Characterization and removal of ion yield transients in the near surface region of secondary ion mass spectrometry depth profiles

1987 ◽  
Vol 5 (1) ◽  
pp. 9-14 ◽  
Author(s):  
S. R. Bryan ◽  
R. W. Linton ◽  
D. P. Griffis
Keyword(s):  
Mass Spectrometry ◽  
Secondary Ion Mass Spectrometry ◽  
Surface Region ◽  
Near Surface ◽  
Depth Profiles ◽  
Ion Mass Spectrometry ◽  
Secondary Ion

Effects of Cryogenic Sample Analysis on Molecular Depth Profiles with TOF-Secondary Ion Mass Spectrometry

2010 ◽  
Vol 82 (19) ◽  
pp. 8291-8299 ◽  
Author(s):  
Alan M. Piwowar ◽  
John S. Fletcher ◽  
Jeanette Kordys ◽  
Nicholas P. Lockyer ◽  
Nicholas Winograd ◽  
...  
Keyword(s):  
Mass Spectrometry ◽  
Secondary Ion Mass Spectrometry ◽  
Sample Analysis ◽  
Depth Profiles ◽  
Ion Mass Spectrometry ◽  
Secondary Ion

Quantitation of Secondary Ion Mass Spectrometry (SIMS) for HgCdTe.

1983 ◽  
Vol 25 ◽  
Author(s):  
Lawrence E. Lapides ◽  
George L. Whiteman ◽  
Robert G. Wilson
Keyword(s):  
Mass Spectrometry ◽  
Ion Implantation ◽  
Ionization Potential ◽  
Electron Affinity ◽  
Secondary Ion Mass Spectrometry ◽  
Relative Sensitivity ◽  
Depth Profiles ◽  
Ion Mass Spectrometry ◽  
Sensitivity Factors ◽  
Secondary Ion

ABSTRACTQuantitative depth profiles of impurities in LPE layers of HgCdTe have been determined using relative sensitivity factors calculated from ion implantation profiles. Standards were provided for Li, Be, B, C, F, Na, Mg, Al, Si, P, S, Cl, Cu, Ga, As, Br, and In. Relative sensitivity factors as a function of ionization potential for O2+ primary ion SIMS and electron affinity for Cs+ primary ion SIMS have been calculated in order to extend quantitation to elements not yet implanted. Examples of depth profiles for implant standards and unimplanted layers are given.

Time-Resolved and Post-Irradiation Studies of the Interaction of High-Power Pulsed Microwave Radiation with Silicon

1986 ◽  
Vol 74 ◽  
Author(s):  
R. B. James ◽  
P. R. Bolton ◽  
R. A. Alvarez ◽  
R. E. Valiga ◽  
W. H. Christie
Keyword(s):  
Mass Spectrometry ◽  
Secondary Ion Mass Spectrometry ◽  
Surface Region ◽  
Surface Damage ◽  
Threshold Value ◽  
Optical Measurements ◽  
Time Resolved ◽  
Near Surface ◽  
Reflected Power ◽  
Secondary Ion

AbstractWe have measured the microwave-induced damage to the near-surface region of silicon for 1.9-μs pulses at a frequency of 2.856 GHz and a pulse power of up to 7.2 MW. Rectangular samples were irradiated in a test section of WR-284 waveguide that was filled with freon to a pressure of 30 psig. Incident, transmitted and reflected powers were monitored with directional couplers and fast diodes. The results of the time-resolved optical measurements show that the onset of surface damage is accompanied by a large increase in the reflected power. Examination of the irradiated surfaces shows that the degree of damage is greatest near the edges of the samples. Using secondary ion mass spectrometry to profile the implanted As, we find that the microwave pulses can melt the near-surface region of the material for pulse powers exceeding a threshold value.

Backside Sims Study Of Ge/Pd Non-Alloyed Ohmic Contacts On InGaAs

1994 ◽  
Vol 354 ◽  
Author(s):  
S.A. Schwarz ◽  
C.J. Pahnstrom ◽  
R. Bhat ◽  
M. Koza ◽  
L.C. Wang ◽  
...  
Keyword(s):  
Mass Spectrometry ◽  
Ohmic Contact ◽  
Ohmic Contacts ◽  
Secondary Ion Mass Spectrometry ◽  
Layer Structure ◽  
Depth Profiling ◽  
Surface Region ◽  
Marker Layer ◽  
Ion Mass Spectrometry ◽  
Secondary Ion

AbstractBackside secondary ion mass spectrometry (SIMS) is employed to examine the Ge/Pd non-alloyed ohmic contact on InGaAs. 130 nm Ge/ 50 nm Pd contacts were deposited on an InP/InGaAs marker layer structure. The contacts were annealed for various times at 200°C and 325°C. Samples were mechanically and chemically thinned to facilitate sputter profiling from the backside, thereby avoiding problems such as roughening or non-uniformity of the metallic layers. Subsequent to depth profiling, additional anneals were performed on the thinned samples, and the samples were reexamined. Extensive reaction of Pd with InGaAs is observed on deposition. Little additional reaction occurs at 200°C. At 325°C, Pd is reclaimed from the reacted surface region, forming PdGe with some excess Ge at the interface. In-diffiision of Pd and Ge into InGaAs is observed at longer annealing times. The results are contrasted with prior studies on GaAs, InP, and InGaAs.

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