Improving the quality of barrier/seed interface by optimizing physical vapor deposition of Cu Film in hollow cathode magnetron
2011 ◽
Vol 29
(4)
◽
pp. 041514
◽
Ionized physical-vapor deposition using a hollow-cathode magnetron source for advanced metallization
2000 ◽
Vol 18
(4)
◽
pp. 1546-1549
◽
2010 ◽
Vol 81
(12)
◽
pp. 123502
◽
2006 ◽
Vol 24
(5)
◽
pp. 1955-1969
◽
1976 ◽
Vol 13
(1)
◽
pp. 520-524
◽
Keyword(s):
2012 ◽
Vol 602-604
◽
pp. 1652-1658
Keyword(s):
1974 ◽
Vol 13
(S1)
◽
pp. 415
◽
Keyword(s):
Keyword(s):
Keyword(s):