ◽  
Lead Free Solder ◽  
Mixed Hardening ◽  
Drop Tests ◽  
Free Solder

Reliable drop test simulations of electronic packages require reliable material characterization of solder joints. Mechanical properties of lead-free solder were here experimentally investigated for both monotonic and cyclic loading at different strain rates. With regards to the observed complex material behavior, the nonlinear mixed hardening Armstrong and Frederick model combined with the Perzyna viscoplastic law was chosen to fit the experimental data. This model was subsequently implemented into a commercial finite element code and used to simulate drop tests. Actual drop test experiments were conducted in parallel and experimental results were compared to simulations. Prediction discrepancies were analyzed and explanations suggested.

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