Low-resistivity atomic-layer-deposited-TaN with atomic-layer-deposited-TaN/physical-vapor-deposited-Ta multilayer structure for multilevel Cu damascene interconnect
2006 ◽
Vol 24
(1)
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pp. 103-105
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2019 ◽
Vol 45
(6)
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pp. 7407-7412
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2018 ◽
Vol 18
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pp. 8333-8336
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2006 ◽
Vol 45
(4B)
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pp. 2975-2979
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2017 ◽
Vol 29
(15)
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pp. 6502-6510
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2006 ◽
Vol 9
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pp. C54
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2018 ◽
Vol 36
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pp. 051505
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2013 ◽
Vol 31
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pp. 01A139
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