Silicon films on insulator formation using lateral solid-phase epitaxy induced by focused ion beam

Author(s):  
Seigo Kanemaru
1996 ◽  
Vol 438 ◽  
Author(s):  
R. G. Elliman ◽  
H. Jiang ◽  
W. C. Wong ◽  
P. Kringhøj

AbstractGexSi1-x, strained layers can be fabricated by Ge implantation and solid-phase epitaxy and can be used in electronic devices to improve their performance. Several important materials science issues are addressed, including the effect of the strain on solid-phase-epitaxy, the effect of oxidation on the implanted Ge distribution, and the effect of Ge on the oxidation rate of Si. The potential of this process is demonstrated by comparing the performance of metal-oxidesemiconductor field-effect-transistors (MOSFETs) employing ion-beam synthesised GeSi strained layer channel regions with that of Si-only devices.


1999 ◽  
Vol 587 ◽  
Author(s):  
Fabian Radulescu ◽  
John M. McCarthy

AbstractThe residual stress and the microstructure associated with it were studied in connection with the Pd-Ge ohmic contact formation on GaAs. Evaporated Pd (20 nm) / Ge (150 nm) / Pd (50 nm) thin film stacks on GaAs were annealed at various temperatures and the resulting microstructures were investigated by transmission electron microscopy (TEM). Micro-cantilever beam structures were fabricated with a focused ion beam (FIB) workstation and the residual stress present was calculated from the deflection magnitude. It was found that Ge solid phase epitaxial (SPE) growth on GaAs is associated with a stress relaxation of the thin film system. A new model that suggests the tensile stress induced by the intermediate layer may play an important role in the SPE growth mechanism is proposed. Other cases of solid phase heteroepitaxial growth with an intermediate medium, such as Ge/Au/Si, Co/Ti/Si (the TIME method) and Co/SiOx/Si (the OME method) are discussed in light of this newly proposed model. Also, the possibility of using controlled stress to engineer new methods for growing SPE based heterostructures will be presented.


1984 ◽  
Vol 45 (8) ◽  
pp. 874-876 ◽  
Author(s):  
M. Milosavljević ◽  
C. Jeynes ◽  
I. H. Wilson

1999 ◽  
Vol 587 ◽  
Author(s):  
Rosaria A. Puglisi ◽  
Hiroshi Tanabe ◽  
Claudine M. Chen ◽  
Harry A. Atwater ◽  
Emanuele Rimini

AbstractWe investigated the formation of large-grain polycrystalline silicon films on glass substrates for application in low-cost thin film crystalline silicon solar cells. Since use of glass substrates constrains process temperatures, our approach to form large-grain polycrystalline silicon templates is selective nucleation and solid phase epitaxy (SNSPE). In this process, selective crystallization of an initially amorphous silicon film, at lithographically predetermined sites, enables grain sizes larger than those observed via random crystallization. Selective heterogeneous nucleation centers were created on undoped, 75 nm thick, amorphous silicon films, by masked implantation of Ni islands, followed by annealing at temperatures below 600 °. At this temperature, the Ni precipitates into NiSi2 particles that catalyze the transition from the amorphous to the crystalline Si phase. Seeded crystallization begins at the metal islands and continues via lateral solid phase epitaxy (SPE), thus obtaining crystallized regions of several tens of square microns in one hour. We have studied the dependence of the crystallization rate on the Ni-implanted dose in the seed, in the 5×1015/cm3 - 1016/cm3range. The large grained polycrystalline Si films were then used as a substrate for molecular beam epitaxy (MBE) depositions of 1 [.proportional]m thick Si layers. Transmission electron microscopy (TEM) analysis showed a strong correlation between the substrate morphology and the deposited layer. The layer presented a large grain morphology, with sizes of about 4 [.proportional]m.


1997 ◽  
Vol 141 (1-4) ◽  
pp. 83-83
Author(s):  
F. Fortuna ◽  
H. Bernas ◽  
P. Nedellec ◽  
M.-O. Ruault

1992 ◽  
Vol 215 (1) ◽  
pp. 76-83 ◽  
Author(s):  
K. Radermacher ◽  
S. Mantl ◽  
Ch. Dieker ◽  
H. Lüth ◽  
C. Freiburg

1987 ◽  
Vol 134 (10) ◽  
pp. 2536-2540 ◽  
Author(s):  
Miltiadis K. Hatalis ◽  
David W. Greve

1993 ◽  
Vol 301 ◽  
Author(s):  
J. S. Custer ◽  
A. Polman ◽  
E. Snoeks ◽  
G. N. van den Hoven

ABSTRACTSolid phase epitaxy and ion-beam-induced epitaxial crystallization of Er-doped amorphous Si are used to incorporate high concentrations of Er in crystal Si. During solid phase epitaxy, substantial segregation and trapping of Er is observed, with maximum Er concentrations trapped in single crystal Si of up to 2 × 1020 /cm3. Ion-beam-induced regrowth results in very little segregation, with Er concentrations of more than 5 × 1020 /cm3 achievable. Photoluminescence from the incorporated Er is observed.


1999 ◽  
Vol 564 ◽  
Author(s):  
Xin-Ping Qu ◽  
Guo-Ping Ru ◽  
Bing-Zong Li ◽  
C. Detavernier ◽  
R L. Van Meirhaeghe ◽  
...  

AbstractUltra-thin epitaxial CoSi2 films formed by Co(3∼5nm)/Ti(1 nm)/Si(100) and Co(3∼5nm)/Si(lnm)/Ti(Inm)/Si are studied. The multilayers are deposited by ion-beam sputtering. Rapid thermal annealing (RTA) is used for silicidation. XRD, RBS, TEM, AFM, four-point probe, I-V and C-V measurements are carried out for characterization. The XRD spectra show the CoSi2 film formed by Co/Ti/Si or Co/Si/Ti/Si solid phase epitaxy has, epitaxial characteristic. XTEM shows that the film is continuous. RBS/Channeling shows that the formed CoSi2 has sharp interface with a minimum channeling yield of Co signal of 40%. AFM shows that the surface of ultra-thin CoSi2 film is smooth with a roughness of nearly 0.7 nm. The Rs∼T relationship shows that the CoSi2 films formed by Co/Si/Ti/Si reaction have the best thermal stability (stable up to 900°C). Those formed by Co/Ti/Si reaction are stable up to 850°C, while those formed by Co/Si reaction are only stable up to 750°C. By fitting the experimental I-V and C-V curves of the epitaxial CoSi2/Si Schottky diodes, barrier heights of around 0.6 eV and close to unity ideality factors are obtained.


Sign in / Sign up

Export Citation Format

Share Document